Thermally Conductive Plastics for Enhanced Thermal Management

2015 ◽  
Vol 2015 (1) ◽  
pp. 000530-000535
Author(s):  
Chandrashekar Raman
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Thermal Management ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Significant Challenge ◽  
Design Engineers ◽  
Thermally Conductive ◽  
New Material ◽  
Conductive Plastics

Electronic devices continue to shrink while continuing to offer increasing functionality. This trend poses a significant challenge to design engineers who need to adequately address the increasing thermal management requirements of these devices on a shrinking footprint. Thermally conductive plastics have been gaining attention as an innovative new material option to address this challenge. While plastics are typically poor conductors of heat, it is possible to increase the thermal conductivity with the use of certain additives. Unique ceramic additives like boron nitride offer the added advantage of enabling thermally conductive plastic formulations that are also electrically insulating. The replacement of aluminum heat sinks in free (natural) convection environments with thermally conductive plastics is discussed in this paper. The results show it may indeed be possible to replace aluminum with thermally conductive plastic heat sinks in convection limited environments, and if judicious redesign of the plastic heat sink is incorporated, an improved thermal management solution can be realized. Additionally, the benefits of enhancing existing plastic housings to enable an improved thermal management solution are discussed. The results also show that modest enhancements to the thermal conductivity of existing plastic housings can yield significant improvements to the overall thermal management solution as well.

Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

scholarly journals Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3634
Author(s):  
John M. Hutchinson ◽  
Sasan Moradi
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Filler Content ◽  
Electronic Devices ◽  
Cure Kinetics ◽  
The Matrix ◽  
Thermally Conductive ◽  
Filler Particles ◽  
Kinetics Of

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

scholarly journals A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1312
Author(s):  
Yeon Ju Kwon ◽  
Jung Bin Park ◽  
Young-Pyo Jeon ◽  
Jin-Yong Hong ◽  
Ho Seok Park ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Polymer Composite ◽  
Management System ◽  
Electronic Devices ◽  
Electrical Insulation ◽  
Thermal Management System ◽  
Thermally Conductive ◽  
Carbon Fillers

With the development of microelectronic devices having miniaturized and integrated electronic components, an efficient thermal management system with lightweight materials, which have outstanding thermal conductivity and processability, is becoming increasingly important. Recently, the use of polymer-based thermal management systems has attracted much interest due to the intrinsic excellent properties of the polymer, such as the high flexibility, low cost, electrical insulation, and excellent processability. However, most polymers possess low thermal conductivity, which limits the thermal management applications of them. To address the low thermal conduction of the polymer materials, many kinds of thermally conductive fillers have been studied, and the carbon-based polymer composite is regarded as one of the most promising materials for the thermal management of the electric and electronic devices. In addition, the next generation electronic devices require composite materials with various additional functions such as flexibility, low density, electrical insulation, and oriented heat conduction, as well as ultrahigh thermal conductivity. In this review, we introduce the latest papers on thermally conductive polymer composites based on carbon fillers with sophisticated structures to meet the above requirements. The topic of this review paper consists of the following four contents. First, we introduce the design of a continuous three-dimensional network structure of carbon fillers to reduce the thermal resistance between the filler–matrix interface and individual filler particles. Second, we discuss various methods of suppressing the electrical conductivity of carbon fillers in order to manufacture the polymer composites that meet both the electrical insulation and thermal conductivity. Third, we describe a strategy for the vertical alignment of carbon fillers to improve the through-plane thermal conductivity of the polymer composite. Finally, we briefly mention the durability of the thermal conductivity performance of the carbon-based composites. This review presents key technologies for a thermal management system of next-generation electronic devices.

Extraordinary Thermal Conductivity of Graphene: Prospects of Thermal Management Applications

2010 ◽  
Author(s):  
Suchismita Ghosh ◽  
Denis L. Nika ◽  
Evgenni P. Pokatilov ◽  
Irene Calizo ◽  
Alexander A. Balandin
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Phonon Scattering ◽  
Electronic Devices ◽  
Measurement Procedure ◽  
Two Dimensions ◽  
Heat Sinks ◽  
Spectral Position ◽  
Graphene Flakes ◽  
Integrated Intensity

We have recently discovered experimentally that suspended graphene, which is an individual sheet of sp2-hybridized carbon bound in two dimensions (2D), reveal an extremely high thermal conductivity. The measurements were performed using a non-contact optical technique developed by us on the basis of Raman spectroscopy. A large number of graphene flakes were suspended across trenches in Si wafers and attached to heat sinks. The flakes were heated by the focused laser light in the middle of the suspended portion of graphene. The amount of laser power dissipated in graphene and corresponding local temperature rise were determined from the integrated intensity and spectral position of graphene’s Raman G mode. The position of the G peak as a function of the sample temperature was measured independently allowing the use of micro-Raman spectrometer as a “thermometer”. The experimental thermal conductivity values were in the range of ∼ 3000–5300 W/mK near room temperature (RT) and depended on the graphene flake sizes. The thermal conductivity of graphene is the highest among all materials known to date. In this review work we will describe the details of our measurement procedure and explain theoretically why the 2D thermal conductivity of graphene is higher than that of bulk graphite provided that the size of graphene flakes is sufficiently large. Our theory, which includes the phonon-mode dependent Gruneisen parameter and phonon scattering on edges and defects, gives results, which are in excellent agreement with the experiment. Superior thermal properties of graphene are beneficial for the proposed graphene electronic devices, and may pave the way for graphene’s thermal management applications.

scholarly journals Measurements of Aluminum-Annealed Pyrolytic Graphite Composite Baseplates with Improved Thermal Conductivity

2021 ◽  
Vol 16 (2) ◽  
pp. 042-047
Author(s):  
Yanfei Bian ◽  
SHI Jian-zhou ◽  
XIE Ming-jun ◽  
CAI Meng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Management ◽  
Pure Aluminum ◽  
Pyrolytic Graphite ◽  
Aluminum Plate ◽  
Graphite Composite ◽  
Conductive Composites ◽  
Thermal Potential ◽  
Thermally Conductive

Annealed pyrolytic graphite (APG) is a material with thermal conductivity of about 1500 W/(m·K). This property may enable the usage of APG’s thermal potential to develop highly thermally conductive composites for devices requiring effective thermal management. In this paper, APG has been encapsulated in aluminum by brazing, and the thermal properties of Al-APG composite baseplates were measured. The results show that the thermal conductivity of the Al-APG composite baseplates is about 620 W/(m·K), which is four times higher than the pure aluminum plate (152 W/(m·K)).

Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Three Dimensional ◽  
Heat Removal ◽  
Interconnected Network ◽  
Microelectronic Devices ◽  
Thermally Conductive

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.

scholarly journals Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

2017 ◽  
Vol 35 (2) ◽  
pp. 382-389 ◽  
Author(s):  
Lukasz Jarosinski ◽  
Andrzej Rybak ◽  
Karolina Gaska ◽  
Grzegorz Kmita ◽  
Renata Porebska ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Graphene Nanoplatelets ◽  
Electrical Insulation ◽  
Graphene Nanocomposites ◽  
Thermally Conductive ◽  
Conductive Particles ◽  
Proper Performance ◽  
Enhanced Thermal Conductivity

Abstract Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

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