Development of a new package for next generation power semiconductor devices: Toward high temperature and high voltage applications
2019 ◽
Vol 9
(1)
◽
pp. 3-9
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Keyword(s):
2019 ◽
Vol 40
(2)
◽
pp. 303-306
◽
2014 ◽
Vol 2014
(1)
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pp. 000757-000762
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2014 ◽
Vol 1070-1072
◽
pp. 1241-1245
2013 ◽
Vol 10
(4)
◽
pp. 138-143
◽
2015 ◽
Vol 28
(3)
◽
pp. 495-505
◽