Extraordinary Thermal Conductivity of Graphene: Prospects of Thermal Management Applications

2010 ◽  
Author(s):  
Suchismita Ghosh ◽  
Denis L. Nika ◽  
Evgenni P. Pokatilov ◽  
Irene Calizo ◽  
Alexander A. Balandin
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Phonon Scattering ◽  
Electronic Devices ◽  
Measurement Procedure ◽  
Two Dimensions ◽  
Heat Sinks ◽  
Spectral Position ◽  
Graphene Flakes ◽  
Integrated Intensity

We have recently discovered experimentally that suspended graphene, which is an individual sheet of sp2-hybridized carbon bound in two dimensions (2D), reveal an extremely high thermal conductivity. The measurements were performed using a non-contact optical technique developed by us on the basis of Raman spectroscopy. A large number of graphene flakes were suspended across trenches in Si wafers and attached to heat sinks. The flakes were heated by the focused laser light in the middle of the suspended portion of graphene. The amount of laser power dissipated in graphene and corresponding local temperature rise were determined from the integrated intensity and spectral position of graphene’s Raman G mode. The position of the G peak as a function of the sample temperature was measured independently allowing the use of micro-Raman spectrometer as a “thermometer”. The experimental thermal conductivity values were in the range of ∼ 3000–5300 W/mK near room temperature (RT) and depended on the graphene flake sizes. The thermal conductivity of graphene is the highest among all materials known to date. In this review work we will describe the details of our measurement procedure and explain theoretically why the 2D thermal conductivity of graphene is higher than that of bulk graphite provided that the size of graphene flakes is sufficiently large. Our theory, which includes the phonon-mode dependent Gruneisen parameter and phonon scattering on edges and defects, gives results, which are in excellent agreement with the experiment. Superior thermal properties of graphene are beneficial for the proposed graphene electronic devices, and may pave the way for graphene’s thermal management applications.

Thermally Conductive Plastics for Enhanced Thermal Management

2015 ◽  
Vol 2015 (1) ◽  
pp. 000530-000535
Author(s):  
Chandrashekar Raman
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Thermal Management ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Significant Challenge ◽  
Design Engineers ◽  
Thermally Conductive ◽  
New Material ◽  
Conductive Plastics

Electronic devices continue to shrink while continuing to offer increasing functionality. This trend poses a significant challenge to design engineers who need to adequately address the increasing thermal management requirements of these devices on a shrinking footprint. Thermally conductive plastics have been gaining attention as an innovative new material option to address this challenge. While plastics are typically poor conductors of heat, it is possible to increase the thermal conductivity with the use of certain additives. Unique ceramic additives like boron nitride offer the added advantage of enabling thermally conductive plastic formulations that are also electrically insulating. The replacement of aluminum heat sinks in free (natural) convection environments with thermally conductive plastics is discussed in this paper. The results show it may indeed be possible to replace aluminum with thermally conductive plastic heat sinks in convection limited environments, and if judicious redesign of the plastic heat sink is incorporated, an improved thermal management solution can be realized. Additionally, the benefits of enhancing existing plastic housings to enable an improved thermal management solution are discussed. The results also show that modest enhancements to the thermal conductivity of existing plastic housings can yield significant improvements to the overall thermal management solution as well.

Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

scholarly journals Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3634
Author(s):  
John M. Hutchinson ◽  
Sasan Moradi
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Filler Content ◽  
Electronic Devices ◽  
Cure Kinetics ◽  
The Matrix ◽  
Thermally Conductive ◽  
Filler Particles ◽  
Kinetics Of

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

Enhanced Thermal Performance of Internal Y-Shaped Bifurcation Microchannel Heat Sinks With Metal Foams

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Han Shen ◽  
Xueting Liu ◽  
Hongbin Yan ◽  
Gongnan Xie ◽  
Bengt Sunden
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
Metal Foam ◽  
Electronic Devices ◽  
Metal Foams ◽  
Heat Sinks ◽  
High Power Density ◽  
Pore Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area, and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

Enhancement of Thermal Conductivity of Polyvinyl Alcohol Membrane Using Nano-fiber

MRS Advances ◽  
2017 ◽  
Vol 2 (58-59) ◽  
pp. 3651-3656 ◽  
Author(s):  
Xiandong Chen ◽  
Meng An ◽  
Rulei Guo ◽  
Ni Tang ◽  
Zhan Peng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polyvinyl Alcohol ◽  
Heat Dissipation ◽  
Phonon Scattering ◽  
Electronic Devices ◽  
Electrospinning Process ◽  
Omega Method ◽  
Nano Fiber ◽  
3 Omega ◽  
3 Omega Method

ABSTRACTThe thermal properties of organic membranes attract much attention due to the fact that heat dissipation in electronic devices limits their functionality and reliability. Here, we enhance the thermal conductivity of polyvinyl alcohol (PVA) membrane using nano-fibers fabricated by electrospinning. Measured by the 3-Omega method, the results show that the effective thermal conductivity of the electrospinning membranes (with/without Cu nanoparticles) are as high as 0.7 W/m-K at room temperature which is as twice as the value of thermal conductivity of amorphous spin-coated PVA membrane (0.35 W/m-K). The mechanism of enhancement are that, compared with amorphous membrane, the phonon scattering is attenuated and the crystallinity is improved in the electrospinning process. Our studies bring new insights in designing new kind of membrane with high thermal conductivity.

scholarly journals Experimental analysis of effect of base with different inner geometries filled nano PCM for the thermal performance of the plate fin heat sink

2021 ◽  
pp. 243-243
Author(s):  
Periyannan Lakshmanan ◽  
Saravanan Periyasamy ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Reynolds Number ◽  
Phase Shift ◽  
Experimental Research ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Base Plate ◽  
Heat Sinks

Experimental research demonstrates the performance of electronic devices on plate fin heat sinks in order to guarantee that operating temperatures are kept as low as possible for reliability. Paraffin wax (PCM) is a substance that is used to store energy and the aluminum plate fin cavity base is chosen as a Thermal Conductivity Enhancer (TCEs). The effects of PCM material (Phase shift material), cavity form base (Rectangular, Triangular, Concave and Convex) with PCM, Reynolds number (Re= 4000-20000) on heat transfer effectiveness of plate fin heat sinks were experimentally explored in this research. The thermal performance of concave base plate fin heat sink with PCM is increased up to 7.8% compared to other cavity base heat sinks.

High Thermal Conductivity Graphite Copper Composites with Diamond Coatings for Thermal Management Packaging Applications

1995 ◽  
Vol 390 ◽  
Author(s):  
Chris H. Stoessel ◽  
C. Pan ◽  
J. C. Withers ◽  
D. Wallace ◽  
R. O. Loutfy
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Graphite Fiber ◽  
Fiber Reinforced ◽  
Cathode Sputtering ◽  
Large Expansion ◽  
Thermal Conductivities

ABSTRACTHigh thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. Heat sinks in industrial semiconductor application have thermal conductivities generally less than 180 W/mK, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology of producing graphite fiber reinforced copper (Cf/Cu) composite has been developed that produced thermal conductivities up to 454 W/mK utilizing a K=640 W/mK fiber reinforcement (with a potential for 800 W/mK when utilizing a K = 1100 W/mK P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80 %. In heat sink applications, where the electrical conductivity of the graphite fiber reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity and acts as a heat spreader.

Composites based on thermally hyper-conductive vapor grown carbon fiber

1995 ◽  
Vol 10 (6) ◽  
pp. 1478-1484 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake ◽  
David R. Duffy
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Carbon Fibers ◽  
Electronic Devices ◽  
Aluminum Matrix ◽  
Aluminum Matrix Composites ◽  
Carbon Composites ◽  
Matrix Composites ◽  
A Value

Aluminum matrix composites and carbon/carbon composites based on vapor grown carbon fiber (VGCF) were fabricated for analysis of thermophysical properties. Due to the highly graphitic nature of VGCF, the resulting composites exhibit values of thermal conductivity that have not been achieved by using any other carbon fibers, and thus represent new materials for thermal management in applications such as packaging for high-power, high-density electronic devices. In the aluminum matrix VGCF composites, a thermal conductivity of 642 W/m-K was obtained by using a VGCF loading of only 36.5 vol.%. For VGCF/C composites, thermal conductivity of 910 W/m-K has been observed, a value which is more than a factor of two higher than that of copper. Based on the observed thermal conductivity of VGCF/Al composites and VGCF/C composites, the room temperature thermal conductivity of VGCF in the composite was calculated to be 1460 W/m-K and 1600 W/m-K, respectively.

Sign in / Sign up

Export Citation Format

Share Document