High Frequency Measurement Techniques for On-Chip Inductors

2010 ◽  
Vol 2010 (1) ◽  
pp. 000886-000890
Author(s):  
Bruce C. Kim ◽  
Dae-Hyun Han ◽  
Seok-Ho Noh

This paper presents high frequency measurement techniques of on-chip inductors in giga Hertz range for wireless communication products. The on-chip inductors were fabricated on high resistive substrate to reduce loss. We compared several different on-chip inductors for self-resonance frequency and quality factors. The collection of measurement data could be used for the guideline of designing practical spiral inductors for wireless applications.

2020 ◽  
Author(s):  
Pieter-Jan Daems ◽  
Y. Guo ◽  
S. Sheng ◽  
C. Peeters ◽  
P. Guillaume ◽  
...  

Abstract Wind energy is one of the largest sources of renewable energy in the world. To further reduce the operations and maintenance (O&M) costs of wind farms, it is essential to be able to accurately pinpoint the root causes of different failure modes of interest. An example of such a failure mode that is not yet fully understood is white etching cracks (WEC). This can cause the bearing lifetime to be reduced to 5–10% of its design value. Multiple hypotheses are available in literature concerning its cause. To be able to validate or disprove these hypotheses, it is essential to have historic high-frequency measurement data (e.g., load and vibration levels) available. In time, this will allow linking to the history of the turbine operating data with failure data. This paper discusses the dynamic loading on the turbine during certain events (e.g., emergency stops, run-ups, and during normal operating conditions). By combining the number of specific events that each turbine has seen with the severity of each event, it becomes possible to assess which turbines are most likely to show signs of damage.


1990 ◽  
Vol 5 (1) ◽  
pp. 41-53 ◽  
Author(s):  
V.J. Thottuvelil ◽  
T.G. Wilson ◽  
H.A. Owen

2014 ◽  
Vol 3 (4) ◽  
pp. 104-113 ◽  
Author(s):  
Miroslav Kotzev ◽  
Young H. Kwark ◽  
Sebastian Muller ◽  
Andreas Hardock ◽  
Renato Rimolo-Donadio ◽  
...  

Author(s):  
V. Joseph Thottuvelil ◽  
Thomas G. Wilson ◽  
Harry A. Owen

2019 ◽  
Vol 9 (24) ◽  
pp. 5488 ◽  
Author(s):  
Efthymios Lallas

Wireless data traffic has experienced an unprecedented boost in past years, and according to data traffic forecasts, within a decade, it is expected to compete sufficiently with wired broadband infrastructure. Therefore, the use of even higher carrier frequency bands in the THz range, via adoption of new technologies to equip future THz band wireless communication systems at the nanoscale is required, in order to accommodate a variety of applications, that would satisfy the ever increasing user demands of higher data rates. Certain wireless applications such as 5G and beyond communications, network on chip system architectures, and nanosensor networks, will no longer satisfy speed and latency demands with existing technologies and system architectures. Apart from conventional CMOS technology, and the already tested, still promising though, photonic technology, other technologies and materials such as plasmonics with graphene respectively, may offer a viable infrastructure solution on existing THz technology challenges. This survey paper is a thorough investigation on the current and beyond state of the art plasmonic system implementation for THz communications, by providing in-depth reference material, highlighting the fundamental aspects of plasmonic technology roles in future THz band wireless communication and THz wireless applications, that will define future demands coping with users’ needs.


Sign in / Sign up

Export Citation Format

Share Document