The Tamessa project: a practical application of a 225°C multilayer PCB/SMT/COB system
Abstract The Tamessa project has developed a high-temperature, multilayer, Printed Circuit Board and component assembly process that is capable of withstanding 225°C operating temperatures in a non-hermetic environment. This paper describes the practical application of this project's work to the electronic interface for a high temperature pressure sensor. The PCB used in Tamessa has been made from novel materials and the Surface Mount Technology (SMT) component attach process is a solder-less process that uses an adhesive. Additionally, the project has developed and proved a Chip on Board (COB) system. The combination has enabled the development of a complete assembly system that has been shown to withstand temperature excursions up to 250°C in a non-hermetic environment. The successful application to a pressure sensor, designed to resist temperatures of 210°C, was a further test to demonstrate its practical capability in a real-life situation.