Sandwich Structured Power Module for High Temperature SiC Power Semiconductor Devices

2014 ◽  
Vol 2014 (1) ◽  
pp. 000757-000762 ◽  
Author(s):  
Takeshi ANZAI ◽  
Yoshinori MURAKAMI ◽  
Shinji SATO ◽  
Hidekazu TANISAWA ◽  
Kohei HIYAMA ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
High Temperature ◽  
Semiconductor Devices ◽  
Ceramic Substrate ◽  
Power Module ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
High Temperature Operation

A high temperature sandwich structured power module for high temperature SiC power semiconductor devices has been accomplished. Problems were found in the high temperature building-up process of the module caused by excess warpage of the ceramic substrate. Also the high temperature operation of the power module brings an excess warpage of the structure caused by parts having different coefficients of thermal expansion (CTEs) from each other. In this paper, some countermeasures to overcome the problems are demonstrated.

High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices

2013 ◽  
Vol 10 (4) ◽  
pp. 138-143 ◽  
Author(s):  
Christina DiMarino ◽  
Zheng Chen ◽  
Dushan Boroyevich ◽  
Rolando Burgos ◽  
Paolo Mattavelli
Keyword(s):  
High Temperature ◽  
Semiconductor Devices ◽  
Wide Bandgap ◽  
Current Gain ◽  
Dynamic Characterization ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
Unbiased Manner ◽  
Insight Into

Focused on high-temperature (200°C) operation, this paper seeks to provide insight into state-of-the-art 1.2 kV silicon carbide (SiC) power semiconductor devices; namely the MOSFET, BJT, SJT, and normally-off JFET. This is accomplished by characterizing and comparing the latest generation of these wide bandgap devices from various manufacturers (Cree, GE, ROHM, Fairchild, GeneSiC, and SemiSouth). To carry out this study, the static and dynamic characterization of each device is performed under increasing temperatures (25–200°C). Accordingly, this paper describes the experimental setup used and the different measurements conducted, which include: threshold voltage, current gain, specific on-resistance, and the turn-on and turn-off switching energies of the devices. The driving method used for each device is also detailed. Key trends and observations are reported in an unbiased manner throughout the paper and summarized in the conclusion.

High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000082-000087 ◽  
Author(s):  
Christina DiMarino ◽  
Zheng Chen ◽  
Dushan Boroyevich ◽  
Rolando Burgos ◽  
Paolo Mattavelli
Keyword(s):  
High Temperature ◽  
Semiconductor Devices ◽  
Wide Bandgap ◽  
Current Gain ◽  
Dynamic Characterization ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
Unbiased Manner ◽  
Insight Into

Focused on high-temperature (200 °C) operation, this paper seeks to provide insight into state-of-the-art 1.2 kV Silicon Carbide (SiC) power semiconductor devices; namely the MOSFET, BJT, SJT, and normally-off JFET. This is accomplished by characterizing and comparing the latest generation of these wide bandgap devices from various manufacturers (Cree, GE, Rohm, Fairchild, GeneSiC, and SemiSouth). To carry out this study, the static and dynamic characterization of each device is performed under increasing temperatures (25–200 °C). Accordingly, this paper describes the experimental setup used and the different measurements conducted, which include: threshold voltage, current gain, specific on-resistance, and the turn-on and turn-off switching energies of the devices. The driving method used for each device is also detailed. Key trends and observations are reported in an unbiased manner throughout the paper and summarized in the conclusion.

scholarly journals Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

2009 ◽  
Vol 2 (1) ◽  
pp. 79-84 ◽  
Author(s):  
Yasushi Yamada ◽  
Yoshikazu Takaku ◽  
Yuji Yagi ◽  
Ikuo Nakagawa ◽  
Takashi Atsumi ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joints ◽  
Semiconductor Devices ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
High Temperature Solder

Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices

2015 ◽  
Vol 12 (3) ◽  
pp. 153-160 ◽  
Author(s):  
Takeshi Anzai ◽  
Yoshinori Murakami ◽  
Shinji Sato ◽  
Hidekazu Tanisawa ◽  
Kohei Hiyama ◽  
...  
Keyword(s):  
High Temperature ◽  
Thermal Cycle ◽  
Coefficient Of Thermal Expansion ◽  
Fabrication Process ◽  
Power Module ◽  
Ceramic Substrates ◽  
Soldering Temperature ◽  
Power Semiconductor ◽  
Power Modules ◽  
High Temperature Operation

This article presents a sandwich-structured SiC power module that can be operated at 225°C. The proposed power module has two ceramic substrates that are made of different materials (Si3N4 and Al2O3). The SiC devices are sandwiched between these ceramic substrates. The module also has a baseplate soldered onto the ceramic substrate. Conventional power modules use baseplate materials with a large coefficient of thermal expansion (CTE), for example, Cu (17–18 ppm/°C and Al (23–24 ppm/°C). In the fabrication process, the soldering temperature reaches 450°C because Au-Ge eutectic solder is used. A problem was found in the fabrication process of the module because of the high soldering temperature and CTE mismatches of the components. Furthermore, for high-temperature operation, a thermal cycle of −40°C to 250°C will be needed to ensure reliability and it is important to decrease the warpage of the module during the thermal cycle. By using stainless steel (CTE: 10 ppm/°C) for the baseplate, the warp-age measured at room temperature was reduced to one-third that of a module using a Cu baseplate. Further, the warpage displacement from 50°C to 250°C was also reduced.

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