Preparation and Properties of Modified Boron Nitride/Epoxy Resin Thermal Conductive Composites

2020 ◽  
Vol 1003 ◽  
pp. 173-178
Author(s):  
Chen Liu ◽  
Hao Ran Zhou ◽  
Zhen Yuan
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Boron Nitride ◽  
Epoxy Composite ◽  
Conductive Filler ◽  
Decomposition Temperature ◽  
Thermal Stability Of

Boron nitride (BN) was modified by silane coupling agent (KH560) and used as heat conductive filler to prepare the modified BN (BN560)/epoxy composite. The effect of the BN560 filler content on the thermal conductivity and thermal stability of the epoxy composite was studied. The results show that BN560 can be uniformly dispersed in the epoxy matrix by an ultrasonic disperser. The BN560 added can effectively improve the thermal conductivity of the epoxy composite. With the increase of BN560 content to 20 wt.%, the thermal conductivity of the composite increases accordingly to 0.27 W/(m·K), 50% higher than that of pure epoxy, and a heat conductive network is formed. The BN560 added can improve the thermal stability of the composite. With increasing BN560 content, the thermal decomposition temperature and glass transition temperature of the composite increase. The composite with the BN560 content of 20 wt.% has the weight loss of 10 wt.% at 395.12 °C and the glass transition temperature of 144.59 °C.

scholarly journals Mechanical, Thermal, and Electrical Properties of BN–Epoxy Composites Modified with Carboxyl-Terminated Butadiene Nitrile Liquid Rubber

Polymers ◽  
2019 ◽  
Vol 11 (10) ◽  
pp. 1548 ◽  
Author(s):  
Xingming Bian ◽  
Rui Tuo ◽  
Wei Yang ◽  
Yiran Zhang ◽  
Qing Xie ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Epoxy Resin ◽  
Epoxy Composite ◽  
Resin Matrix ◽  
Liquid Rubber

Filled high thermal conductivity epoxy composite solves the problem of the low thermal conductivity of the epoxy resin itself, but the addition of the thermal conductive filler reduces the mechanical properties of the composite, which limits its application in the field of high voltage insulation. In this work, carboxyl-terminated butadiene nitrile liquid rubber (CTBN) was used to toughen the boron nitride-epoxy hybrid system, and the effects of different contents of CTBN on the mechanical properties, thermal conductivity, glass transition temperature, thermal stability, and dielectric properties of the composites were investigated. The results showed that when the content of CTBN was 5–15 wt.%, the CTBN formed a dispersed island structure in the epoxy resin matrix. The toughness of the composite increased by about 32%, the breakdown strength was improved, and the thermal conductivity was about 160% higher than that of pure epoxy resin. As the CTBN content increased, the glass transition temperature and thermal stability of the composite decreased and the dielectric constant and the dielectric loss increased. When the CTBN content is 10–15 wt.%, a toughened epoxy composite material with better comprehensive properties is obtained.

Nanocomposite Epoxy Resin for SiC Module

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000196-000200 ◽  
Author(s):  
Kenji Okamoto ◽  
Yuji Takematsu ◽  
Miyako Hitomi ◽  
Yoshinari Ikeda ◽  
Yoshikazu Takahashi
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Epoxy Resin ◽  
Molecular Motion ◽  
Experimental Results ◽  
Power Module ◽  
Operation Temperature ◽  
Thermal Stability Of

There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.

Thermal Properties of Acrylic Resin Denture Base Material Containing Silver Nanoparticle Synthesized from Aqueous Extract of Boesenbergia rotunda

2018 ◽  
Vol 777 ◽  
pp. 173-177
Author(s):  
Panjaporn Wongwitthayakool ◽  
Matsayapan Pudla
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Base Material ◽  
Acrylic Resin ◽  
Denture Base ◽  
Acrylic Resins ◽  
Thermal Stability Of

Silver nanoparticles (AgNPs) were synthesized by bioreduction method using aqueous extracts of Boesenbergia rotunda as reducing and stabilizing agents. Ultraviolet-Visible (UV-Vis) spectrophotometer was utilized to monitor the qualitative formation of AgNPs. The UV-Vis spectrum showed that the spherical AgNPs with diameter of 20-40 nm were formed. The antifugal activity of synthesized AgNPs was investigated using Candida albicans, which was found that the synthesized AgNPs could be used as effective growth inhibitors. The influence of the incorporation of prepared AgNPs on thermal properties of the acrylic denture base material was investigated. Glass transition temperature of filled acrylic resins was studied using the dynamic mechanical analyzer (DMA). The temperature sweeps were performed with tension mode. Thermogravimetry analysis (TGA) was used to examine effect of AgNP concentration and thermocycling (1250, 2500, 5000, and 10000 cycles) on thermal stability of AgNP filled acrylic resin denture base materials. Glass transition temperature (Tg) of the acrylic resins slightly increase with increasing AgNP contents. TGA results indicated that AgNP retarded thermal degradation of acrylic resin denture material, and thermocycling did not affect thermal stability of AgNP filled acrylic resin denture material.

Isothermal Crystallization of Zr55Al10Ni5Cu30 Bulk Amorphous Alloy Near the Glass Transition Temperature

2004 ◽  
Vol 449-452 ◽  
pp. 933-936 ◽  
Author(s):  
Zhuang Qi Hu ◽  
Q.S. Zhang ◽  
Hai Feng Zhang ◽  
B.Z. Ding ◽  
Z.M. Rao
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Amorphous Alloy ◽  
Amorphous Phase ◽  
Isothermal Crystallization ◽  
Metastable Phases ◽  
Bulk Amorphous Alloy ◽  
Thermal Stability Of

Isothermal crystallization of Zr55Al10Ni5Cu30bulk amorphous alloy near the glass transition temperature has been investigated. The microstructures and thermal stability of the annealed amorphous alloy were examined by HRTEM, XRD and DSC. The amorphous phase in the Zr55Al10Ni5Cu30bulk amorphous alloy crystallized at 420°C through the following processes of amorphous →amorphous with clusters + metastable phases→metastable phases.

Effects of graphene on thermal properties and thermal stability of polycarbonate/graphene nanocomposite

2021 ◽  
pp. 089270572199788
Author(s):  
Md Amir Sohel ◽  
Abhijit Mondal ◽  
P Mohammad Arif ◽  
Sabu Thomas ◽  
Asmita SenGupta
Keyword(s):  
Thermal Stability ◽  
Thermal Decomposition ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Multilayer Graphene ◽  
Melt Mixing ◽  
Graphene Nanocomposite ◽  
Thermal Stability Of

Polycarbonate (PC) /graphene nanocomposite was prepared using multilayer graphene (MLG) with loadings of 0.5, 1, and 3 wt% via melt mixing process. Morphological, structural, and thermal properties of the PC/MLG nanocomposites are investigated to look into the influence of MLG on the nanocomposite. A significant increase (∼6.4°C) in glass transition temperature is observed upon the addition of 3 wt% of MLG into the polycarbonate matrix. This increase in glass transition temperature may be due to the interaction between the MLG and polycarbonate polymer matrix. The specific heat capacity of pure PC and PC/MLG nanocomposites varies linearly with temperature below their glass transition. Upon the addition of MLGs, the overall thermal stability of PC/MLG nanocomposites increases with MLG loadings. A maximum increase about 29.23°C in T onset of thermal decomposition is observed in PC/MLG nanocomposite having 3 wt% of MLG loading. The activation energy ( Ea) of thermal decomposition is also calculated by kinetic analysis of thermal decomposition of the PC/MLG nanocomposites using Horowitz–Metzger and Broido’s methods.

scholarly journals Synthesis of Fe75Si20-xB5Mx (M=Ti, Ta or Zr) Powders by Wet Mechanical Milling

2015 ◽  
Vol 13 ◽  
pp. 54-58
Author(s):  
Horea Florin Chicinaş ◽  
Bogdan Viorel Neamţu ◽  
Traian Florin Marinca ◽  
Ionel Chicinaş
Keyword(s):  
Thermal Stability ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Transition Metals ◽  
Mechanical Alloying ◽  
Crystallization Temperature ◽  
Mechanical Milling ◽  
Thermal Stability Of

Amorphous Fe75Si20-xB5Mxpowders with M= Ti, Ta or Zr andx= 0 and 5 were synthesized by wet mechanical alloying, using benzene as a surfactant. The thermal stability of the Fe-Si-B alloy increases by introducing transition metals. The replacement of 5% Si with Ti, Ta or Zr leads to an increase of the crystallization temperature. It was found that the replacement of 5% Si with Zr increases the crystallization temperature with 115 °C, and also reveals a glass transition temperature around 580 °C.

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