Influence of High-Temperature Bias Stress on Room-Temperature VT Drift Measurements in SiC Power MOSFETs

2019 ◽  
Vol 963 ◽  
pp. 757-762
Author(s):  
Daniel B. Habersat ◽  
Aivars Lelis ◽  
Ronald Green

Our results reinforce the notion of the need for an improved high-temperature gate bias (HTGB) test method — one which discourages the use of slow (greater than ~1 ms) threshold-voltage (VT) measurements at elevated temperatures and includes biased cool-down if room temperature measurements are performed, to ensure that any ephemeral effects during the high-temperature stress are observed. The paper presents a series of results on both state-of-the-art commercially-available devices as well as older vintage devices that exhibit enhanced charge-trapping effects. Although modern devices appear to be robust, it is important to ensure that any new devices released commercially, especially by new vendors, are properly evaluated for VT stability.

2012 ◽  
Vol 717-720 ◽  
pp. 461-464 ◽  
Author(s):  
Daniel B. Habersat ◽  
Aivars J. Lelis ◽  
Ronald Green

Since power devices such as DMOSFETs will operate at high temperature where mobile ion effects are enhanced, identifying their presence is a key reliability issue for power electronics applications. We have detected the presence of mobile ion contamination in some SiC MOS device sample sets and correlated those results with observed high temperature bias instability. The differing behaviors of these devices to bias stressing as a function of temperature suggests that in some cases mobile ion drift may be counteracting the typical charge trapping effect. Triangular voltage sweep (TVS) data indicates the presence of roughly 1-4x1012cm-2mobile ions in samples where the bias instability significantly decreased with higher temperature, while samples with a nearly flat or positive-trending response showed overall lower ion contaminations of roughly 6-9x1011cm-2. These results, although preliminary, support the theory that mobile ion contamination is the cause of negative bias instability at elevated temperatures in SiC MOS.


Alloy Digest ◽  
1981 ◽  
Vol 30 (6) ◽  

Abstract FANSTEEL 85 METAL is a columbium-base alloy characterized by good fabricability at room temperature, good weldability and a good combination of creep strength and oxidation resistance at elevated temperatures. Its applications include missile and rocket components and many other high-temperature parts. This datasheet provides information on composition, physical properties, microstructure, hardness, elasticity, tensile properties, and bend strength as well as creep. It also includes information on low and high temperature performance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cb-7. Producer or source: Fansteel Metallurgical Corporation. Originally published December 1963, revised June 1981.


Author(s):  
Haiyang Fan ◽  
Yahui Liu ◽  
Shoufeng Yang

Ti–6Al–2Sn–4Zr–2Mo (Ti-6242), a near-[Formula: see text] titanium alloy explicitly designed for high-temperature applications, consists of a martensitic structure after selective laser melting (SLM). However, martensite is thermally unstable and thus adverse to the long-term service at high temperatures. Hence, understanding martensite decomposition is a high priority for seeking post-heat treatment for SLMed Ti-6242. Besides, compared to the room-temperature titanium alloys like Ti–6Al–4V, aging treatment is indispensable to high-temperature near-[Formula: see text] titanium alloys so that their microstructures and mechanical properties are pre-stabilized before working at elevated temperatures. Therefore, the aging response of the material is another concern of this study. To elaborate the two concerns, SLMed Ti-6242 was first isothermally annealed at 650[Formula: see text]C and then water-quenched to room temperature, followed by standard aging at 595[Formula: see text]C. The microstructure analysis revealed a temperature-dependent martensite decomposition, which proceeded sluggishly at [Formula: see text]C despite a long duration but rapidly transformed into lamellar [Formula: see text] above the martensite transition zone (770[Formula: see text]C). As heating to [Formula: see text]C), it produced a coarse microstructure containing new martensites formed in water quenching. The subsequent mechanical testing indicated that SLM-built Ti-6242 is excellent in terms of both room- and high-temperature tensile properties, with around 1400 MPa (UTS)[Formula: see text]5% elongation and 1150 MPa (UTS)[Formula: see text]10% elongation, respectively. However, the combination of water quenching and aging embrittled the as-built material severely.


Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1330
Author(s):  
Muhammad Farzik Ijaz ◽  
Mahmoud S. Soliman ◽  
Ahmed S. Alasmari ◽  
Adel T. Abbas ◽  
Faraz Hussain Hashmi

Unfolding the structure–property linkages between the mechanical performance and microstructural characteristics could be an attractive pathway to develop new single- and polycrystalline Al-based alloys to achieve ambitious high strength and fuel economy goals. A lot of polycrystalline as-cast Al-Cu-Mg-Ag alloy systems fabricated by conventional casting techniques have been reported to date. However, no one has reported a comparison of mechanical and microstructural properties that simultaneously incorporates the effects of both alloy chemistry and mechanical testing environments for the as-cast Al-Cu-Mg-Ag alloy systems. This preliminary prospective paper presents the examined experimental results of two alloys (denoted Alloy 1 and Alloy 2), with constant Cu content of ~3 wt.%, Cu/Mg ratios of 12.60 and 6.30, and a constant Ag of 0.65 wt.%, and correlates the synergistic comparison of mechanical properties at room and elevated temperatures. According to experimental results, the effect of the precipitation state and the mechanical properties showed strong dependence on the composition and testing environments for peak-aged, heat-treated specimens. In the room-temperature mechanical testing scenario, the higher Cu/Mg ratio alloy with Mg content of 0.23 wt.% (Alloy 1) possessed higher ultimate tensile strength when compared to the low Cu/Mg ratio with Mg content of 0.47 wt.% (Alloy 2). From phase constitution analysis, it is inferred that the increase in strength for Alloy 1 under room-temperature tensile testing is mainly ascribable to the small grain size and fine and uniform distribution of θ precipitates, which provided a barrier to slip by deaccelerating the dislocation movement in the room-temperature environment. Meanwhile, Alloy 2 showed significantly less degradation of mechanical strength under high-temperature tensile testing. Indeed, in most cases, low Cu/Mg ratios had a strong influence on the copious precipitation of thermally stable omega phase, which is known to be a major strengthening phase at elevated temperatures in the Al-Cu-Mg-Ag alloying system. Consequently, it is rationally suggested that in the high-temperature testing scenario, the improvement in mechanical and/or thermal stability in the case of the Alloy 2 specimen was mainly due to its compositional design.


2012 ◽  
Vol 710 ◽  
pp. 457-462 ◽  
Author(s):  
G. Rajaram ◽  
S. Kumaran ◽  
T Srinivas Rao

The high temperature tensile behaviour of Al-Si alloy and two of its composite systems with graphite as major reinforcement were investigated. The composites were developed by the stir casting method, wherein a mixture of graphite (3 wt %) and Cu / Ni (2 wt% each) were added into the molten Al-Si alloy to fabricate two systems such as Al-Si-Cu/graphite composite and Al-Si-Ni/graphite composite. The properties of composites were better than that of the matrix alloy. Tensile behaviour of alloy and composites were studied at different temperatures from room temperature to 300°C. It is found that the tensile strength of the alloy and composites were decreasing with increase in temperature. The transition elements (Cu / Ni) have played the key role in improving the ultimate tensile and yield strength of the composites over the alloy. The flow stress of the composite is more than that of the alloy. The strain hardening exponent value continuously drops with the increase of tensile temperature due to the thermal softening effect. The % elongation of the alloy is more than that of the composites. Fracture surfaces of the samples are analyzed by scanning electron microscope to understand the fracture mechanisms. Fractography reveals that the fracture behaviour of the alloy changes from cleavage mode at room temperature to complete ductile mode at high temperature.


2011 ◽  
Vol 462-463 ◽  
pp. 1-6 ◽  
Author(s):  
Tao Suo ◽  
Yu Long Li ◽  
Ming Shuang Liu

As Carbon-fiber-reinforced SiC-matrix (C/SiC) composites are widely used in high-temperature structural applications, its mechanical behavior at high temperature is important for the reliability of structures. In this paper, mechanical behavior of a kind of 2D C/SiC composite was investigated at temperatures ranging from room temperature (20C) to 600C under quasi-static and dynamic uniaxial compression. The results show the composite has excellent high temperature mechanical properties at the tested temperature range. Catastrophic brittle failure is not observed for the specimens tested at different strain rates. The compressive strength of the composite deceases only 10% at 600C if compared with that at room temperature. It is proposed that the decrease of compressive strength of the 2D C/SiC composite at high temperature is influenced mainly by release of thermal residual stresses in the reinforced carbon fiber and silicon carbon matrix and oxidation of the composite in high temperature atmosphere.


Science ◽  
2018 ◽  
Vol 362 (6419) ◽  
pp. 1131-1134 ◽  
Author(s):  
Aristide Gumyusenge ◽  
Dung T. Tran ◽  
Xuyi Luo ◽  
Gregory M. Pitch ◽  
Yan Zhao ◽  
...  

Although high-temperature operation (i.e., beyond 150°C) is of great interest for many electronics applications, achieving stable carrier mobilities for organic semiconductors at elevated temperatures is fundamentally challenging. We report a general strategy to make thermally stable high-temperature semiconducting polymer blends, composed of interpenetrating semicrystalline conjugated polymers and high glass-transition temperature insulating matrices. When properly engineered, such polymer blends display a temperature-insensitive charge transport behavior with hole mobility exceeding 2.0 cm2/V·s across a wide temperature range from room temperature up to 220°C in thin-film transistors.


2014 ◽  
Vol 54 (2) ◽  
pp. 374-380 ◽  
Author(s):  
J. Hao ◽  
M. Rioux ◽  
S.A. Suliman ◽  
O.O. Awadelkarim

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