Comparative Analysis of Thermal Dissipation Properties to Heat Sink of Thermal Conductive Polymer and Aluminum Material

This research presents an experimental investigation on the heat transfer performance and pressure drop characteristics of a heat sink with miniature square pin fin structure using nanofluids as coolant. ZnO-water nanofluids with particle concentrations of 0.2, 0.4 and 0.6 vol.% are used as working fluid and then compared with the data for water-cooled heat sink. Heat sink made from aluminum material with dimension around 28 x 33 x 25 mm (width x length x thickness). The heat transfer area and hydraulic diameter of the each flow channel is designed at 1,565 mm2and 1.2 mm respectively. Uniform heat flux at the bottom of heat sink is achieved using an electric heater. The experimental data illustrate that the thermal performance of heat sink using nanofluids as coolant is average 14% higher than that of the water-cooled heat sink. For pressure drop, the data show that the pressure drop of nanofluids is a few percent larger than that of the water-cooled heat sink.

Download Full-text

Comparative analysis of heat sink pressure drop using different methodologies

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) ◽

10.1109/stherm.2004.1291317 ◽

2004 ◽

Cited By ~ 3

Author(s):

C.K. Loh ◽

D.J. Chou

Keyword(s):

Comparative Analysis ◽

Pressure Drop ◽

Heat Sink

Download Full-text

The Effect of Parameter Changes to the Performance of a Triangular Shape Interrupted Microchannel Heat Sink

Jurnal Teknologi ◽

10.11113/jt.v58.1544 ◽

2012 ◽

Vol 58 (2) ◽

Author(s):

Fudhail Abd Munir ◽

Mohd Irwan Mohd Azmi ◽

Nadlene Razali ◽

Ernie Mat Tokit

Keyword(s):

Contact Angle ◽

Pressure Drop ◽

Heat Sink ◽

Heat Dissipation ◽

Thermal Dissipation ◽

Working Fluid ◽

Uniform Heat Flux ◽

Length Width ◽

Fluent Software ◽

Phase Water

The effect of parameter changes on triangular shaped interrupted microchannel performance was studied by simulation using FLUENT software. The parameters that were studied are total length, and the contact angle. On the other hand, the investigated effects were pressure drop and platinum film temperature. The flow in microchannel is laminar and single phase. Water was used as the working fluid and the interrupted microchannel is made of silicon. A thin platinum film plate was deposited to provide uniform heat flux. The geometry dimension of the heat sink is 30 mm in length, width of 7 mm and the thickness of 0.525 mm. From the simulation results, it is found that the improvement on heat dissipation may be achieved by increasing the microchannel length at the expense of increase in pressure drop. In addition to that, by reducing the contact angle will result to reduction in term of pressure drop and increases the improvement thermal dissipation.

Download Full-text

Three-Dimensional Analysis of a Thermal Dissipation System with a Rectangular Diamond Heat Spreader on a Semi-infinite Copper Heat Sink

Japanese Journal of Applied Physics ◽

10.1143/jjap.35.4852 ◽

1996 ◽

Vol 35 (Part 1, No. 9A) ◽

pp. 4852-4861 ◽

Cited By ~ 11

Author(s):

Ping Hui ◽

Hong Siang Tan

Keyword(s):

Dimensional Analysis ◽

Heat Sink ◽

Three Dimensional ◽

Thermal Dissipation ◽

Heat Spreader ◽

Dissipation System

Download Full-text

Optimization of Pin Fin Heat Sink by Application of CFD Simulations and Doe Methodology with Neural Network Approximation

International Journal of Applied Mechanics and Engineering ◽

10.2478/ijame-2013-0022 ◽

2013 ◽

Vol 18 (2) ◽

pp. 365-381 ◽

Cited By ~ 2

Author(s):

K. Kasza ◽

Ł. Malinowski ◽

I. Królikowski

Keyword(s):

Neural Network ◽

Thermal Efficiency ◽

Heat Sink ◽

Performance Metrics ◽

Conductive Polymer ◽

Pso Algorithm ◽

Design Parameters ◽

Transfer Coefficients ◽

Pin Fin ◽

Thermally Conductive

A design optimization of a staggered pin fin heat sink made of a thermally conductive polymer is presented. The influence of several design parameters like the pin fin height, the diameter, or the number of pins on thermal efficiency of the natural convection heat sink is studied. A limited number of representative heat sink designs were selected by application of the design of experiments (DOE) methodology and their thermal efficiency was evaluated by application of the antecedently validated and verified numerical model. The obtained results were utilized for the development of a response surface and a typical polynomial model was replaced with a neural network approximation. The particle swarm optimization (PSO) algorithm was applied for the neural network training providing very accurate characterization of the heat sink type under consideration. The quasi-complete search of defined solution domain was then performed and the different heat sink designs were compared by means of thermal performance metrics, i.e., array, space claim and mass based heat transfer coefficients. The computational fluid dynamics (CFD) calculations were repeated for the most effective heat sink designs.

Download Full-text

Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint

Heat Transfer Engineering ◽

10.1080/01457630802293324 ◽

2009 ◽

Vol 30 (1-2) ◽

pp. 43-53 ◽

Cited By ~ 6

Author(s):

Dylan Farnam ◽

Bahgat Sammakia ◽

Harold Ackler ◽

Kanad Ghose

Keyword(s):

Comparative Analysis ◽

Heat Sink ◽

Microchannel Heat Sink

Download Full-text

Experimental Study of Solder Joint Reliability for External Heat Sink Installation on FCBGA

Volume 5: Electronics and Photonics ◽

10.1115/imece2007-42743 ◽

2007 ◽

Author(s):

Nicholas Kao ◽

Jeng Yuan Lai ◽

Yu Po Wang ◽

C. S. Hsiao

Keyword(s):

Solder Joint ◽

Power Consumption ◽

Heat Sink ◽

Solder Ball ◽

Flip Chip ◽

Operating Time ◽

Compressive Force ◽

External Heat ◽

Thermal Dissipation ◽

Operation Temperature

As the increasing power consumption for electronic devices, thermal management on board level becomes a challenge to manufacturers who are integrating more functionality and components into a board in order to the high performance products in this competitive market. To drive such high level products requires more power consumption and consequently arises a thermal risk of system malfunction because of overheating to chips. A common implement for thermal solution is a heat sink installed on package via clip mechanism that maintained a compressive force to clamp the heat sink and board to fulfill this thermal dissipation demand. But this compressive force along with operation temperature will arise solder joint risk and potentially induce the function failed due to the clamped force may potentially arise solder ball creep after long operating time and damage the connection failed of solder ball and PCB. This paper describes the experimental setup and test results to evaluate the solder joints creep behavior in the presence of clamped force and operation temperature. An External Heat Spreader Flip Chip BGA (EHS-FCBGA) was tested for several weeks under 85°C with a compressive force. The different levels of uniform compressive forces were applied with 25kg and 50kg metal blocks on EHS-FCBGA to simulate the clamped force. All test vehicles were placed in an oven at 85°C for several weeks to accelerate thermal aging condition and measured solder ball collapsed shapes and do open-short test at the end of every two weeks.

Download Full-text

Cooling of Concentrated Photovoltaic System Using Various Configurations of Phase-Change Material Heat Sink

Volume 6A: Energy ◽

10.1115/imece2016-67111 ◽

2016 ◽

Cited By ~ 4

Author(s):

Mohamed Emam ◽

Mahmoud Ahmed ◽

Shinichi Ookawara

Keyword(s):

Phase Change ◽

Phase Change Material ◽

Heat Sink ◽

Fluid Model ◽

Heat Sinks ◽

Photovoltaic System ◽

Thermal Dissipation ◽

Thermal Regulation ◽

Change Material ◽

Single Cavity

In the current work, a hybrid system including Concentrated photovoltaic (CPV) and phase change material (PCM) as a heat sink is considered as a single module to achieve high solar conversion efficiency. The main objective is to accelerate the thermal dissipation with a longer thermal regulation period. Thus, a new CPV-PCM system using various configurations of the PCM heat sink and different combinations of PCMs is investigated. This study presents a numerical simulation of the effects of PCM materials and designs on the CPV-PCM system performance. To estimate the thermal performance of the new CPV-PCM system, a comprehensive 2-D model for CPV layers integrated with PCMs is developed. This model couples a thermal model for CPV layers and a thermo-fluid model that considers the phase-change phenomenon using the enthalpy method. The model is numerically simulated at different configurations and combinations of PCM with various ranges of phase transition temperatures. Three different configurations of PCMs are investigated: one with a single cavity, and two with parallel arrangements including three and five cavities. Results indicate that the use of PCM heat sinks with three and five cavities increases the heat transfer inside the PCM and achieves a significant reduction of the solar cell temperature compared with a single cavity CPV-PCM system. Furthermore, thermal regulation effect and temperature uniformity of the CPV-PCM system is enhanced by using various combinations of PCMs.

Download Full-text