scholarly journals Nanoscale Insights on the Origin of the Power MOSFETs Breakdown after Extremely Long High Temperature Reverse Bias Stress

2020 ◽  
Vol 1004 ◽  
pp. 433-438
Author(s):  
Patrick Fiorenza ◽  
Mario Alessandrino ◽  
Beatrice Carbone ◽  
Clarice Di Martino ◽  
Alfio Russo ◽  
...  

In this work, the origin of the dielectric breakdown of 4H-SiC power MOSFETs was studied at the nanoscale, analyzing devices that failed after extremely long (three months) of high temperature reverse bias (HTRB) stress. A one-to-one correspondence between the location of the breakdown event and a threading dislocation propagating through the epitaxial layer was found. Scanning probe microscopy (SPM) revealed the conductive nature of the threading dislocation and a local modification of the minority carriers concentration. Basing on these results, the role of the threading dislocation on the failure of 4H-SiC MOSFETs could be clarified.

2020 ◽  
Vol 31 (12) ◽  
pp. 125203 ◽  
Author(s):  
P Fiorenza ◽  
M S Alessandrino ◽  
B Carbone ◽  
C Di Martino ◽  
A Russo ◽  
...  

Author(s):  
Meng Lu ◽  
Yiqiang Chen ◽  
Min Liao ◽  
Chang Liu ◽  
Shuaizhi Zheng ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 757-762
Author(s):  
Daniel B. Habersat ◽  
Aivars Lelis ◽  
Ronald Green

Our results reinforce the notion of the need for an improved high-temperature gate bias (HTGB) test method — one which discourages the use of slow (greater than ~1 ms) threshold-voltage (VT) measurements at elevated temperatures and includes biased cool-down if room temperature measurements are performed, to ensure that any ephemeral effects during the high-temperature stress are observed. The paper presents a series of results on both state-of-the-art commercially-available devices as well as older vintage devices that exhibit enhanced charge-trapping effects. Although modern devices appear to be robust, it is important to ensure that any new devices released commercially, especially by new vendors, are properly evaluated for VT stability.


2016 ◽  
Vol 64 ◽  
pp. 458-463 ◽  
Author(s):  
O. Schilling ◽  
K. Leitner ◽  
K.-D. Schulze ◽  
F. Umbach

2019 ◽  
Vol 130 ◽  
pp. 233-240
Author(s):  
Sheng Li ◽  
Chi Zhang ◽  
Siyang Liu ◽  
Jiaxing Wei ◽  
Long Zhang ◽  
...  

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