Hot Spot Elimination by Thin and Smart Heat Spreader

2015 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Masataka Mochizuki ◽  
Koichi Mashiko
Keyword(s):  
Heat Pipe ◽  
Hot Spot ◽  
Electronic Devices ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Metal Plate ◽  
Confined Space ◽  
Heat Spreader ◽  
Clock Speed ◽  
Wick Structure

Heat pipes are recognized as an excellent heat transport devices and extensively investigated for applications in electronic cooling. Different types of heat pipes have been developed such as micro/miniature heat pipes, loop heat pipes and so on, and these heat pipes have been widely applied in the field of electronics cooling such as notebook, desktop, data center; as well as aerospace, industrial cooling field. However, in recent years the application of heat pipe is widening to the filed of hand held mobile electronic devices such as smart phone, tablet pc, digital camera etc. With the development in technology these devices have different user friendly functions and capabilities, which requires the highest processor clock speed. In general, high clock speed of processor generates lot of heat which need to be spread or removed to eliminate the hot spot. It becomes a challenging task to cool such electronic devices as mentioned above with a very confined space and concentrated heat sources. Regarding to this challenge, ultra thin flat heat pipe is developed; this newly developed heat pipe consists of a special fiber wick structure which can ensure vapor spaces on the two sides of the wick structure. In this paper a novel thin spreader is proposed to eliminate the hot spot; generally the proposed heat spreader consists of 0.20mm thick metal plate and ultra thin heat pipe of 0.40mm thickness soldered in its body. Maximum thickness of this spreader is 0.63mm. Metal plate is 60mm × 110mm in size; and the ultra thin heat pipe can be fabricated from different original diameter ranges from 2.0mm to 3.0mm Cu tube. Theoretical and experimental analysis have been done to evaluate this thin spreader. In addition, some real application of this spreader will be introduced in this paper.

Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures

2009 ◽  
Author(s):  
Pramod Chamarthy ◽  
H. Peter J. de Bock ◽  
Boris Russ ◽  
Shakti Chauhan ◽  
Brian Rush ◽  
...  
Keyword(s):  
Heat Pipe ◽  
High Performance ◽  
Gravitational Force ◽  
Driving Forces ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
High Permeability ◽  
Permeability Characteristics ◽  
Wick Structure ◽  
Initial Results

Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick’s capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.

Investigation of Heat Transfer Enhancement Effect on Normal and Nano Coated Wick Structure Heat Pipes-A Comparative Assessment

2020 ◽  
Vol 51 ◽  
pp. 191-198
Author(s):  
N. Manikanda Prabu ◽  
S. Nallusamy ◽  
G. Sureshkannan
Keyword(s):  
Heat Transfer ◽  
Electronic Devices ◽  
Research Work ◽  
Heat Pipes ◽  
Enhancement Effect ◽  
Heat Transfer Capacity ◽  
Wick Structure ◽  
Improve Heat Transfer ◽  
Super Conducting ◽  
The Stability

Removal of heat generation is an important characteristic needs to be considered in electromechanical and electronic devices which improve the stability and feasibility of system. Despite numerous cooling methods, heat pipes are recent updating in research line. Heat pipes are one of the super conducting medium of heat energy and it is being used as an equipment to absorb more heat through phase change process of cooling medium circulated in it. It ensures the direct enhancement in heat transfer capacity and characteristics. Nowadays, improvement of the thermal performance in heat pipes getting up with various technologies, especially combination of heat pipe and Nano fluids. It has been experimentally practiced and various results are observed by previous researches that wick structure also a part of reason in improvement. The aim of this research work is to analyze the influence of wick material to improve heat transfer characteristics in heat pipes. In addition, combination of nano coated wick material with heat pipes is comparatively analyzed. From the final observed results it was found that, the best combination of wick material is supporting the better cooling requirements in electronic devices.

A Novel Thermo-Hydraulic Test Platform for Micropillared Array Thermal Wick Optimization

2012 ◽  
Author(s):  
Collier Miers ◽  
Geoff Wehmeyer ◽  
Carlos H. Hidrovo
Keyword(s):  
Analytical Model ◽  
Capillary Flow ◽  
Electronic Devices ◽  
Heat Removal ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Capillary Forces ◽  
Limiting Factor ◽  
Hydraulic Test ◽  
Capillary Limit

Heat pipes have immense potential in the future of thermal management in electronic devices. As a passive device, they rely solely upon capillary forces to recirculate the coolant from the condenser to the evaporator via a wicking structure. In intermediate temperature heat pipes the limiting factor for heat removal is the capillary limit, which indicates the maximum recirculation rate that the capillary forces can induce. This capillary limit must be increased to allow heat pipes to remain a viable option for heat management within electronic devices. The aim of this work is to characterize and optimize the capillary limit of micropillared thermal wicks for heat pipe application in micro-electronics cooling. Towards this goal, an analytical model, and a novel thermo-hydraulic experimental setup was developed. The analytical model of the micropillared array wicking structure provides a theoretical basis from which the pillar geometry and arrangement can be optimized. A capillary limit model was used to determine the geometric relationship between the pillar arrays and the maximum capillary flow rate through the wick. This model considers the effects of gravity and mass transfer due to evaporation. Finally, the thermo-hydraulic characterization setup, designed to minimize environmental losses, was used to experimentally determine the capillary limits of different silicon based micropillared wick samples. The heater and wicking structure were enclosed in a temperature and humidity controlled vacuum chamber. The results obtained from this setup were used to validate the analytical model shown in this paper.

scholarly journals Experimental and Numerical Analysis of Composite Wick Heat Pipes using Ethanol

2020 ◽  
Vol 9 (3) ◽  
pp. 2360-2363
Keyword(s):  
Heat Pipe ◽  
Heat Load ◽  
Information Sources ◽  
Heat Pipes ◽  
Wide Scope ◽  
Computational Investigation ◽  
Water Stream ◽  
Sintered Copper ◽  
Wick Structure ◽  
Working Liquid

Warmth pipes come convenient now-a-days as they work with most noteworthy warmth conductance contrasted with some other method of warmth move and accessible over wide scope parameters. In the present investigation de-ionized water stream in plain thermo siphon, Sintered Copper wick and Helical scored heat pipes with synchronous vanishing, adiabatic and buildup wonder are contemplated utilizing Heat pipe test gear. In this hardware warmth pipe exposed to foreordain heat load an obstruction radiator at its evaporator end water coat with controlled progression water is utilized disperse warmth vitality at condenser end. Every one temperatures are estimated necessary computations are done get rate efficiencies at different stream rates warmth inputs. The exhibition warmth funnels correlation between their efficiencies is done. The sintered copper wick structure pipe have been found capable when stood out from other two with heat inputs beginning from 50 to 800 watts evaporator 30, condenser 72, adiabatic 110, flate heat pipe width 7.6mm, thickness 3.4 mm, first dia 6mm warmth pipe holder thickness in 0.5mm working liquid ethanol wick in view prevailing Capillarity property. The varieties of evaporator and condenser surface temperatures are plotted for changing warmth information sources and stream rate changes at condenser water coat. ANSYS programming is utilized for computational investigation and exploratory outcomes are in great concurrence with the examination.

Innovative Configurations of Large Scale Heat Pipes

2005 ◽  
Author(s):  
Jessica Sheehan ◽  
Donald Jordan ◽  
Douglas T. Queheillalt ◽  
Pamela M. Norris
Keyword(s):  
Heat Pipe ◽  
Large Scale ◽  
Heat Pipes ◽  
Heat Spreader ◽  
Pipe System ◽  
Pipe Systems

A large-scale heat pipe is one of many possible solutions to the modern day problem of quickly dissipating high amounts of concentrated heat. While heat pipes are a proven technology, little research has been directed at large-scale heat pipe systems. Two configurations of large-scale heat pipes are investigated in this study. The two configurations examined were a 2’ × 2’ heat spreader plate (a type of heat pipe) and an innovative heat pipe system that combines traditional heat pipes and heat spreader plates. The heat spreader plate, when tested, quickly becomes isothermal and works as a traditional heat pipe. This demonstrates the ability of this large-scale heat pipe configuration to work effectively to spread out high amounts of deposited heat. The experimentation on the innovative heat pipe system gave similar results, showing that the configuration works as a traditional heat pipe.

Experimental Investigation of Graphene Oxide Nanofluids on Thermal Performance of Heat Pipe

2019 ◽  
Author(s):  
Weilin Zhao ◽  
Jun Xu ◽  
Jinkai Li
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Air Cooling ◽  
Coating Film ◽  
Water Cooling ◽  
Condenser Section ◽  
Wick Structure

Abstract The graphene oxide-deionized water (GO-DW) and graphene oxide-ethylence glycol (GO-EG) nanofluids were synthesized. The better suspension of nanofluids was achieved. The thermal conductivity of both nanofluids was analyzed. It indicates that GO nanoparticles can strengthen the thermal conductivity of DW base fluids by 22.6%–61.7% and EG base fluids by 15.3%–32.8%. Four copper heat pipes charged with GO-DW and GO-EG nanofluids as well as DW and EG base fluids were experimentally researched, it is discovered that the addition of GO nonoparticles in heat pipe can elevate the condenser wall temperature and reduce the temperature difference. Future analysis finds that, with respect to DW and EG fluids heat pipe, the thermal resistances of GO-DW and GO-EG nanofluids heat pipe are respectively decreased 42.6–52.4% and 31.9%–38.4% for air cooling, and 15.5–16.7% and 11.5%–18.9% for water cooling at condenser section. Besides, the wick structure of GO-DW nanofluids heat pipe was examined by Scanning Electron Microscope, and the effective thermal conductivity of fluid-wick combination was evaluated. The outcomes demonstrate that the evaporator wick surface contains about 0375–1.24μm coating film of GO nanoparticles. Assumed the coating film is 0.75μm, the effective thermal conductivity of fluid-wick combination is respectively enhanced by 66.92 % for GO-DW nonofluids heat pipe and 37.32% for GO-EG nonofluids heat pipe at 70 °C.

Characterization of the Performance of Flat Heat Pipes for Electronics Cooling

2000 ◽  
Author(s):  
Unnikrishnan Vadakkan ◽  
Suresh V. Garimella ◽  
Choondal B. Sobhan
Keyword(s):  
Heat Pipe ◽  
Heat Input ◽  
Energy Transport ◽  
Temperature Drop ◽  
Thermal Conductance ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Flow And Heat Transfer ◽  
Parametric Studies ◽  
Axial Heat

Abstract A computational model has been developed to analyze the transient and steady-state performance of flat heat pipes and assess their performance under different operating and geometric parameters, in order to arrive at optimal designs. The model assumes two-dimensional fields for flow and heat transfer and solves the governing differential equations using a finite-difference approach. The wick region of the heat pipe is analyzed using transport equations for a porous medium. The influence of axial heat conduction along the wall, as well as the energy transport in the wick, on the velocity and temperature distributions is examined. The overall performance of the heat pipe is quantified by calculating an effective thermal conductance from the heat input and the temperature drop along the heat pipe wall. Parametric studies are conducted using the model to investigate the dependence of the heat pipe performance on the heat input at the evaporator, the containing wall thickness, and the porosity of the wick.

Experimental Model to Optimize the Design of Cylindrical Heat Pipes for Solar Collector Application

2013 ◽  
Vol 393 ◽  
pp. 735-740
Author(s):  
Fairosidi Idrus ◽  
Nazri Mohamad ◽  
Ramlan Zailani ◽  
Wisnoe Wirachman ◽  
Mohd Zulkifly Abdullah
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Pipes ◽  
Design Parameters ◽  
Working Fluid ◽  
Pipe Material ◽  
Efficient Design ◽  
Wick Structure ◽  
To Come ◽  
Transfer Device

A heat pipe is a heat-transfer device that use the principles of thermal conductivity and phase change to transfer heat between two ends at almost constant temperature. The thermal peformance of cylindrical heat pipes depends on design parameters such as dimensions of the heat pipe, material, wick structure and the working fluid. An experimental strategy was designed to study the effect of these parameters on the thermal performance of cylindrical heat pipes. The experimental design was conceived by employing the Taguchi method. The final aim of the experiments is to come up with design parameters that will yield optimum thermal performance. This paper presents an efficient design of experiment and the associated experimental setup and procedures to be carried out in order to optimize the design of cylindrical heat pipes.

scholarly journals CHARACTERIZATION OF HEAT CONDUCTIVITY OF ECCENTRICALLY ROTATING HEAT PIPES USED FOR COOLING OF MOTOR SPINDLES

2021 ◽  
Vol 2021 (3) ◽  
pp. 4698-4705
Author(s):  
B. Denkena ◽  
◽  
B. Bergmann ◽  
K. Kono ◽  
R. Ishiguro ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Heat Exchangers ◽  
Thermal Characteristics ◽  
Heat Pipes ◽  
Simulation Based ◽  
Wick Structure ◽  
Parameter Values

Heat losses within motor spindles lead to undesired effects such as machining inaccuracies and de-creasing lifetime of the motor and bearings. To reduce thermal loads, complex shaft cooling concepts with costly sealing techniques exist. For this reason, a novel, less costly cooling concept has been de-veloped based on heat pipes with high thermal conductivity and fin-shaped heat exchangers. The de-sign and integration of these heat exchanger elements into a motor spindle is carried out using the fi-nite element method. The aim is to optimize the efficiency of the heat pipes and heat exchangers for optimal shaft cooling performance. For a simulation-based development of a prototype spindle, un-known thermal characteristics of the heat transfer elements must be determined. In this paper, the de-termination of the thermal conductivity of the heat pipes is described. The determination of conductivi-ty is done experimentally. First, the developed test rig and the applied procedure for the determination of the conductivity are shown. Subsequently, the experimental results are presented and discussed. Two types of heat pipes were analyzed: Copper heat pipes with sintered wick structure and nickel-plated copper heat pipes with axial grooves. The influences of rotational speed, heat flow rates and the angle between the heat pipe and main axis of rotation were investigated. The results indicate a distinct dependency of the conductivity on the varied parameters. However, changes of parameter values have very different quantitative and qualitative effects on the determined conductivities de-pending on the type of heat pipe.

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