scholarly journals Advanced Semiconductor Design through Specialized Printable Conductive Layer

2020 ◽  
pp. 43-47
Author(s):  
Rennier Rodriguez ◽  
Frederick Ray Gomez ◽  
Maiden Grace Maming
Keyword(s):  
Cost Saving ◽  
Semiconductor Manufacturing ◽  
Semiconductor Device ◽  
Manufacturing Industries ◽  
Conductive Layer ◽  
Fabrication Method ◽  
Input Output ◽  
Stencil Printing ◽  
Specific Approach ◽  
Multiple Input

Semiconductor package miniaturization and thinning have become of particular interest among semiconductor manufacturing industries, with each manufacturing company having specific approach and technical directions in providing unique solutions in their products. The paper provides a specialized design of manufacturing flow for semiconductor device through advanced fabrication method using stencil printing. The advanced process would significantly reduce the carrier thickness for the overall package height configuration of the device. The implementation of the specialized design and process would mitigate common assembly barriers and defects related in producing thin devices, hence, enabling cost-saving realization and manufacturing solution to package thinning and miniaturization with multiple input/output (I/O) requirements.

General Theory for Multiple Input-Output Perturbations in Complex Molecular Systems. 1. Linear QSPR Electronegativity Models in Physical, Organic, and Medicinal Chemistry

2013 ◽  
Vol 13 (14) ◽  
pp. 1713-1741 ◽  
Author(s):  
Humberto Gonzalez-Diaz ◽  
Sonia Arrasate ◽  
Asier Gomez-SanJuan ◽  
Nuria Sotomayor ◽  
Esther Lete ◽  
...  
Keyword(s):  
General Theory ◽  
Medicinal Chemistry ◽  
Input Output ◽  
Molecular Systems ◽  
Physical Organic ◽  
Multiple Input

Innovative Curriculum on Electronic Materials Processing and Engingeering

2001 ◽  
Vol 684 ◽  
Author(s):  
Jane P. Chang
Keyword(s):  
Semiconductor Manufacturing ◽  
Chemical Engineering ◽  
Materials Science ◽  
Semiconductor Device ◽  
Electronic Materials ◽  
Dynamic Environment ◽  
Complementary Metal Oxide Semiconductor ◽  
Device Fabrication ◽  
Oxide Semiconductor ◽  
Solid State Physics

Recognizing that the traditional engineering education training is often inadequate in preparing the students for the challanges presented by this industry's dynamic environment and insufficient to meet the empoyer's criteria in hiring new engineers, a new curriculum on Semiconductor Manufacturing is instituted in the Chemical Engineering Department at UCLA to train the students in various scientific and technologica areas that are pertinenet to the microelectronics industries. This paper describes this new mutidisciplinary curriculum that provides knowledge and skills in semiconductor manufacturing through a series ofcourses that emphasize on the application of fundamenta engineeering disciplines in solid-state physics, materials science of semiconductors, and chemical processing. The curriculum comprises three major components:(1)a comprehensive course curriculum in semiconductor manufacturing; (2) a laboratory for hands-on training in semiconductor device fabrication; (3) design of experiments. The capstone laboratory course is designed to strengthen students’ training in “unit operatins” used in semicounductor manufacturing and allow them to practice engineering principles using the state-of-the-art experimental setup. It comprises the most comprehensive training(seven photolithographic steps and numero0us chemical processes)in fabricating and testing complementary metal-oxide-semiconductor (CMOS) devices. This curriculum is recentyaccredited by the Accreditation Board for Engineering and Technology(ABET).

scholarly journals Emission factor, relative ozone formation potential and relative carcinogenic risk assessment of VOCs emitted from manufacturing industries

2020 ◽  
Vol 30 (1) ◽  
Author(s):  
Hsi-Hsien Yang ◽  
Sunil Kumar Gupta ◽  
Narayan Babu Dhital
Keyword(s):  
Acrylic Resin ◽  
Carcinogenic Risk ◽  
Manufacturing Industries ◽  
Emission Sources ◽  
Ozone Formation ◽  
Stencil Printing ◽  
Voc Emission ◽  
Formation Potential ◽  
Ozone Formation Potential ◽  
Level I

AbstractManufacturing industries are one of the important emission sectors of anthropogenic volatile organic compounds (VOCs). In this study, VOC emission factors, relative ozone formation potential (ROFP) and relative carcinogenic risk (RCR) were estimated for manufacturing industries (n = 13) located in central Taiwan. Emission samples were collected in stainless steel canisters and were analyzed with a system of gas chromatography-mass spectroscopy. Higher emission factors of total VOCs (∑VOCs) were observed for stencil printing (423 mg-VOC kg− 1) compared to other emission industries. Alkanes constituted the most prominent group of VOCs for steel foundry (42%), aluminum foundry (25%) and synthetic resin industries (25%). Oxygenated VOCs were the most abundant group in the organic solvent (80%), polyester resin (80%) and polyurethane (75%) industries. Moreover, emissions from acrylic resin manufacturing had a major contribution from aromatic compounds (> 95%). Toluene was the topmost compound in terms of its contribution to ∑VOCs in plastic tape manufacturing (44%), aluminum foundry (40%), steel foundry (12%), plastic coating (64%) and stencil printing (35%). Analysis of ozone formation potentials showed that the metal product and machinery acrylic resin manufacturing and stencil printing had a higher normalized relative ozone formation potential (ROFP) index and belonged to Level-I emission sources. However, in terms of the relative carcinogenic risk (RCR), integrated iron and steel manufacturing had the highest normalized RCR index that belonged to level-I emission sources. Level-I represents the most important VOC emission sources. This study provides a reactivity- and carcinogenicity-based approach to identify high-priority VOC emission sources. The results of this study would help formulate emission reduction policies and strategies for manufacturing industries.

Active Wide-Band Vibration Rejection for Semiconductor Manufacturing Robots

2015 ◽  
Author(s):  
Zining Wang ◽  
Cong Wang ◽  
Masayoshi Tomizuka
Keyword(s):  
Semiconductor Manufacturing ◽  
Experimental Validation ◽  
Control Strategies ◽  
Vibration Reduction ◽  
Wide Band ◽  
Controller Synthesis ◽  
Manufacturing Industries ◽  
Tracking Accuracy ◽  
Active Vibration ◽  
Active Vibration Cancellation

Currently, the semiconductor manufacturing industries over the world are upgrading from processing 300mm wafers to processing 450mm wafers. In order to satisfy the requirements of producing and processing 450mm wafers, vibration control of wafer handling tools has to make new breakthroughs. This paper introduces an active wide-band vibration rejection method with a vibrotactile actuator and applies it to a wafer transfer robot. Compared to conventional methods based on motor control of the robot, active vibration cancellation with a separate actuator does not risk compromising the tracking accuracy of wafer transfer motions. A three-step controller synthesis scheme is developed by analyzing and combining the strengths of several control strategies. Experimental validation shows a vibration reduction of more than 40% in energy and 30% in amplitude.

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