scholarly journals Comparison of Heat Transfer rate of closed loop micro pulsating heat pipes having different number of turns

2017 ◽  
Vol 06 (07) ◽  
pp. 01-12
Author(s):  
Malay S. Patel ◽  
Sulochan D. Mane ◽  
Sandeep S. Mopare ◽  
Dhananjay Y. Patil
Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.


1973 ◽  
Vol 95 (2) ◽  
pp. 218-223 ◽  
Author(s):  
E. K. Levy ◽  
S. F. Chou

The results of an analytical study of the vapor dissociation–recombination and homogeneous vapor condensation phenomena in sodium heat pipes are described. It is shown that neither the dissociation–recombination reaction nor the vapor condensation process has a large influence on the sonic-limit heat transfer rate. The single most important factor is shown to be the wall shear stress in the heat-pipe vapor passage. The friction effects control the location of the sonic point, determine if the flow in the condenser section will be subsonic or supersonic, and decrease the sonic-limit heat transfer rate to values which can be substantially lower than those which are predicted from inviscid analyses.


1987 ◽  
Vol 109 (4) ◽  
pp. 1023-1025
Author(s):  
J. H. Ambrose ◽  
L. C. Chow ◽  
J. E. Beam

2019 ◽  
Vol 141 (9) ◽  
Author(s):  
Seok-Hwan Moon ◽  
Su-Hyun Hong ◽  
Hyun-Tak Kim

Heat pipes, commonly used for heat dissipation and thermal management in small electronic and communication devices, are regarded as an excellent solution. Heat pipes must be in surface rather than line contact to be applied to the module and system-level heat dissipation package. As such, a round copper heat pipe is transformed into a plate-like shape through a secondary press process. In this study, an extrusion structure is designed to be sloped to solve the difficulty of making it relatively thin compared with the large area of the plate structure. Specifically, substantial partitions separating the working fluid flow space in the plate-type heat pipe are designed to be inclined at 45 deg, and the extruded envelope is developed to obtain the desired total thickness through the secondary press process. The capillary structure is inserted and positioned within the envelope prior to the secondary press process. In this study, an aluminum flat heat pipe (AFHP) with 0.95 mm total thickness, 150 mm total length, and a capillary structure with braided or carbon wire bundles added thereto was designed and manufactured. Performance test results indicated that the heat transfer performance of the AFHP with inclined wall did not show any deterioration characteristic compared with the AFHP with a normal vertical wall. The isothermal characteristics and heat transfer rate of the AFHP with Cu braid wick were superior to those of AFHP with a simple rectangular groove wick. By contrast, when the carbon wire bundle is added in the Cu braid, the isothermal characteristic was enhanced twice, and the heat transfer rate was 15.5 W by improving approximately 42% under the conditions that inclination angle is −90 deg and the evaporator temperature does not exceed 110 °C.


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