Detection of Crystal Defects in High Doped Epitaxial Layers and Substrates by Photoluminescence

2017 ◽  
Vol 897 ◽  
pp. 222-225 ◽  
Author(s):  
Hrishikesh Das ◽  
Swapna Sunkari ◽  
Hans Naas ◽  
Martin Domeij ◽  
Andrei Konstantinov ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Grain Boundaries ◽  
Basal Plane ◽  
Potassium Hydroxide ◽  
Crystal Defects ◽  
Buffer Layers ◽  
Screw Dislocations ◽  
Near Ultraviolet ◽  
Doped Silicon

In this work, the detection and characterization of various crystal defects in high doped silicon carbide by photoluminescence (PL) is explored. The detection of basal plane dislocations in high doped epitaxial buffer layers is demonstrated using the near ultraviolet (NUV) spectra. Several characteristic defects in high doped 150mm substrates like grain boundaries and screw dislocations are also detected and characterized using the NUV PL spectra. Further characterization using molten potassium hydroxide etching is presented.

Investigation of Low Angle Grain Boundaries in Hexagonal Silicon Carbide

2006 ◽  
Vol 955 ◽  
Author(s):  
Yi Chen ◽  
Hui Chen ◽  
Ning Zhang ◽  
Michael Dudley ◽  
Ronghui Ma
Keyword(s):  
Silicon Carbide ◽  
Grain Boundaries ◽  
Basal Plane ◽  
Vapor Transport ◽  
Threading Dislocations ◽  
Prismatic Plane ◽  
Screw Dislocations ◽  
X Ray ◽  
Edge Dislocations ◽  
Dislocation Walls

ABSTRACTInteraction between basal plane dislocations and single or well-spaced threading dislocations is discussed based on synchrotron white beam X-ray topographic studies carried out on physical vapor transport grown hexagonal silicon carbide single crystals. The basal plane dislocations are able to cut through single or well-spaced threading edge dislocations even if the formation of kinks/jogs is energetically unfavorable while threading screw dislocations were mostly observed to act as effective pinning points. However, basal plane dislocations can sometimes cut through a threading screw dislocation, forming a superjog and which subsequently migrates on the prismatic plane via a cross-slip process. Threading edge dislocation walls act as obstacles for the glide of basal plane dislocations and the mechanism by which this occurs is discussed. The character of low angle grain boundaries and their dislocation content are discussed.

Characterization of Defect Structures in SiC Single Crystals Using Synchrotron X-Ray Topography

1993 ◽  
Vol 307 ◽  
Author(s):  
S. Wang ◽  
M. Dudley ◽  
C. Carter ◽  
D. Asbury ◽  
C. Fazit
Keyword(s):  
Detailed Analysis ◽  
Single Crystals ◽  
Basal Plane ◽  
Defect Structures ◽  
Dislocation Generation ◽  
Screw Dislocations ◽  
X Ray ◽  
White Beam

ABSTRACTSynchrotron white beam X-ray topography has been used to characterize defect structures in 6H-SiC wafers grown on (0001) seeds. Two major types of defects are observed: super screw dislocations approximately perpendicular to the basal plane and dislocation networks lying in the basal plane. The super screw dislocations, which have open cores, are growth dislocations. These dislocations act as sources and/or sinks for the glide dislocation networks. Detailed analysis and discussion of dislocation generation phenomena and Burgers vectors will be presented.

Detecting Basal Plane Dislocations Converted in Highly Doped Epilayers

2019 ◽  
Vol 963 ◽  
pp. 272-275
Author(s):  
Yoshitaka Nishihara ◽  
Koji Kamei ◽  
Kenji Momose ◽  
Hiroshi Osawa
Keyword(s):  
Silicon Carbide ◽  
Basal Plane ◽  
Near Infrared ◽  
Minority Carrier ◽  
Pin Diode ◽  
Forward Voltage ◽  
Carrier Recombination ◽  
Near Ultraviolet ◽  
Bipolar Devices ◽  
Voltage Degradation

Suppression of the forward voltage degradation is essential in fabricating bipolar devices on silicon carbide. Using a highly N–doped 4H–epilayer as an enhancing minority carrier recombination layer is a powerful tool for reducing the expansion of BPDs converted at the epi/sub interface; however, these BPDs cannot be observed by using the near–infrared photoluminescence in the layer. Near–ultraviolet photoluminescence was instead used to detect BPDs as dark lines. In addition, a short BPD converted near the epi/sub interface and contributing to the degradation was detected. When this evaluation was applied to the fabrication of a pin diode including a highly N–doped 4H–epilayer, the Vf shift was suppressed in comparison with that in a diode without the layer.

X-ray topographic dislocation contrast visible in reflections orthogonal to the Burgers vectors of axial screw dislocations in hexagonal silicon carbide

2001 ◽  
Vol 34 (1) ◽  
pp. 20-26 ◽  
Author(s):  
W. M. Vetter ◽  
M. Dudley
Keyword(s):  
Silicon Carbide ◽  
Electron Microscope ◽  
Basal Plane ◽  
High Density ◽  
Screw Dislocations ◽  
X Ray ◽  
Apparent Violation ◽  
Light Contrast

Contrast is associated with micropipes in X-ray topographs of SiC crystals obtained with prismatic reflections, representing an apparent violation of theg·b= 0 invisibility criterion. This is explained as a population of basal-plane dislocations with Burgers vectors of the setb= {\textstyle{1 \over 3}}〈11{\bar{2}}0〉 that occur in a high density within a few micrometers of the micropipes, below the resolution of X-ray topography. These basal-plane dislocations could be observed under an electron microscope. The presence of the surfaces of the micropipes influences the dislocation images in the topographs taken with prismatic reflections, often resulting in a band of light contrast along the axes of the micropipes.

Behavior of Basal Plane Dislocations and Low Angle Grain Boundary Formation in Hexagonal Silicon Carbide

2007 ◽  
Vol 556-557 ◽  
pp. 231-234 ◽  
Author(s):  
Yi Chen ◽  
Govindhan Dhanaraj ◽  
William M. Vetter ◽  
Rong Hui Ma ◽  
Michael Dudley
Keyword(s):  
Silicon Carbide ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Basal Plane ◽  
Opposite Sign ◽  
Three Dimensional ◽  
Cross Slip ◽  
X Ray ◽  
Tilt Boundaries ◽  
Edge Dislocations

The interactions between basal plane dislocations (BPDs) and threading screw and edge dislocations (TSDs and TEDs) in hexagonal SiC have been studied using synchrotron white beam x-ray topography (SWBXT). TSDs are shown to strongly interact with advancing basal plane dislocations (BPDs) while TEDs do not. A BPD can cut through an individual TED without the formation of jogs or kinks. The BPDs were observed to be pinned by TSDs creating trailing dislocation dipoles. If these dipoles are in screw orientation segments can cross-slip and annihilate also potentially leaving isolated trailing loops. The three-dimensional (3D) distribution of BPDs can lead to aggregation of opposite sign edge segments leading to the creation of low angle grain boundaries (LAGBs) characterized by pure basal plane tilt of magnitude determined by the net difference in densities of the opposite sign dislocations. Similar aggregation can also occur against pre-existing prismatic tilt boundaries made up of TED walls with the net difference in densities of the opposite sign dislocations contributing some basal plane tilt character to the LAGB.

Characterization of 100 mm Diameter 4H-Silicon Carbide Crystals with Extremely Low Basal Plane Dislocation Density

2010 ◽  
Vol 645-648 ◽  
pp. 291-294 ◽  
Author(s):  
Michael Dudley ◽  
Ning Zhang ◽  
Yu Zhang ◽  
Balaji Raghothamachar ◽  
Sha Yan Byrapa ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Dislocation Density ◽  
Basal Plane ◽  
X Ray ◽  
Repetitive Process ◽  
Basal Plane Dislocation ◽  
And Behavior ◽  
New Generation ◽  
Edge Dislocations

Synchrotron White Beam X-ray Topography (SWBXT) studies are presented of basal plane dislocation (BPD) configurations and behavior in a new generation of 100mm diameter, 4H-SiC wafers with extremely low BPD densities (3-4 x 102 cm-2). The conversion of non-screw oriented, glissile BPDs into sessile threading edge dislocations (TEDs) is observed to provide pinning points for the operation of single ended Frank-Read sources. In some regions, once converted TEDs are observed to re-convert back into BPDs in a repetitive process which provides multiple BPD pinning points.

scholarly journals Characterization of Screw Dislocations in a 4H-Silicon Carbide Diode Using X-Ray Microbeam Three-Dimensional Topography

2009 ◽  
Vol 615-617 ◽  
pp. 251-254 ◽  
Author(s):  
Ryohei Tanuma ◽  
Tae Tamori ◽  
Yoshiyuki Yonezawa ◽  
Hirotaka Yamaguchi ◽  
Hirofumi Matsuhata ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Strain Field ◽  
Three Dimensional ◽  
Strain Analysis ◽  
Hollow Core ◽  
Screw Dislocations ◽  
X Ray ◽  
Microplasma Breakdown ◽  
Symmetry Break

This paper describes the study of non-hollow-core elementary screw dislocations (SDs) in silicon carbide (SiC) diodes using X-ray microbeam three-dimensional topography. Strain analysis shows that typical screw dislocations having a symmetric strain field tend to cause microplasma breakdown, whereas deformed SDs do not. The symmetry break in SDs will relax the focussing of strain and lessen the formation of defects, thereby leading to the desirable non-leak property.

Characterization of Vacant Broken Line Defects in A-Face Grown Crystals of Silicon Carbide

2014 ◽  
Vol 778-780 ◽  
pp. 386-389
Author(s):  
Naohiro Sugiyama ◽  
Masanori Yamada ◽  
Yasushi Urakami ◽  
Masakazu Kobayashi ◽  
Takashi Masuda ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Basal Plane ◽  
Stable State ◽  
Growth Direction ◽  
Line Defect ◽  
Transmission Electron ◽  
New Type ◽  
Line Defects ◽  
Edge Dislocations

A new type of defects, vacant broken line defects, was found to occur in a-face grown crystals of 4H-Silicon Carbide. We characterized the vacant broken line defects by high voltage transmission electron microscope (HV-TEM). The HV-TEM image revealed that the edges of broken line defects were connected by a bundle of dislocations, which elongated to the growth direction on the basal plane. The analysis by gb method for determining Burgers vector indicated that the dislocations were not pure screw dislocations, but complex of screw and edge dislocations. The vacant broken line defect was considered to be a quasi-stable state of a bundle of basal plane dislocations in a-face growth, similar to a micropipe defect in c-face growth.

Effects of Different Defect Types on the Performance of Devices Fabricated on a 4H-SiC Homoepitaxial Layer

2006 ◽  
Vol 911 ◽  
Author(s):  
Hui Chen ◽  
Balaji Raghothamachar ◽  
William Vetter ◽  
Michael Dudley ◽  
Y. Wang ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Basal Plane ◽  
Schottky Contacts ◽  
Device Performance ◽  
Hollow Core ◽  
Screw Dislocations ◽  
Burgers Vector ◽  
Edge Dislocations ◽  
Sic Wafer ◽  
Koh Etching

AbstractAn 8° off-axis 4H-SiC wafer with circular Schottky contacts fabricated on a CVD grown 4H-SiC homoepitaxial layer was studied to investigate the influence of various defects, including small (closed-core) screw dislocations (Burgers vector of 1c or 2c), hollow-core (micropipes; Burgers vector larger than 2c), threading edge dislocations (from conversion of basal plane dislocations from the substrate into the epilayer), grain boundaries and triangular defects, on the device performance in the form of breakdown voltages. The defects were examined using synchrotron white beam x-ray topography (SWBXT) based techniques and molten KOH etching. The devices commonly contained basal plane dislocations, small screw dislocations and threading edge dislocations, the latter two of which could give rise to low breakdown voltages for the devices. In addition, less commonly observed defects such as micropipes, grain boundaries and triangular defects are much more destructive to device performance than closed-core screw dislocations and threading edge dislocations.

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