A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

2021 ◽  
Vol 21 (12) ◽  
pp. 5960-5964
Author(s):  
Kwon Jai Lee ◽  
Jee Young Oh ◽  
Kyong Nam Kim
Keyword(s):  
Residual Stress ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Rapid Development ◽  
Electronic Devices ◽  
Copper Film ◽  
Electronics Industry ◽  
Electronic Components ◽  
Graphene Layers ◽  
Electronic Parts

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000207-000214
Author(s):  
Rakesh Kumar
Keyword(s):  
High Temperature ◽  
Electronic Devices ◽  
Electronics Industry ◽  
Performance Requirements ◽  
Cell Components ◽  
Temperature Exposure ◽  
Electronic Parts ◽  
Long Term Performance ◽  
Term Performance

A recent development in the area of high temperature and UV stable polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and component, including PCB's, MEMS, optoelectronic devices, fuel cell components and nano-electronic parts are, becoming more challenging due to their long-term performance requirements. This high temperature polymer, named Parylene HT, offers solutions to many existing protective, packaging and reliability issues in the electronics and medical industries, in part because of its excellent electrical and mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure (up to 350°C long-term and short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity, mechanical processing, etc. of a dynamic electronics industry. In addition, Parylene HT polymer coating truly conforms to parts due to its molecular level deposition characteristics. Its suitability and biocompatibility encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries.

scholarly journals THERMOELECTRIC SEMICONDUCTOR DEVICES FOR THERMAL STABILISATION OF REA POWERFUL TRANSISTORS

2020 ◽  
Vol 47 (1) ◽  
pp. 30-38
Author(s):  
T. A. Ismailov ◽  
A. R. Shakhmaeva ◽  
A. M. Ibragimova
Keyword(s):  
Heat Dissipation ◽  
High Efficiency ◽  
Solid Phase ◽  
Electronic Devices ◽  
Experimental Studies ◽  
Thermoelectric Module ◽  
Optimal Designs ◽  
Excess Heat ◽  
Power Transistors ◽  
Low Energy Consumption

Abstract. Aim. The aim of the study is to analyse the problem of heat dissipation in high-power transistors and develop devices for their thermal stabilisation when used in electronic equipment. Method. A method is proposed for testing power transistors using a device to to ensure thermal stabilisation in the stating volume by means of a two-position temperature controller along with a model for the use of these components in electronic devices. The proposed devices support high thermal stabilisation accuracy of power transistors in a radioelectronic device system allowing temperature to be maintained at a given level with high accuracy by means of a thermoelectric battery. Results. Device designs were developed for increasing the accuracy of thermal stabilisation of power transistors with high efficiency, low energy consumption and small size. Conclusion. Based on the results of experimental studies, optimal designs for devices for the thermostabilisation of radioelectronic device components that dissipate significant power during their operation are presented. The devices can be used to increase the accuracy of thermal stabilisation of the radioelectronic device element by means of a working substance whose melting point coincides with its thermal stabilisation temperature. The developed devices have the following functions: the thermoelectric battery sections of the thermoelectric battery will be sequentially disconnected depending on the electrical signals from the temperature sensors to which the solid phase of the working substance has moved. The battery of the thermoelectric module (TEM) removes excess heat from the heat-stabilising substance while maintaining the required temperature of the radioelectronic device element. Excess heat from the heat-generating junctions of the TEM battery is removed by the heat exchanger. During melting of the working substance, the temperature of the thin-walled metal container – and, accordingly, the temperature of the CEA element – can be maintained at a constant value equal to the melting temperature of the working substance. 

scholarly journals Optimization study on Electrical Enclosure with Forced Convection cooling using Computational Fluid Dynamics

2020 ◽  
pp. 34-42
Author(s):  
Mohammed Nabeel Ahmed ◽  
B. Meghanath ◽  
Mayur Laxman Kesarkar ◽  
Lakshminarasimha. N
Keyword(s):  
Heat Dissipation ◽  
Cfd Simulation ◽  
Internal Heat ◽  
Electronic Components ◽  
Ansys Fluent ◽  
Optimization Study ◽  
Convection Cooling ◽  
Electronic Parts ◽  
Significant Structure ◽  
Inlet Opening

Any electronic walled in area comprises of heat creating electronic components, as heat produced by the electronic parts in a fenced in area decreases the life of electronic segments prompting serious harm or disappointment of the framework. Research shows that each 10°c rise above room temperature of the enclosure, the life of the electronic parts decreases. Thus for any electronic frameworks, cooling turns into a significant structure interest, practical and ideal answer for hold the electronic parts to its working limit. Therefore, in the present work CFD simulation has been carried out using ANSYS Fluent by considering a typical Aluminum Electrical enclosure of volume (150mm X 600mm X 250mm) with total internal heat dissipation of 84W. With those values into consideration the surface area of enclosure, enclosure temperature rise, air flow requirement in an enclosure is calculated and based on which the fan is selected. Also optimization study has been carried out by changing the inlet opening position, exhaust fan location and providing baffle at inlet opening location. The results obtained from analysis are validated with analytical results.

Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics Applications

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000108-000113
Author(s):  
Rakesh Kumar
Keyword(s):  
High Temperature ◽  
Electronic Devices ◽  
Electronics Industry ◽  
Performance Requirements ◽  
Cell Components ◽  
Temperature Exposure ◽  
Electronic Parts ◽  
Long Term Performance ◽  
Term Performance

A development in the area of high temperature polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and components that include PCB's, MEM's, optoelectronic devices, fuel cell components and nano-electronic parts are becoming more challenging due to their long-term performance requirements. Parylene HT offers solutions to many existing packaging and reliability issues of electronics industry in part because of its excellent electrical & mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure to over 350°C (short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity and mechanical processing etc. of dynamic electronic industry. In addition, Parylene HT polymer coating truly conforms to the parts due to its molecular level deposition characteristics. Its suitability and biocompatibilty encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries, which include enhancing high temperature application/technologies.

Experimental Study on Natural Convection From Vertical Cylinders With Branched Fins

2013 ◽  
Author(s):  
Kuen Tae Park ◽  
Byeongdong Kang ◽  
Hyun Jung Kim ◽  
Dong-Kwon Kim
Keyword(s):  
Natural Convection ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Electronic Components ◽  
Cooling Systems ◽  
Cooling Technology ◽  
Vertical Cylinders

Advances in semiconductor technology and trends in slim and light electronic systems have led to a significant increase in heat dissipation density of the electronic devices. Therefore, effective cooling technology is essential for reliable operation of electronic components. Among various cooling systems, natural convection heat sinks have been proven to be appropriate because of their inherent simplicity, reliability, and low long-term cost. The present study is focused on natural convective heat transfer from the cylindrical heat sink. Especially, the branched fins, which are motivated by the branched design of nature shown in trees and lungs, are used. The heating power and surface temperature are measured for various types of branched fins and numbers of fins. The result showed that the branched fin dissipates 20% more heat compared to the normal plate fins. Therefore, heat sinks with branched fins have a potential as a next-generation cooling device.

scholarly journals A Multi-Loop Vehicle-Counting Method under Gray Mode and RGB Mode

2021 ◽  
Vol 11 (15) ◽  
pp. 6831
Author(s):  
Yue Chen ◽  
Jian Lu
Keyword(s):  
Intelligent Transportation Systems ◽  
High Efficiency ◽  
Road Traffic ◽  
Low Cost ◽  
Rapid Development ◽  
Intelligent Transportation ◽  
Transportation Systems ◽  
Counting Method ◽  
Moving Vehicle ◽  
Available Information

With the rapid development of road traffic, real-time vehicle counting is very important in the construction of intelligent transportation systems (ITSs). Compared with traditional technologies, the video-based method for vehicle counting shows great importance and huge advantages in its low cost, high efficiency, and flexibility. However, many methods find difficulty in balancing the accuracy and complexity of the algorithm. For example, compared with traditional and simple methods, deep learning methods may achieve higher precision, but they also greatly increase the complexity of the algorithm. In addition to that, most of the methods only work under one mode of color, which is a waste of available information. Considering the above, a multi-loop vehicle-counting method under gray mode and RGB mode was proposed in this paper. Under gray and RGB modes, the moving vehicle can be detected more completely; with the help of multiple loops, vehicle counting could better deal with different influencing factors, such as driving behavior, traffic environment, shooting angle, etc. The experimental results show that the proposed method is able to count vehicles with more than 98.5% accuracy while dealing with different road scenes.

scholarly journals High-Rate Transition Metal-based Cathode Materials for Battery-Supercapacitor Hybrid Devices

2021 ◽  
Author(s):  
Cong Wang ◽  
Zehao Song ◽  
Pei Shi ◽  
Lin Lv ◽  
Houzhao Wan ◽  
...  
Keyword(s):  
Large Scale ◽  
Rapid Development ◽  
Electronic Devices ◽  
High Rate ◽  
Specific Power ◽  
Energy Storage Devices ◽  
Storage Devices ◽  
Electrochemical Devices ◽  
Hybrid Devices ◽  
Scale Grid

With the rapid development of portable electronic devices, electric vehicles and large-scale grid energy storage devices, it needs to reinforce specific energy and specific power of related electrochemical devices meeting...

scholarly journals Regional Zenith Tropospheric Delay Modeling Based on Least Squares Support Vector Machine Using GNSS and ERA5 Data

2021 ◽  
Vol 13 (5) ◽  
pp. 1004
Author(s):  
Song Li ◽  
Tianhe Xu ◽  
Nan Jiang ◽  
Honglei Yang ◽  
Shuaimin Wang ◽  
...  
Keyword(s):  
Support Vector Machine ◽  
Least Squares ◽  
High Efficiency ◽  
Rapid Development ◽  
Support Vector ◽  
Tropospheric Delay ◽  
Improvement Rate ◽  
Zenith Tropospheric Delay ◽  
Background Data ◽  
Mean Square Errors

The meteorological reanalysis data has been widely applied to derive zenith tropospheric delay (ZTD) with a high spatial and temporal resolution. With the rapid development of artificial intelligence, machine learning also begins as a high-efficiency tool to be employed in modeling and predicting ZTD. In this paper, we develop three new regional ZTD models based on the least squares support vector machine (LSSVM), using both the International GNSS Service (IGS)-ZTD products and European Centre for Medium-Range Weather Forecasts Reanalysis 5 (ERA5) data over Europe throughout 2018. Among them, the ERA5 data is extended to ERA5S-ZTD and ERA5P-ZTD as the background data by the model method and integral method, respectively. Depending on different background data, three schemes are designed to construct ZTD models based on the LSSVM algorithm, including the without background data, with the ERA5S-ZTD, and with the ERA5P-ZTD. To investigate the advantage and feasibility of the proposed ZTD models, we evaluate the accuracy of two background data and three schemes by segmental comparison with the IGS-ZTD of 85 IGS stations in Europe. The results show that the overall average Root Mean Square Errors (RMSE) value of all sites is 30.1 mm for the ERA5S-ZTD, and 10.7 mm for the ERA5P-ZTD. The overall average RMSE is 25.8 mm, 22.9 mm, and 9 mm for the three schemes, respectively. Moreover, the overall improvement rate is 19.1% and 1.6% for the ZTD model with ERA5S-ZTD and ERA5P-ZTD, respectively. In order to explore the reason of the lower improvement for the ZTD model with ERA5P-ZTD, the loop verification is performed by estimating the ZTD values of each available IGS station. In actuality, the monthly improvement rate of estimated ZTD is positive for most stations, and the biggest improvement rate can even reach about 40%. The negative rate mainly comes from specific stations, these stations are located on the edge of the region, near the coast, as well as the lower similarity between the individual verified station and training stations.

scholarly journals Antireflective and Superhydrophilic Structure on Graphite Written by Femtosecond Laser

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 236
Author(s):  
Rui Lou ◽  
Guangying Li ◽  
Xu Wang ◽  
Wenfu Zhang ◽  
Yishan Wang ◽  
...  
Keyword(s):  
Femtosecond Laser ◽  
Near Infrared ◽  
High Efficiency ◽  
Electronic Devices ◽  
Sample Surface ◽  
Graphite Surface ◽  
Hazardous Substances ◽  
Functional Surface ◽  
Nano Structures ◽  
Average Reflectance

Antireflection and superhydrophilicity performance are desirable for improving the properties of electronic devices. Here, we experimentally provide a strategy of femtosecond laser preparation to create micro-nanostructures on the graphite surface in an air environment. The modified graphite surface is covered with abundant micro-nano structures, and its average reflectance is measured to be 2.7% in the ultraviolet, visible and near-infrared regions (250 to 2250 nm). The wettability transformation of the surface from hydrophilicity to superhydrophilicity is realized. Besides, graphene oxide (GO) and graphene are proved to be formed on the sample surface. This micro-nanostructuring method, which demonstrates features of high efficiency, high controllability, and hazardous substances zero discharge, exhibits the application for functional surface.

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