Research on Cold-Rolled Bimetal of High-Tin Aluminum Alloy and Steel

Bimetal of high-tin aluminum alloy and steel was fabricated by cold-rolling process; microstructure, bonding strength and bonding mechanism for bonding interface of the bimetal were investigated under cold-rolling and recrystallization annealing state, respectively. Experimental results indicate that tin phase of bimetal in cold-rolling state shows a belt type distribution, however, it, in recrystallization annealing state, is uniformly distributed just like some “isolated islands”. A well bonding interface, between layers of high–tin aluminum alloy and pure aluminum, can be obtained, and it is difficult to distinguish one layer from the other; but the interface, between layers of low-carbon steel back and pure aluminum, is clear and uneven. And meanwhile, bonding mechanism of bimetal interface, in cold-rolling state, is cold pressure welding and mechanical occluding, But it, in recrystallization annealing state, is cold pressure welding, mechanical occluding, and metallurgic bonding. After recrystallization annealing, at 350°C for 2h,the bonding strength of bimetal approaches to 92.4MPa, which is about 26% higher than that of cold-rolling state.

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The Interfacial Characterization and Performance of Cu/Al-Conductive Heads Processed by Explosion Welding, Cold Pressure Welding, and Solid-Liquid Casting

Metals ◽

10.3390/met9020237 ◽

2019 ◽

Vol 9 (2) ◽

pp. 237 ◽

Cited By ~ 3

Author(s):

Yanni Wei ◽

Hui Li ◽

Fu Sun ◽

Juntao Zou

Keyword(s):

Corrosion Resistance ◽

Bonding Strength ◽

Explosive Welding ◽

Slag Inclusion ◽

Explosion Welding ◽

Bonding Interface ◽

Pressure Welding ◽

And Performance ◽

Solid Liquid ◽

Cold Pressure

The Cu/Al composites conductive head is widely used in hydrometallurgy as the core component of cathode plate. Its conductive properties directly affect the power consumption, and the bonding strength and corrosion resistance determine the conductive head service life. The Cu/Al conductive head prepared by explosion welding, cold pressure welding, and solid-liquid casting methods were investigated in this paper. The interface microstructure and compositions were examined by scanning electron microscope and X-ray energy dispersive spectrometry. The bonding strength, interface conductivity, and the corrosion resistance of three types of joints were characterized. The Cu/Al bonding interface produced by explosive welding presented a wavy-like morphology with typical defects and many of brittle compounds. A micro-interlocking effect was caused by the sawtooth structures on the cold pressure welding interface, and there was no typical metallurgical reaction on the interface. The Cu/Al bonding interface prepared by solid-liquid casting consisted mainly of an Al-Cu eutectic microstructure (Al2Cu+Al) and partial white slag inclusion. The thickness of the interface transition layer was about 200–250 µm, with defects such as holes, cracks, and unwelded areas. The conductivity, interfacial bonding strength, and corrosion resistance of the conductive head prepared by explosive welding were superior to the other two.

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Atomic level bonding mechanism in steel/aluminum joints produced by cold pressure welding

Materialia ◽

10.1016/j.mtla.2019.100396 ◽

2019 ◽

Vol 7 ◽

pp. 100396 ◽

Cited By ~ 3

Author(s):

Nicolas J. Peter ◽

Christiane Gerlitzky ◽

Abdulrahman Altin ◽

Simon Wohletz ◽

Waldemar Krieger ◽

...

Keyword(s):

Atomic Level ◽

Bonding Mechanism ◽

Pressure Welding ◽

Cold Pressure

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Effects of Ce-Rich Mischmetal on Microstructure Evolution and Mechanical Properties of 5182 Aluminum Alloy

Materials ◽

10.3390/ma12244230 ◽

2019 ◽

Vol 12 (24) ◽

pp. 4230

Author(s):

Tianhao Gong ◽

Junhui Dong ◽

Zhiming Shi ◽

Xinba Yaer ◽

Huimin Liu

Keyword(s):

Mechanical Properties ◽

Tensile Strength ◽

Aluminum Alloy ◽

Cold Rolling ◽

Microstructure Evolution ◽

Recrystallization Annealing ◽

Al Alloy ◽

Cold Rolled ◽

Particle Strengthening ◽

Grain Refinement Strengthening

This paper addresses the effects of Ce-rich mischmetal on the microstructure evolution of a 5182 aluminum alloy during annealing and rolling processes. The Ce-rich mischmetal was added to an as-cast 5182 aluminum alloy in an induction furnace, and this was followed by homogenized annealing at 450 °C for 24 h and a rolling operation. The microstructure evolution and mechanical properties’ analysis of the 5182 Al alloy were characterized. The results show that the Ce-rich mischmetal could modify the microstructure, refine the α-Al grains, break the network distribution of Mg2Si phases, and prevent Cr and Si atoms from diffusing into the Al6(Mn, Fe) phase in the as-cast 5182 Al alloys. Ce-rich mischmetal elements were also found to refine the Al6(Mn, Fe) phase after cold rolling. Then, the refined Al6(Mn, Fe) particles inhibited the growth of recrystallization grains to refine them from 10.01 to 7.18 μm after cold rolling. Consequently, the tensile strength of the cold-rolled 5182 Al alloy increased from 414.65 to 454.34 MPa through cell-size strengthening, dislocation density strengthening, and particle strengthening. The tensile strength of the recrystallization annealed 5182 Al alloy was increased from 322.16 to 342.73 MPa through grain refinement strengthening, and this alloy was more stable after the recrystallization annealing temperature.

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A Bonding Map for Cu and Al Plates by Pressure Welding at Cold and Warm Temperatures

Materials Science Forum ◽

10.4028/www.scientific.net/msf.475-479.2667 ◽

2005 ◽

Vol 475-479 ◽

pp. 2667-2670 ◽

Cited By ~ 3

Author(s):

K.-S. Sim ◽

Yong Sin Lee

Keyword(s):

Surface Roughness ◽

Bonding Strength ◽

Room Temperature ◽

Holding Time ◽

Bonding Mechanism ◽

Warm Temperature ◽

Pressure Welding ◽

Temperature Ranges ◽

Welding Pressure ◽

Bonding Characteristics

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm formings such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to 200°C. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of 1MPa , is proposed in terms of welding pressure and surface roughness for the cold and warm temperature ranges.

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Processing 20 Ply Clad Plate by Accumulative Clad Rolling from Stainless Steel/Aluminum/Aluminum Alloy…/Stainless Steel Sheets

Materials Science Forum ◽

10.4028/www.scientific.net/msf.610-613.454 ◽

2009 ◽

Vol 610-613 ◽

pp. 454-458

Author(s):

Yu Hua Pang ◽

Jia Wei Yuan ◽

Qi Sun ◽

Yang Lei Hu

Keyword(s):

Stainless Steel ◽

Aluminum Alloy ◽

Austenitic Stainless Steel ◽

Bonding Strength ◽

Pure Aluminum ◽

Rare Metal ◽

Interface Composition ◽

Steel Sheets ◽

Clad Sheet ◽

Electrical Conductivities

According to the principle of accumulative roll bonding(ARB),the 20 ply clad sheet from austenitic stainless steel (STS304)/pure aluminum(Al1060)/aluminum alloy(Al3003) …/ austenitic stainless steel (STS304)sheets with excellent heat, anti-corrosion and mechanical properties of stainless steel and the high thermal and electrical conductivities of aluminum was fabricated by accumulative clad rolling (ACR). Well-bonded clad plate was successfully obtained in the procedure: Al1060 sheets with a thickness of 0.5mm and Al3003 sheets 0.5mm thick and STS304 sheets 0.5mm thick were employed. Basic clad sheet from different ply Al1060/Al3003 sheets was obtained with an initial rolling reduction of 44% at 450°C followed by annealing at 300°C, then ACR was with reduction of 50% at 550°C from STS304 on each side. The stretch property, bonding property, microscopic structure and interface composition were measured and analyzed. It was indicated that the best clad sheet had bonding strength of 129MPa and stretch strength of 225MPa. was of 129Mpa bonding strength and 225Mpa stretch strength. At the end,STS304 sheet with thickness of 3mm which being used in superior quality kitchenware and finishing material and so on was taken the place of the clad sheet from STS304 sheets of 1mm and Al1060 of 1mm and Al3003 of 1mm. Therefore, it decreased by 44% in weight and economizes rare metal elements Cr and Ni of 66% in weight.

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Multilayered 5052 aluminum alloy/titanium composites fabricated by cold pressure welding.

Journal of Japan Institute of Light Metals ◽

10.2464/jilm.51.157 ◽

2001 ◽

Vol 51 (3) ◽

pp. 157-162 ◽

Cited By ~ 2

Author(s):

Yoshio OKUMURA ◽

Shigeoki SAJI ◽

Hiroshi ANADA ◽

Masayuki YOKOI ◽

Orie SHINOHARA

Keyword(s):

Aluminum Alloy ◽

Pressure Welding ◽

Cold Pressure ◽

Alloy Titanium

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Au-Si Eutectic Wafer Bonding Mechanism Analysis and a Intensity Model

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.121-123.575 ◽

2007 ◽

Vol 121-123 ◽

pp. 575-578

Author(s):

X. Wang ◽

D.C. Zhang ◽

J. Li ◽

Z. You ◽

B. Cai

Keyword(s):

Wafer Bonding ◽

Bonding Strength ◽

Bonding Interface ◽

Bonding Mechanism ◽

Mechanism Analysis ◽

Testing Method ◽

Different Temperatures ◽

Intensity Model

Our experiments highlight that gold-silicon eutectics are fairly influenced by the thickness of Au layer and the wastage of Si, i.e. the wasting thickness of the silicon die. In the experiments, a bonding intensity testing method, called Press-arm model, is used to verify the Au-Si eutectics bonding strength. Through the intensity value of the bonding interface, we analyze the eutectics condition of the bonding interface at different temperatures and discuss the optimum procession of the wafer capsulation.

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Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100065079 ◽

1971 ◽

Vol 29 ◽

pp. 204-205

Author(s):

G. G. Shaw

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Aluminum Alloy ◽

Electron Beam ◽

Pure Aluminum ◽

Ion Milling ◽

Transmission Electron ◽

Fiber Matrix ◽

Ion Erosion ◽

Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

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