Mouse Minute Virus (MMV) Contamination--A Case Study: Detection, Root Cause Determination, and Corrective Actions

2011 ◽  
Vol 65 (6) ◽  
pp. 580-588 ◽  
Author(s):  
M. Moody ◽  
W. Alves ◽  
J. Varghese ◽  
F. Khan
2020 ◽  
Vol 3 (1) ◽  

This paper describes about the case study of a very interesting and peculiar blackout conditions (total power failure) arising out of both the Gas Turbine Generators (Two units of GTG, namely GTG-01 & GTG-02) units back to back tripping in a short span of a week’s time. It brings out the various observations noted during that condition and it’s root cause analysis. It also highlights the various possible corrective actions in a short term and long term basis to prevent the reoccurrence of such blackout situations.


Author(s):  
Jason Wheeler ◽  
John Wolfgong

Abstract The focus of this paper is to present an interesting case study involving Vishay wire-wound (WSC model) resistor failures, which affected a significant number of production and fielded assemblies. The failures were considered “mission critical”, which was the primary driver necessitating root cause analysis. A disciplined approach to the failure analysis effort was established, which resulted in root cause determination and the generation of appropriate corrective actions. This paper will highlight a non-conventional decapsulation method used to preserve the integrity of the fragile resistive element and a “lucky break” that was instrumental in linking the supplier’s actions to the failures.


2018 ◽  
Author(s):  
Sneta Mishra ◽  
Daniel R. Bockelman
Keyword(s):  

Abstract A case study is presented of a core CPU product where FA/FI debug is performed for an ESD-related pin leakage issue on an IO family to root cause and qualify the product. A Powered TIVA technique is used to localize the damage to the termination resistor circuitry of the affected IO block when the pin is tristated using a device tester. Failure characterization shows a gate to drain short on the transistor, with nanoprobing confirming a solid short on gate to drain and TEM finding a short at the location indicated by the TIVA hits.


Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.


Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.


Author(s):  
Michael Woo ◽  
Marcos Campos ◽  
Luigi Aranda

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.


Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.


Water ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 683
Author(s):  
Birte Moser ◽  
Meruyert Beknazarova ◽  
Harriet Whiley ◽  
Thilini Piushani Keerthirathne ◽  
Nikki Harrington ◽  
...  

Iron-related clogging of boreholes, pumps and dripper lines is a significant and costly problem for irrigators worldwide. The primary cause of iron-related clogging is still debated. Previous studies have described complex interactions between biological clogging and inorganic iron/manganese oxide precipitation. This case study examined groundwater bores used for viticulture irrigation in the Limestone Coast region, a highly productive wine growing area in the SE of South Australia. Iron clogging of bore screens, pumps and dripper systems has been a persistent problem in the region and the issue is perceived to be growing, with irrigators suggesting the widespread introduction of iron-related bacteria (IRB) through drilling equipment to be the root cause of the problem. Analysis of the groundwater microbiology and inorganic chemistry found no apparent correlation between the presence of IRB and the clogging status of wells. In fact, IRB proved to be widespread throughout the limestone aquifer. However, a clear correlation could be found between clogging affected bores and the redox potential of the groundwater with the most severely affected bores strongly oversaturated in respect to iron oxide minerals. Elevated dissolved concentrations of Fe(II) thereby tended to be found in deeper bores, which also were generally more recently drilled. Following decades of less than average rainfall, a tendency to deepen bores in response to widespread declines in water levels has been documented for the SE of South Australia. The gradually widening clogging problem in the region is postulated to be related to the changes in climate in the region, with irrigators increasingly driven to rely on deeper, anoxic iron-rich groundwater resources.


2010 ◽  
Vol 30 (1) ◽  
pp. 62-65
Author(s):  
Naveed Ramzan ◽  
Shahid Naveed ◽  
Muhammad Rizwan ◽  
Werner Witt

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