Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
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AbstractIn this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.
1990 ◽
Vol 48
(1)
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pp. 510-511
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1921 ◽
Vol 99
(700)
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pp. 385-397
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2003 ◽
Vol 12
(1)
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pp. 57-61
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1993 ◽
Vol 64
(2)
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pp. 124-130
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2015 ◽
Vol 789-790
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pp. 471-476