Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

The most frequent cause of failure for wireless, handheld, and portable consumer electronic products is an accidental drop to the ground. The impact may cause interfacial fracture of ball-grid-array solder joints. Existing metrology, such as ball shear and ball pull tests, cannot characterize the impact-induced high speed fracture failure. In this study, a mini-impact tester was utilized to measure the impact toughness and to characterize the impact reliability of both eutectic SnPb and SnAgCu solder joints. The annealing effect at 150 °C on the impact toughness was investigated, and the fractured surfaces were examined. The impact toughness of SnAgCu solder joints with the plating of electroless Ni/immersion Au (ENIG) became worse after annealing, decreasing from 10 or 11 mJ to 7 mJ. On the other hand, an improvement of the impact toughness of eutectic SnPb solder joints with ENIG was recorded after annealing, increasing from 6 or 10 to 15 mJ. Annealing has softened the bulk SnPb solder so that more plastic deformation can occur to absorb the impact energy.

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DIN EN 60191-6-22:2013-08, Mechanische Normung von Halbleiterbauelementen_- Teil_6-22: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen_- Konstruktionsleitfaden für Halbleitergehäuse Si-Feinraster-Ball-Grid-Array und Si-Feinraster-Land-Grid-Array (S-FBGA_und_S-FLGA) (IEC_60191-6-22:2012); Deutsche Fassung EN_60191-6-22:2013

10.31030/2015842 ◽

2013 ◽

Keyword(s):

Ball Grid Array

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DIN EN 60191-6-13:2017-06, Mechanische Normung von Halbleiterbauelementen_- Teil_6-13: Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC_60191-6-13:2016); Deutsche Fassung EN_60191-6-13:2016

10.31030/2646994 ◽

2017 ◽

Keyword(s):

Ball Grid Array

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Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

10.31399/asm.cp.istfa2018p0037 ◽

2018 ◽

Author(s):

J. Lindsay ◽

P. Trimby ◽

J. Goulden ◽

S. McCracken ◽

R. Andrews

Keyword(s):

High Speed ◽

Solder Joints ◽

Phase Distribution ◽

Bond Failure ◽

Microstructural Parameters ◽

Snpb Solder ◽

Grain Orientations ◽

Accelerated Thermal Cycling ◽

The Relationship ◽

Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

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Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0389 ◽

2004 ◽

Author(s):

Luis A. Curiel ◽

Andrew J. Komrowski ◽

Daniel J.D. Sullivan

Keyword(s):

Ball Grid Array ◽

Acoustic Microscopy ◽

Electronic Packages ◽

Nondestructive Technique ◽

Molding Compound ◽

Microscopy Technique ◽

Plastic Ball ◽

Die Surface ◽

Plastic Ball Grid Array ◽

Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

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The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa1998p0405 ◽

1998 ◽

Author(s):

C.H. Zhong ◽

Sung Yi

Keyword(s):

Failure Mode ◽

Barrier Layer ◽

Shear Force ◽

Solder Ball ◽

Ball Grid Array ◽

Reliability Test ◽

Shear Forces ◽

Ball Shear ◽

Plastic Ball ◽

Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

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