Potential of Zn-Al Solder Alloy for High Temperature SiC Power Module

Abstract We are developing SiC power module which can operate at high temperature. At present, SiC devices are attached by Au-Ge eutectic solder. In terms of cost, we are considering using Zn-Al solder instead of Au-Ge eutectic solder. For Zn-Al solder, joint reliability is reported for a small area bonding such as device connection. However, as far as we know, there is no report on the bonding reliability of large area such as base plate and substrate. Therefore, we report crack propagation by thermal cycle test on solder thickness.

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Physics-of-Failure Design-for-Reliability of a Bidirectional Multi-Output DC-DC Power Converter

2010 14th International Heat Transfer Conference, Volume 3 ◽

10.1115/ihtc14-23040 ◽

2010 ◽

Author(s):

Vibhash Jha ◽

F. Patrick McCluskey

Keyword(s):

Solder Joint ◽

Heat Sink ◽

Thermal Cycle ◽

Power Converter ◽

Power Module ◽

Solder Joint Reliability ◽

Physics Of Failure ◽

Design For Reliability ◽

Joint Reliability ◽

Dc Power

The design of a prototype power converter was evaluated and improved using the physics-of-failure based design-for-reliability approach. Thermal simulation of the power module board with the heat sink has been carried out and these results have been used further for estimating the overall thermal cycle reliability. The solder joint reliability has been investigated using two different kinds of solders — SnAgCu (SAC305) and SnPb eutectic solder.

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Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2380-4491-2018-hiten-000028 ◽

2018 ◽

Vol 2018 (HiTEC) ◽

pp. 000028-000031 ◽

Cited By ~ 1

Author(s):

Fumiki Kato ◽

Hiroki Takahashi ◽

Hidekazu Tanisawa ◽

Kenichi Koui ◽

Shinji Sato ◽

...

Keyword(s):

Thermal Analysis ◽

Thermal Resistance ◽

Thermal Cycle ◽

Base Plate ◽

Test Machine ◽

Power Module ◽

Eutectic Solder ◽

Transient Thermal Analysis ◽

The Individual ◽

Transient Thermal

Abstract In this paper, we demonstrate that the structural degradation of a silicon carbide (SiC) power module corresponding to thermal cycles can be detected and tracked non-destructively by transient thermal analysis method. The purpose of this evaluation is to analyze the distribution of the thermal resistance in the power module and to identify the structure deterioration part. The power module with SiC-MOSFET were assembled using ZnAl eutectic solder as device under test. The individual thermal resistance of each part such as the SiC-die, the die-attachment, the AMCs, and the baseplate was successfully evaluated by analyzing the structure function graph. A series of thermal cycle test between −40 and 250°C was conducted, and the power modules were evaluated their thermal resistance taken out from thermal cycle test machine at 100, 200, 500 and 1000 cycles. We confirmed the increase in thermal resistance between AMCs and base plate in each thermal cycle. The portion where the thermal resistance increased is in good agreement with the location of the structural defect observed by scanning acoustic tomography (SAT) observation.

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