Thermal Cycling Analysis of BGA Solder Joint Reliability

The solder joint reliability of semiconductor package interconnects is critical to product durability. A dominant failure mode is solder fatigue due to the CTE mismatch between BGA component and PCB at thermal cycling. It is well known that besides thermal expansion mismatch of component and board, the solder joint geometry has a great impact on fatigue behavior and time to failure. In this study, a combination of Surface Evolver and finite element analysis are use to predict the solder joint shapes for the assembly of medium pin count BGA's and to estimate the reliability at accelerated temperature cycling conditions. Results of Surface Evolver are compared with the assumption of a truncated sphere. The solder shape predictions are applied for a subsequent thermo-mechanical analysis of the BGA assembly. Inelastic creep deformation is evaluated for critical solder balls, and the Coffin-Manson relation is used to estimate the solder joint lifetime. The entire simulation procedure will be demonstrated for a product design study for high reliability automotive BGA's. A fractional factorial design is defined that considers solder sphere diameter and solder pad sizes on BGA substrate and on PCB side. Resulting creep values and lifetime estimates will be compared.

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Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896911 ◽

2017 ◽

Cited By ~ 4

Author(s):

Unique Rahangdale ◽

Rahul Srinivas ◽

S. Krishnamurthy ◽

Pavan Rajmane ◽

Abel Misrak ◽

...

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Power Cycling

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Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling

Microelectronics Reliability ◽

10.1016/j.microrel.2005.12.001 ◽

2006 ◽

Vol 46 (8) ◽

pp. 1348-1356 ◽

Cited By ~ 10

Author(s):

H.T. Chen ◽

C.Q. Wang ◽

M.Y. Li

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Experimental Analysis ◽

Solder Joint Reliability ◽

Joint Reliability

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Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419505 ◽

2018 ◽

Cited By ~ 3

Author(s):

Jyotirmoy Denria ◽

Pavan Rajmane ◽

Dereje Agonafer

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Reliability Assessment ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Assessment Study ◽

Power Cycling ◽

Board Level

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Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

Lead-free Solders ◽

10.1520/stp49323s ◽

2011 ◽

pp. 74-74-15 ◽

Cited By ~ 1

Author(s):

Weiqiang Wang ◽

Michael Osterman ◽

Diganta Das ◽

Michael Pecht

Keyword(s):

Solder Joint ◽

Temperature Cycling ◽

Lead Frame ◽

Solder Joint Reliability ◽

Joint Reliability

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Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

ASME 2009 InterPACK Conference, Volume 2 ◽

10.1115/interpack2009-89019 ◽

2009 ◽

Cited By ~ 1

Author(s):

Kanji Takagi ◽

Qiang Yu ◽

Tadahiro Shibutani ◽

Hiroki Miyauchi

Keyword(s):

Surface Tension ◽

Solder Joint ◽

High Reliability ◽

Electronic Components ◽

Reflow Process ◽

Solder Joint Reliability ◽

Automotive Electronic ◽

Joint Reliability ◽

On Chip ◽

Joint Shape

The miniaturization and high reliability for automotive electronic components has been strongly requested. Generally, electronic component and printed wiring board are connected using solder joint. The reliability of solder joint has widely dispersion. For the dispersion reduction of solder joint reliability, not only design factors but manufacturing factors should be optimized. The evaluation of manufacturing factors for solder joint reliability was very difficult by experimental evaluation alone. Therefore, the reflow process simulation was established. The simulation was reenacted soldering process on chip component, which was the most severe reliability in automotive electronic components. The novelty of simulation was the coupled analysis of flow and rigid for simulating self-alignment of chip component. In this simulation, contact angle and surface tension was very important factor. So, these characteristics were measured based on Spread test and Wetting balance tests using the specimens. In the result, the solder joint shape of analysis was agree with the one of specimens using the measured contact angle and surface tension. Next, the effect of manufacturing process dispersion for solder joint shape was evaluated. The factors were mount offset and length unbalance of electrodes on chip component. As a result, the mount offset was not affected solder joint shape of chip component until a certain level. Also, the unbalance of electrode of chip component was not almost affected for solder joint shape of chip component because a part was moved to the center of part by surface tension of solder joint. Finally, the relation between the estimated solder joint shape and fatigue life of solder joints is evaluated using crack propagation analysis based on Manson-Coffin’s law and Miner’s rule. When the value of mount offset was large, the crack propagation mode was changed and the fatigue life of solder joint was decreased. As mentioned above, it was able to evaluate the relation between manufacturing factors and solder joint reliability. Accordingly, this simulation was very useful for consideration on the miniaturization, high reliability and appropriate margin for design of electronic components.

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