scholarly journals Effect of Dry Oxidation and Thermal Annealing on AlN/GaN/AlN/Si (111) and Evaluation of its Electrical Characteristics

2021 ◽  
Vol 25 (4) ◽  
Keyword(s):  
Thermal Annealing ◽  
Electrical Characteristics ◽  
Dry Oxidation

Optical and Electrical Characteristics of Amorphous InGaZnO after Thermal Annealing

2008 ◽  
Author(s):  
Satoshi Taniguchi ◽  
Norihiko Yamaguchi ◽  
Takao Miyajima ◽  
Masao Ikeda
Keyword(s):  
Thermal Annealing ◽  
Electrical Characteristics ◽  
Amorphous Ingazno

Rapid Thermal Anneaung of Arsenic-Phosphorus(N+-N-) Double-Diffused Shallow Junctions

1985 ◽  
Vol 52 ◽  
Author(s):  
D. L. Kwong ◽  
N. S. Alvi ◽  
Y. H. Ku ◽  
A. W. Cheung
Keyword(s):  
Ion Implantation ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Experimental Results ◽  
Silicon Substrates ◽  
Electrical Characteristics ◽  
Shallow Junctions

ABSTRACTDouble-diffused shallow junctions have been formed by ion implantation of both phosphorus and arsenic ions into silicon substrates and rapid thermal annealing. Experimental results on defect removal, impurity activation and redistribution, effects of Si preamorphization, and electrical characteristics of Ti-silicided junctions are presented.

The Effect of Rapid Thermal Annealing on the Electrical and Material Characteristics of Planar Doped and Uniformly Doped GaAs/AiGaAs/InGaAs Pseudomorphic HEMT Structures

1991 ◽  
Vol 240 ◽  
Author(s):  
T. E. Kazior ◽  
S. K. Brierley
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Material Properties ◽  
Structural Changes ◽  
Electrical Characteristics ◽  
Pl Spectra ◽  
Annealing Temperatures ◽  
Si Doping ◽  
Significant Change ◽  
Ingaas Quantum Well

ABSTRACTMBE grown GaAs/Al0.25Ga0.75As/In0.85Ga0.85 As structures were subjected to SiNx capped rapid thermal annealing and their electrical and material properties were characterized by Hall measurements and photoluminescence (PL). Low temperature (5°K) PL spectra from undoped structures annealed up to 900°C indicated negligible intermixing at the AIGaAs/lnGaAs interface. For planar doped structures (Nd≈5×1012/cm2) the Hall mobility began to decrease at anneal temperatures as low as 800°C with significant degradation observed for annealing temperatures at 850°C. This data is supported by PL spectra which indicate no significant change for samples annealed at 800°C. For the samples annealed at ≥ 850°C a large increase in the full width at half maximum of the transitions from the electron sub-bands of the InGaAs quantum well were observed, suggesting that the change in electrical characteristics is primarily due to diffusion of the Si doping pulse. In contrast. Hall measurement of uniformly doped structures reveal only small decreases in mobility and no significant change in sheet concentration for anneal temperatures up to 900°C and doping levels up to 2.5×1018/cm3. PL spectra reveal no structural changes.

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