Fabrication and Properties of W-SiCP/Cu Composites by Hot Pressing Sintering

2016 ◽  
Vol 697 ◽  
pp. 207-210
Author(s):  
Lian Meng Zhang ◽  
Yao Liu ◽  
Cheng Cheng Zhang ◽  
Guo Qiang Luo ◽  
Huang Liu ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Low Temperature ◽  
Bending Strength ◽  
Coefficient Of Thermal Expansion ◽  
Hot Press ◽  
X Ray Diffraction ◽  
Ternary Composite ◽  
Hot Pressing Sintering ◽  
Hot Press Sintering ◽  
Structural Characterizations

Abstract. A new ternary composite of W-SiCP/Cu(40vol%) was designed and prepared by low-temperature hot-press sintering. The micro-structural characterizations were evaluated by X-ray diffraction (XRD) and scanning electron microstructure (SEM), coefficient of thermal expansion is measured. When sintered at 950°C-100MPa-2h, the relative density of the W-SiCP/Cu composites as a function of W content all exceeded 97%. Due to the plastic deformation of Cu, higher densification W-SiCP/Cu(40vol%) composites can be achieved at a relatively low temperature. The composites are characterized by the relatively low coefficient of thermal expansion, bending strength and hardness. The values of thermal expansion indicate that thermal expansion can be precisely controlled by adding SiC particles.

Influences of SiC Particle Size and Electroless Plating on the Properties of SiCp/Cu Composites

2014 ◽  
Vol 1030-1032 ◽  
pp. 103-107
Author(s):  
Li Li Tang ◽  
Ming Hu ◽  
Lin Shan ◽  
Yun Long Zhang
Keyword(s):  
Thermal Expansion ◽  
Relative Density ◽  
Electroless Plating ◽  
Bending Strength ◽  
Coefficient Of Thermal Expansion ◽  
Hot Press ◽  
The Poor ◽  
Sic Particles ◽  
Hot Press Sintering ◽  
Sic Particle

Electroless plating technology was applied in order to improve the poor wettability between the copper and SiC. SiCp/Cu composites were frbricated by hot-press sintering technique. The influences of SiC particles (Cu-coated and Cu-uncoated) and SiCp/Cu-5vol%n-SiC on microstructures, relative density, bending strength and coefficient of thermal expansion(CTE) were researched in detail. The results show that SiC particles distributed in Cu matrix uniformly. And a certain amount of SiC, the relative density and bending strength of SiCp/Cu(Cu-coated) composite were greater than SiCp/Cu(Cu-uncoated) composite, and the coefficient of thermal expansion was opposite, Between SiCp/Cu(Cu-coated) and SiCp/Cu-5vol% nanoscale SiC(n-SiC), the relative density and bending strength of SiCp/Cu(Cu-coated) were more than SiCp/Cu-5vol%n-SiC, and CTE was different.

Fabrication and Mechanical Properties of SiC/Cu Composites with Zn Addition by Hot Pressing Sintering

2013 ◽  
Vol 745-746 ◽  
pp. 700-705
Author(s):  
Huang Liu ◽  
Guo Qiang Luo ◽  
Pin Gan Chen ◽  
Qiang Shen ◽  
Lian Meng Zhang
Keyword(s):  
Mechanical Properties ◽  
Vickers Hardness ◽  
Hot Pressing ◽  
Bending Strength ◽  
Coefficient Of Thermal Expansion ◽  
High Volume ◽  
X Ray Diffraction ◽  
X Ray ◽  
Zn Addition ◽  
Hot Pressing Sintering

SiC/Cu composites exhibit low density, low coefficient of thermal expansion and excellent mechanical properties. In this study, Zn of 2 wt. % was added as the sintering activator, and the high volume faction (60%) SiC/Cu composites was fabricated by hot pressing sintering technology. The phase composition and morphology of as-prepare samples were characterized by X-ray diffraction (XRD) system and scanning electron microscopy (SEM) equipped with an energy-dispersive spectroscopy (EDS) system. The as-prepared SiC/Cu composites were dense and uniform as well as void free. The results show that SiC/Cu composites can reach excellent mechanical properties of SiC/Cu composites. With the increase of sintering temperature, Vickers hardness and the bending strength of the samples increased obviously and the as-prepared SiC/Cu composites achieved a maximum Vickers hardness and bending strength respectively of 195MPa and 140MPa.

Effect of Different Sintering Temperature on the Performance of Mullite-Corundum Refractory Materials

2013 ◽  
Vol 750-752 ◽  
pp. 521-524
Author(s):  
Ping Li ◽  
Xing Yong Gu ◽  
Ting Luo ◽  
Yun Xia Chen
Keyword(s):  
Thermal Expansion ◽  
Thermal Stress ◽  
Stress Fracture ◽  
Bending Strength ◽  
Sintering Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Refractory Materials ◽  
Corundum Refractory ◽  
X Ray Diffraction

Al (OH)3, Suzhou kaolin, AlF3 and V2O5 were premixed and pelleted to form the precursor for fabricating the mullite whisker, and then the precursor was added into the calcined bauxite and Suzhou kaolin mixture according to a certain mass percent. The mullite-corundum refractory materials with well-dispersed needle-like mullite formed in-situ were prepared. Through studying the effect of different sintering temperatures on the performances of the as-fabricated mullite-corundum refractory materials, it was concluded that the appropriate sintering temperature was 1450 °C. X-ray diffraction (XRD), scanning electron microscopy (SEM), water absorption, bending strength, coefficient of thermal expansion and the first thermal stress fracture factor were used to characterize and evaluate the materials. The results show that the sintering character and thermal expansion coefficient of the refractory materials increase with the rising sintering temperature. The bending strength of the refractory materials sintered at 1500 °C presented the maximum value and the first thermal stress fracture factor appeared the highest value at 1450 °C.

A cautionary tale on the use of GE-7031 varnish: low-temperature thermal expansion studies of ScF3

2013 ◽  
Vol 46 (3) ◽  
pp. 823-825 ◽  
Author(s):  
Cody R. Morelock ◽  
Matthew R. Suchomel ◽  
Angus P. Wilkinson
Keyword(s):  
Thermal Expansion ◽  
Low Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Negative Thermal Expansion ◽  
Rhombohedral Phase ◽  
Thermal Expansion Mismatch ◽  
X Ray Diffraction ◽  
Electrical Insulator ◽  
Sample Matrix ◽  
Cell Volumes

GE-7031 varnish, a commonly used low-temperature adhesive and electrical insulator owing to its high thermal conductivity and mechanical strength at low temperatures, was used as a sample matrix for low-temperature powder X-ray diffraction measurements of the negative thermal expansion (NTE) material ScF3. When ScF3powder was mixed with GE-7031 varnish, an unexpected cubic to rhombohedral phase transition in the ScF3sample was observed at ∼50 K, and it exhibited smaller low-temperature unit-cell volumes than samples without the varnish matrix. Experimental observations and quantitative estimates suggest that these anomalies are the result of stress induced by a thermal expansion mismatch between the varnish matrix (large positive coefficient of thermal expansion, CTE) and ScF3(quite large negative CTE). The use of GE-7031 varnish as a sample matrix for low-temperature measurements should be approached with caution if a large thermal expansion mismatch is expected.

scholarly journals Effect of Sintering Temperature on Microstructure and Mechanical Properties of Hot-Pressed Fe/FeAl2O4 Composite

Crystals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 422
Author(s):  
Kuai Zhang ◽  
Yungang Li ◽  
Hongyan Yan ◽  
Chuang Wang ◽  
Hui Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Bending Strength ◽  
Sintering Temperature ◽  
Raw Materials ◽  
Hot Press ◽  
Microstructure And Mechanical Properties ◽  
Powder Particles ◽  
Hot Press Sintering ◽  
Sintering Method

An Fe/FeAl2O4 composite was prepared with Fe-Fe2O3-Al2O3 powder by a hot press sintering method. The mass ratio was 6:1:2, sintering pressure was 30 MPa, and holding time was 120 min. The raw materials for the powder particles were respectively 1 µm (Fe), 0.5 µm (Fe2O3), and 1 µm (Al2O3) in diameter. The effect of sintering temperature on the microstructure and mechanical properties of Fe/FeAl2O4 composite was studied. The results showed that Fe/FeAl2O4 composite was formed by in situ reaction at 1300 °C–1500 °C. With the increased sintering temperature, the microstructure and mechanical properties of the Fe/FeAl2O4 composite showed a change law that initially became better and then became worse. The best microstructure and optimal mechanical properties were obtained at 1400 °C. At this temperature, the grain size of Fe and FeAl2O4 phases in Fe/FeAl2O4 composite was uniform, the relative density was 96.7%, and the Vickers hardness and bending strength were 1.88 GPa and 280.0 MPa, respectively. The wettability between Fe and FeAl2O4 was enhanced with increased sintering temperature. And then the densification process was accelerated. Finally, the microstructure and mechanical properties of the Fe/FeAl2O4 composite were improved.

Thermoelectric Properties of Mn Doped Cu12-xMnxSb4S13 Tetrahedrites

2016 ◽  
Vol 847 ◽  
pp. 161-165 ◽  
Author(s):  
Ju Yi Wang ◽  
Xiao Ya Li ◽  
Ye Feng Bao
Keyword(s):  
Electrical Conductivity ◽  
Substitution Effect ◽  
Hot Press ◽  
X Ray Diffraction ◽  
Doping Amount ◽  
Spectroscopy Analysis ◽  
Mn Doping ◽  
Thermoelectric Transport Properties ◽  
Hot Press Sintering ◽  
Mn Doped

In this study, Mn doped Cu12-xMnxSb4S13(x=0, 0.5, 1.0, and 2.0) tetrahedrite samples were prepared by melting and annealing followed by hot press sintering. Powder X-ray diffraction and scanning electron microscopy and electron energy dispersive spectroscopy analysis were performed for the samples, and the thermoelectric transport properties of samples were characterized. The experimental results showed that the synthetic tetrahedrites were consisted of principal Cu12Sb4S13 phase and a small amount of secondary Cu3SbS4 and CuSbS2. The electrical conductivity of the tetrahedrites decreased with increasing the Mn doping amount. Contrary to the electrical conductivity, the Seebeck coefficient of the tetrahedrites increased with increasing Mn doping amount. The thermal conductivity decreased with increasing Mn doping amount due to the suppression of the carrier contribution, as well as due to the substitution effect of Mn on the Cu site. For the Mn doped Cu12-xMnxSb4S13 compounds with x=0.5, 1.0, and 2.0, the ZT values decreased with the increase of Mn doping amount, a maximum ZT=0.89 was obtained for the Mn doped compound with x=0.5.

Effects of TiN Content on Mechanical Properties and Microstructure of ATN Materials

2013 ◽  
Vol 589-590 ◽  
pp. 590-593 ◽  
Author(s):  
Min Wang ◽  
Jun Zhao
Keyword(s):  
Mechanical Properties ◽  
Mechanical Property ◽  
Fracture Toughness ◽  
Vickers Hardness ◽  
Bending Strength ◽  
Sintering Temperature ◽  
Ceramic Materials ◽  
Hot Press ◽  
Hot Press Sintering ◽  
Tin Content

In order to investigate the effects of TiN content on Al2O3/TiN ceramic material (ATN), the ATN ceramic materials were prepared of TiN content in 30%, 40%, 50%, 60% in the condition of hot press sintering. The sintering temperature is 1700°C, the sintering press is 32MPa, and the holding time are 5min, 10min, 15min. The effects of TiN content on mechanical properties and microstructure of ATN ceramic materials were investigated by analyzing the bending strength, hardness, fracture toughness. The results show that ATN50 has the best mechanical property, its bending strength is 659.41MPa, vickers hardness is 13.79GPa, fracture toughness is 7.06MPa·m1/2. It is indicated that the TiN content has important effect on microstructure and mechanical properties of ATN ceramic materials.

Sign in / Sign up

Export Citation Format

Share Document