Thermo-Mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change

2006 ◽  
Vol 324-325 ◽  
pp. 227-230
Author(s):  
Jin Won Joo ◽  
Yong Chul Cho ◽  
Jong Hwa Won ◽  
Sung Hoon Choa
Keyword(s):  
Mechanical Behavior ◽  
Frequency Shift ◽  
Temperature Change ◽  
Deformation Behavior ◽  
High Sensitivity ◽  
Temperature Dependent ◽  
Mems Gyroscope ◽  
Sensor Package ◽  
Gyroscope Sensor ◽  
Global And Local

In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moiré interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.

Performance and Reliability of MEMS Gyroscopes and Packaging at High Temperatures

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000359-000366 ◽  
Author(s):  
Patrick McCluskey ◽  
Chandradip Patel ◽  
David Lemus
Keyword(s):  
High Temperature ◽  
Indoor Environment ◽  
Elevated Temperatures ◽  
High Sensitivity ◽  
Effect Of Temperature ◽  
Gps Tracking ◽  
Mems Gyroscope ◽  
Mems Gyroscopes ◽  
Gyroscope Sensor

Elevated temperatures can significantly affect the performance and reliability of MEMS gyroscope sensors. A MEMS vibrating resonant gyroscope measures angular velocity via a displacement measurement which can be on the order on nanometers. High sensitivity to small changes in displacement causes the MEMS Gyroscope sensor to be strongly affected by changes in temperature which can affect the displacement of the sensor due to thermal expansion and thermomechanical stresses. Analyzing the effect of temperature on MEMS gyroscope sensor measurements is essential in mission critical high temperature applications, such as inertial tracking of the movement of a fire fighter in a smoke filled indoor environment where GPS tracking is not possible. In this paper, we will discuss the development of the high temperature package for the tracking application, including the characterization of the temperature effects on the performance of a MEMS gyroscope. Both stationary and rotary tests were performed at room and at elevated temperatures on 10 individual single axis MEMS gyroscope sensors.

Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

2009 ◽  
Author(s):  
Chandradip Patel ◽  
Allen Jones ◽  
Joshua Davis ◽  
Patrick McCluskey ◽  
David Lemus
Keyword(s):  
Temperature Effects ◽  
Indoor Environment ◽  
Elevated Temperatures ◽  
High Sensitivity ◽  
Effect Of Temperature ◽  
Gps Tracking ◽  
Test Protocol ◽  
Mems Gyroscope ◽  
Mission Critical ◽  
Gyroscope Sensor

Elevated temperatures can significantly affect the performance and reliability of MEMS gyroscope sensors. A MEMS vibrating resonant gyroscope measures angular velocity via a displacement measurement which can be on the order on nanometers. High sensitivity to small changes in displacement causes the MEMS Gyroscope sensor to be strongly affected by changes in temperature which can affect the displacement of the sensor due to thermal expansion and thermomechanical stresses. Analyzing the effect of temperature on MEMS gyroscope sensor measurements is essential in mission critical high temperature applications, such as inertial tracking of the movement of a fire fighter in a smoke filled indoor environment where GPS tracking is not possible. In this paper, we will discuss the development of a test protocol which was used to assess temperature effects. Both stationary and rotary tests were performed at room and at elevated temperatures on 10 individual single axis MEMS gyroscope sensors.

scholarly journals Design of A New Structure Quartz MEMS Gyroscope with High Sensitivity

2018 ◽  
Vol 382 ◽  
pp. 042036 ◽  
Author(s):  
Qingyuan Zhang ◽  
Lihui Feng ◽  
Jianmin Cui ◽  
Yi Tang ◽  
Yanqing Yao
Keyword(s):  
High Sensitivity ◽  
Mems Gyroscope

Stress Hysteresis and Thermal-Mechanical Behavior of PECVD Silicon Nitride and Ebeam Aluminum Films for Microbolometer Applications

2004 ◽  
Vol 854 ◽  
Author(s):  
Shusen Huang ◽  
Xin Zhang
Keyword(s):  
Silicon Nitride ◽  
Mechanical Behavior ◽  
Measurement System ◽  
Low Cost ◽  
High Sensitivity ◽  
Central Idea ◽  
Aluminum Films ◽  
Uncooled Microbolometer ◽  
Curvature Measurement ◽  
Stress Hysteresis

ABSTRACTUncooled cantilever-based microbolometer arrays received more attention recently due to high sensitivity and low cost. The central idea is built on the deflection of a bilayer SiNx/Al material upon the temperature change. The thermal-mechanical behavior of the bilayer is significant for the performance of the microbolometers. In this paper, we perform thermal cyclings to aluminum and SiNx films. The CTEs and the stress evolutions were measured using a curvature measurement system. The curvature profile of a SiNx/Al/Si component was predicted using an extension of Stoney's formula, well agreeing with the experimental results. This work demonstrates fundamental mechanics issues in bilayer SiNx/Al components, which have a great potential for the use in uncooled microbolometer applications.

Optical and Electrical Methods to Measure the Dynamic Behavior of a MEMS Gyroscope Sensor

2005 ◽  
Author(s):  
Alfredo Cigada ◽  
Elisabetta Leo ◽  
Marcello Vanali
Keyword(s):  
Laser Doppler Vibrometer ◽  
Mechanical Parameters ◽  
Mems Sensors ◽  
Electrical Method ◽  
Mems Gyroscope ◽  
Full Characterization ◽  
Design Specifications ◽  
Electrical Methods ◽  
Gyroscope Sensor

A full characterization of the mechanical parameters for vibrating MEMS sensors is required before integrating the mechanical and the electronic part. This is to verify that the main design specifications are fulfilled before sensors are available on the market. The main goal is to accurately establish the well-working devices in the shortest time. In this paper the electrical method based on the measurement of the GND current is used to satisfy this purpose. To check the validity of the achieved results through this method a comparison is done with those obtained through the widely used optical method based on vibration measurements through by means of a Laser Doppler Vibrometer (LDV).

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