High-speed digital and microwave circuits have traditionally been tested by dicing wafers and mounting chips into high-frequency test carriers. This process is expensive, time consuming, and destructive. Methods of high-frequency measurement at the wafer stage are very desirable; for example, for wafer mapping, but conventional needle probes cannot be used because of their parasitics. New probe structures based on fine coaxial lines, vertically mounted microstrip lines, and tapered coplanar lines have been reported.For measurement at microwave frequencies (2–20 GHz), we have developed a geometry of a coplanar wave-guide probe that gives better than 10 dB return loss. Individual monolithic components can easily be measured and modelled for inclusion in a circuit simulation.For the measurement of digital circuits, especially those requiring several high-speed signal lines, we have used proprietary microstrip probes. Satisfactory operation up to about 2 Gbit∙s−1 has been observed, the upper bit rate being restricted by the inductance of the probe tip.Microwave-frequency and time-domain measurements of both types of probes have been made and will be discussed. Additionally, examples of the use of these probes for on-wafer measurements of digital and analog circuits will be given.
High Speed/High Frequency Technology and EMC. High-frequency measurement techniques. High Frequency Parameter.
