Preparation of Epoxy Modified Organosilicone High-Temperature Resistance Coatings

2008 ◽  
Vol 373-374 ◽  
pp. 434-437
Author(s):  
Hua Zhu ◽  
Zhi Lang Chen ◽  
Fang Nan ◽  
An Lin ◽  
Fu Xing Gan
Keyword(s):  
High Temperature ◽  
Epoxy Resin ◽  
Adhesion Strength ◽  
Ring Opening ◽  
Epoxy Group ◽  
Temperature Resistance ◽  
Ring Opening Reaction ◽  
High Temperature Resistance ◽  
Solidification Reaction ◽  
The Fourier Transform

An ambient-cured organosilicone resin modified with epoxy resin was synthesized with lab-synthesized polysiloxane resin and biphenix-A epoxy resin(E-20) by copolymerization at 180~190 °C for 2~3 hours. The effect of ratios between polysiloxane resin and E-20, reaction temperatures and reaction time on heat resistance and miscibility etc were discussed in detail. The experiment results showed that the epoxy modified organosilicone resin exhibited the best solubility performance and adhesion strength when the ratio of the polysiloxane resin to E-20 was 3:7. The Fourier transform infrared spectra (FTIR) revealed that hydroxy on epoxy resin had reacted with ethyoxyl on organic silicon molecular chain, but no ring-opening reaction happened on epoxy group of E-20. The excellent high-temperature resistance painting, based on these epoxy modified organosilicone resin was prepared with flake aluminum powder as temperature resistance filler, polyamide 650 as curer and WD-50 coupling agent as curing-promoter. It was shown that the temperature resistance was superior to 600°C and the adhesion strength of the coating was up to 1 grade. Scanning electron microscope(SEM) revealed the reaction happened on -Si-O-Si- and Al under high temperature improved the coatings to resist higher temperature. The mechanism of the high-temperature anticorrosion is attributed to “ring-opening reaction” and “cross-link solidification reaction”.

High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing

2011 ◽  
Vol 284-286 ◽  
pp. 1804-1807 ◽  
Author(s):  
De Long Ran ◽  
Jian Jun Xie ◽  
Kai Huang ◽  
Shui Ping Yin ◽  
Sheng Ming Chen ◽  
...  
Keyword(s):  
High Temperature ◽  
Absorption Band ◽  
Epoxy Resin ◽  
Room Temperature ◽  
Loss Modulus ◽  
Technological Parameters ◽  
Temperature Resistance ◽  
Epoxy Adhesives ◽  
High Temperature Resistance ◽  
Long Chain

High-temperature resistant epoxy adhesives cured under room-temperature becomes more and more important in many industries such as aerospace and aviation, the locomotive and diesel, etc. In this paper three self-made amine-based mannich-amide was mixed with E-44 epoxy resin under the same technological parameters, and the epoxy adhesives cured by the three amine-based mannich-amides under room-temperature are tested by FTIR, TGA and DMA. Results of TGA show a quicker drop in weight occurrence within 150-250°C for epoxy networks cured by multiamine-based mannich amides than the long-chain alkyl one. Results of FTIR show completely curing of epoxy adhesives cured by mannich amides under room temperature and the height of absorption band 1502cm-1(C-N) is much lower after 12h under 150°C,200°C atmosphere than 25°C. Results of DMA show that the Tg determined by DMA has an order EP AN2(89.9°C) >EP AN1(89.7°C)>EP AN3(80.8°C). In the rest results of DMA, the EP-AN3 system has the biggest storage modulus (E’) within 100-150°C while the EP-AN3 system has the smallest loss modulus(E”) within 100-150°C. As a whole, the epoxy adhesives cured by AN3 under room-temperature have the best high temperature resistance.

scholarly journals Research on Resin Used for Impregnating Polyimide Fiber Paper-Based Composite Materials

Materials ◽  
2021 ◽  
Vol 14 (17) ◽  
pp. 4909
Author(s):  
Wenlong Pang ◽  
Ruisen Shi ◽  
Jun Wang ◽  
Qingwei Ping ◽  
Xueru Sheng ◽  
...  
Keyword(s):  
Composite Material ◽  
High Temperature ◽  
Epoxy Resin ◽  
Temperature Stability ◽  
Silicone Resin ◽  
High Temperature Stability ◽  
Temperature Resistance ◽  
High Temperature Resistance ◽  
Polyimide Fiber ◽  
Modified Epoxy

In this paper, a resin with high adhesion, easy curing, good flexibility, and high temperature resistance was prepared from polyimide fiber paper. First, in order to improve the toughness and curability of impregnating resin, epoxy resin was modified by addition of vinyl silicone resin. Subsequently, ternary resin with high temperature stability was obtained by polyimide resin addition. Among the investigated conditions, the optimal additive amount of vinyl silicone resin and polyimide resin was 30% and 5%, respectively. The prepared ternary resin has better toughness, crosslinking degree, high temperature stability (5% mass loss at 339.2 °C) and no obvious glass transition at high temperature. Finally, the polyimide fiber paper-based composite material was impregnated with modified epoxy resin and ternary resin, respectively. The results shows that the paper-based composite material impregnated with modified epoxy resin has a better fiber bonding degree, a smooth surface, and contact angle could reach up to 148.71°. Meanwhile, the paper-based composite material impregnated with ternary resin has good high temperature resistance, and the tensile index of the paper-based composite material could reach up to 35.1 N·m/g at 200 °C.

Research and Development of Self-Lubricating Bearing Materials

2013 ◽  
Vol 651 ◽  
pp. 198-203
Author(s):  
Xiu Ling Wang ◽  
Li Ying Yang ◽  
Shou Ren Wang
Keyword(s):  
High Temperature ◽  
Research And Development ◽  
Metal Matrix ◽  
Future Trend ◽  
Al Alloy ◽  
Temperature Resistance ◽  
The Future ◽  
High Temperature Resistance ◽  
Bearing Materials ◽  
New Type

It is significant and necessary to carry out the research and development of self-lubricating bearing. The current study of metal matrix self-lubricating bearing materials is summarized. A new type of high temperature self-lubricating Ti-Al alloy bearing materials is proposed. It is light, anti-friction, anti-corrosion and high temperature resistance (600 °C). The future trend is introduced in the end of this paper.

Preparation and Properties of Waterborne Varnish for On-Demand Inkjet Printing

2021 ◽  
Author(s):  
Jilei Chao ◽  
Ruizhi Shi ◽  
Fuqiang Chu ◽  
Yanling Guo ◽  
Qian Deng
Keyword(s):  
Inkjet Printing ◽  
Ring Opening ◽  
Water Resistance ◽  
Epoxy Group ◽  
Molar Ratio ◽  
Esterification Reaction ◽  
Trimellitic Anhydride ◽  
Friction Resistance ◽  
Ring Opening Reaction ◽  
Film Forming

A kind of waterborne varnish for inkjet printing was synthesized, and properties of the waterborne varnish were characterized to make it suitable for the glazing requirements of inkjet printing and other printability requirements. The waterborne varnish was synthesized from epoxy resin (E-51), epoxy diluent (ED), acrylic acid, trimellitic anhydride, maleic anhydride and organic amine by three steps of ring opening reaction, esterification reaction, neutralization reaction. The viscosity, film-forming property, water absorption of waterborne varnish and the water resistance, lightness, wear resistance and bonding strength of coated paper were tested. The effects of the ratio of E-51 and ED in the polymerization system on the properties of waterborne varnish were studied. In the test of printability of self-made waterborne varnish, the absorption of digital inkjet paper to varnish and the influence of varnish on color reproduction of printed image were discussed and studied. The results show that when the molar ratio of epoxy group in E-51 and ED is about 1:1, the prepared varnish is suitable for inkjet printing, and its film-forming property, such as water resistance, adhesion and friction resistance are better. At the same time, its printability is also better.

Mineral-impregnated carbon fibre reinforcement for high temperature resistance of thin-walled concrete structures

2019 ◽  
Vol 97 ◽  
pp. 68-77 ◽  
Author(s):  
Kai Schneider ◽  
Albert Michel ◽  
Marco Liebscher ◽  
Lucas Terreri ◽  
Simone Hempel ◽  
...  
Keyword(s):  
High Temperature ◽  
Carbon Fibre ◽  
Concrete Structures ◽  
Fibre Reinforcement ◽  
Temperature Resistance ◽  
High Temperature Resistance ◽  
Thin Walled
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