Au-Si Eutectic Wafer Bonding Mechanism Analysis and a Intensity Model

2007 ◽  
Vol 121-123 ◽  
pp. 575-578
Author(s):  
X. Wang ◽  
D.C. Zhang ◽  
J. Li ◽  
Z. You ◽  
B. Cai
Keyword(s):  
Wafer Bonding ◽  
Bonding Strength ◽  
Bonding Interface ◽  
Bonding Mechanism ◽  
Mechanism Analysis ◽  
Testing Method ◽  
Different Temperatures ◽  
Intensity Model

Our experiments highlight that gold-silicon eutectics are fairly influenced by the thickness of Au layer and the wastage of Si, i.e. the wasting thickness of the silicon die. In the experiments, a bonding intensity testing method, called Press-arm model, is used to verify the Au-Si eutectics bonding strength. Through the intensity value of the bonding interface, we analyze the eutectics condition of the bonding interface at different temperatures and discuss the optimum procession of the wafer capsulation.

Research on Cold-Rolled Bimetal of High-Tin Aluminum Alloy and Steel

2012 ◽  
Vol 217-219 ◽  
pp. 395-399
Author(s):  
Guo Ming Cui ◽  
Xing Xia Li ◽  
Jian Min Zeng
Keyword(s):  
Aluminum Alloy ◽  
Cold Rolling ◽  
Bonding Strength ◽  
Pure Aluminum ◽  
Bonding Interface ◽  
Recrystallization Annealing ◽  
Bonding Mechanism ◽  
Pressure Welding ◽  
Annealing State ◽  
Cold Pressure

Bimetal of high-tin aluminum alloy and steel was fabricated by cold-rolling process; microstructure, bonding strength and bonding mechanism for bonding interface of the bimetal were investigated under cold-rolling and recrystallization annealing state, respectively. Experimental results indicate that tin phase of bimetal in cold-rolling state shows a belt type distribution, however, it, in recrystallization annealing state, is uniformly distributed just like some “isolated islands”. A well bonding interface, between layers of high–tin aluminum alloy and pure aluminum, can be obtained, and it is difficult to distinguish one layer from the other; but the interface, between layers of low-carbon steel back and pure aluminum, is clear and uneven. And meanwhile, bonding mechanism of bimetal interface, in cold-rolling state, is cold pressure welding and mechanical occluding, But it, in recrystallization annealing state, is cold pressure welding, mechanical occluding, and metallurgic bonding. After recrystallization annealing, at 350°C for 2h,the bonding strength of bimetal approaches to 92.4MPa, which is about 26% higher than that of cold-rolling state.

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

scholarly journals Interfacial Morphology and Bonding Mechanism of Explosive Weld Joints

2021 ◽  
Vol 34 (1) ◽  
Author(s):  
Tingting Zhang ◽  
Wenxian Wang ◽  
Zhifeng Yan ◽  
Jie Zhang
Keyword(s):  
Laminated Composite ◽  
Base Plate ◽  
Sine Wave ◽  
Laminated Plates ◽  
Bonding Interface ◽  
Interfacial Structure ◽  
Bonding Mechanism ◽  
Critical Material ◽  
Interfacial Morphology ◽  
Az31b Alloy

AbstractInterfacial structure greatly affects the mechanical properties of laminated plates. However, the critical material properties that impact the interfacial morphology, appearance, and associated bonding mechanism of explosive welded plates are still unknown. In this paper, the same base plate (AZ31B alloy) and different flyer metals (aluminum alloy, copper, and stainless steel) were used to investigate interfacial morphology and structure. SEM and TEM results showed that typical sine wave, wave-like, and half-wave-like interfaces were found at the bonding interfaces of Al/Mg, Cu/Mg and SS/Mg clad plates, respectively. The different interfacial morphologies were mainly due to the differences in hardness and yield strength between the flyer and base metals. The results of the microstructural distribution at the bonding interface indicated metallurgical bonding, instead of the commonly believed solid-state bonding, in the explosive welded clad plate. In addition, the shear strength of the bonding interface of the explosive welded Al/Mg, Cu/Mg and SS/Mg clad plates can reach up to 201.2 MPa, 147.8 MPa, and 128.4 MPa, respectively. The proposed research provides the design basis for laminated composite metal plates fabrication by explosive welding technology.

scholarly journals The Interfacial Characterization and Performance of Cu/Al-Conductive Heads Processed by Explosion Welding, Cold Pressure Welding, and Solid-Liquid Casting

Metals ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 237 ◽  
Author(s):  
Yanni Wei ◽  
Hui Li ◽  
Fu Sun ◽  
Juntao Zou
Keyword(s):  
Corrosion Resistance ◽  
Bonding Strength ◽  
Explosive Welding ◽  
Slag Inclusion ◽  
Explosion Welding ◽  
Bonding Interface ◽  
Pressure Welding ◽  
And Performance ◽  
Solid Liquid ◽  
Cold Pressure

The Cu/Al composites conductive head is widely used in hydrometallurgy as the core component of cathode plate. Its conductive properties directly affect the power consumption, and the bonding strength and corrosion resistance determine the conductive head service life. The Cu/Al conductive head prepared by explosion welding, cold pressure welding, and solid-liquid casting methods were investigated in this paper. The interface microstructure and compositions were examined by scanning electron microscope and X-ray energy dispersive spectrometry. The bonding strength, interface conductivity, and the corrosion resistance of three types of joints were characterized. The Cu/Al bonding interface produced by explosive welding presented a wavy-like morphology with typical defects and many of brittle compounds. A micro-interlocking effect was caused by the sawtooth structures on the cold pressure welding interface, and there was no typical metallurgical reaction on the interface. The Cu/Al bonding interface prepared by solid-liquid casting consisted mainly of an Al-Cu eutectic microstructure (Al2Cu+Al) and partial white slag inclusion. The thickness of the interface transition layer was about 200–250 µm, with defects such as holes, cracks, and unwelded areas. The conductivity, interfacial bonding strength, and corrosion resistance of the conductive head prepared by explosive welding were superior to the other two.

Experimental Research on Bond Strength between Rebar and Concrete after High Temperature

2011 ◽  
Vol 71-78 ◽  
pp. 1057-1061 ◽  
Author(s):  
Ke Fang Yin ◽  
Yang Han ◽  
Yi Liu
Keyword(s):  
Reinforced Concrete ◽  
High Temperature ◽  
Bond Strength ◽  
Experimental Research ◽  
Bonding Strength ◽  
Different Temperatures ◽  
Ultimate Bond Strength

With the centrally pulling-out test, the bond strength of reinforced concrete is measured with different temperatures and different cooling ways after high temperature; and the ultimate bond strength and slip of reinforced and concrete under different conditions are analyzed. The results show that the bonding strength declines gradually with the increase of temperature, and the ultimate slippage also decreases gradually.

Silicon Wafer Bonding Mechanism for Silicon-on-Insulator Structures

1990 ◽  
Vol 29 (Part 2, No. 12) ◽  
pp. L2311-L2314 ◽  
Author(s):  
Takao Abe ◽  
Tokio Takei ◽  
Atsuo Uchiyama ◽  
Katsuo Yoshizawa ◽  
Yasuaki Nakazato
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding ◽  
Silicon On Insulator ◽  
Bonding Mechanism

Fracture Mechanism Analysis of Mg-9Gd-4Y-0.6Zr Alloy

2007 ◽  
Vol 546-549 ◽  
pp. 261-266 ◽  
Author(s):  
Xin Ming Zhang ◽  
Yang Xiao
Keyword(s):  
Cleavage Fracture ◽  
Shear Fracture ◽  
Grain Boundary Sliding ◽  
Fracture Mechanisms ◽  
Slip Systems ◽  
Mechanism Analysis ◽  
Pyramidal Slip ◽  
Local Areas ◽  
Different Temperatures ◽  
Boundary Sliding

The fractographs of Mg-9Gd-4Y-0.6Zr alloy specimens which were tensioned at different temperatures were investigated by optical and scanning electron microscopy, respectively. The results showed that different slip systems were activated at different temperatures, which were responsible for varied deformation mechanisms and fracture mechanisms. At 25 °C, the enabled slip systems were few and only the slip systems on basal plane were able to be activated, so cleavage fracture was observed. At −196°Cthe number of enabled slip systems increased, prismatic or pyramidal slip maybe occurred, so that an obvious low-temperature plasticity was observed, while fracture mechanisms were mainly microvoid coalescence fracture with cleavage fracture in local areas. At 250 °C, 300 °C and 350 °C, the multisystem slips on the basal planes, the prismatic planes and the pyramidal planes were able to be activated, while fracture mechanisms were also microviod coalescence fracture. At 400 °C, recrystallization happened, grain-boundary sliding in new fine recrystallized grains made the plastic deformation easy, showing coarse-grain superplasticity phenomenon, and an intergranular shear fracture took place.

Mesoscopic damage evolution on bonding interface and its influence on macroscopic performance deterioration of reinforced concrete member

2019 ◽  
Vol 08 (02) ◽  
pp. 1950005
Author(s):  
Ying Wang ◽  
Yuqian Zheng ◽  
Xuan Wang
Keyword(s):  
Reinforced Concrete ◽  
Bonding Strength ◽  
Element Model ◽  
Bonding Interface ◽  
Interfacial Damage ◽  
Concrete Member ◽  
Steel Bar ◽  
Reinforced Concrete Member ◽  
Bonding Property ◽  
Performance Deterioration

Slip or debonding of bonding interface is the key cause of the performance degradation or failure of the reinforced concrete (RC) member. In this paper, based on Monte Carlo method, a mesoscopic finite element model composed of mortar, coarse aggregate and steel rebar was established to consider the mesoscopic damage on the bonding interface and its influence on macroscopic performance deterioration of RC specimen. The results show that the simulation results fit well with experimental data. Higher initial interfacial damage results in lower bonding strength and smaller final displacement. Higher mortar modulus could greatly improve the initial bonding property and bonding strength, but slightly increase the final damage. Compared with the RC specimen model with plain steel bar, the model with deformed steel bar shows a longer duration of nonlinear increase for drawing force and lower bonding strength. When confinement is applied, the coalescence of damage zones is prevented due to the effect of thread. Therefore, the application of confinement could increase the bonding strength and the initial bonding property.

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