Numerical Optimization of a CPU Heat Sink Geometry

During its operation CPU dissipates undesirable heat. Therefore, heat sink is very essential in modern computing system to absorb extra heat dissipated by the CPU. Forced convection air cooling is common approach. In the present work, a steady-state convective heat transfer process is analyzed for CPU cooling. A rectangular fin heat sink equipped in a computer chassis is numerically investigated and simulated using the software ANSYS CFX. A two-equation based turbulence model is chosen to capture the turbulence of the flow inside the domain. The overall dimension of the heat sink is optimized for three different parameters of the heat sink such as fin quantity, fin height and baseplate thickness. An optimum fin quantity, fin height and baseplate thickness are found, and, respectively. Two different orientations of fins are also compared. Better thermal performance is achieved when the fin channel is perpendicular to the surface parallel to the outlet. The average temperature of the heat sink is found. It is also predicted that the heat sink studied here is capable to keep the CPU temperature underthat is reasonably acceptable.

Pengaruh Temperatur Double Dan Single Kondensor Cascade Straight Heat Pipe Pendingin CPU

Kebutuhan masyarakat akan komputer sangat tinggi. Komputer dapat diartikan sebagai alat yang dipakai untuk mengolah data menurut prosedur yang telah dirumuskan. Komputer itu sendiri terdiri dari perangkat keras (Hardware) dan perangkat lunak (Software). Salah satu komponen penting dalam komputer ialah Central Processing Unit (CPU) yang merupakan perangkat keras. Kondisi komputer yang dibebani kerja tentunya akan mengakibatkan CPU bekerja lebih keras dan menyebabkan CPU lebih cepat panas. Panas inilah yang dapat mengganggu kinerja dari CPU tersebut, oleh karena itu panas ini harus dibuang. Era sekarang ini, sistem pendinginan untuk CPU mulai mengarah pada penggunaan heat pipe sebagai pendingin. Heat pipe ini dapat mengatasi panas yang ditimbulkan oleh CPU yang nantinya akan membantu mengembalikan performa dari CPU tersebut. Untuk membantu menurunkan temperatur CPU digunakan heat pipe dengan desain single dan double kondensor cascade straight heat pipe. Perlakuan yang diberikan dalam pengujian cascade straight heat pipe dengan pemberian kalor masing-masing besarnya idle 10 (watt), 20 (watt), 30 (watt), 40 (watt) dan maksimal 48 (watt). Dari percobaan yang telah dilakukan menunjukkan hasil yang diberikan oleh cascade straight heat pipe untuk double kondensor menghasilkan temperatur lebih rendah dibandingkan single kondensor dimana temperatur mengalami penurunan sebesar 1,169°C pada pemberian kalor 20 watt, 0,437°C pada pemberian kalor 30 watt, 2,657°C pada pemberian kalor 40 watt dan 3,565°C pada pemberian kalor 48 watt. Computers needs in comunity is very high. Computers can be interpreted as a tool used to process data according to procedures that have been formulated. The computer consists of hardware (Hardware) and software (Software). One important component in a computer is the Central Processing Unit (CPU) which is the hardware. The condition of a computer that is burdened with work will require the CPU to work faster and cause the CPU to heat up faster. The heat must be removed from the CPU, because of the heat that must be removed. In this current era, the system supports CPUs. Starting to use heat pipes as a cooler. This heat pipe can overcome the heat generated by the CPU that is needed will help restore the performance of the CPU. To help reduce CPU temperature, a single and double cascade condenser heat pipe is used. The treatment given in the straight heat pipe cascade test by giving each value is idle 10 (watts), 20 (watts), 30 (watts), 40 (watts) and a maximum of 48 (watts). From the experiments conducted the results given by the straight cascade of heat pipes for multiple condensers produce lower temperatures than single condensers while the temperature requires a decrease of 1.169 ° C for the provision of 20 watts of heat, 0.437 ° C for 30 watt heat assistance, 2.657 ° C at the provision of heat of 40 watts and 3.565 ° C in the provision of heat of 48 watts.

Numerical and Experimental Study of CPU Cooling with Finned Heat Sink and Different P.C. Air Passages Configurations

This study investigated numerically and experimentally fluid flow and heat transfer in the desktop PC. Three patterns of the positions of air inlet and outlet were tested to find the best one for cooling. The computer components in the present study are CPU, finned heat sink, power supply, motherboard, CD, HDD and fans. Three components which were generate heat are CPU, motherboard and power supply and there were two openings for air inlet and two for air outlet. The air inlet velocities were 1.2, 1.8, 2.4 m/s with constant CPU fan velocity. The studied parameters were the changed of inlet air velocity, powers of CPU, motherboard and PSU and the positions of inlet air. The numerical results obtained are found in a good agreement with the experimental results. The experimental results show that the maximum temperature was 81 at 16.5 W and 1.2 m/s. Numerical results showed that the CPU temperature reaches 89.6 at 18.5 W and 1.2 m/s. From the results, it was found that; the temperatures of the main components (PSU and motherboard) affected little by CPU power and vice versa, the finned heat sink has higher cooling efficiency and the pattern 1 was the best pattern for CPU cooling.

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Efficient and compact cooling technologies play a pivotal role in determining the performance of high performance computing devices when used with highly parallel workloads in supercomputers. The present work deals with evaluation of different cooling technologies and elucidating their impact on the power, performance, and thermal management of Intel® Xeon Phi™ coprocessors. The scope of the study is to demonstrate enhanced cooling capabilities beyond today’s fan-driven air-cooling for use in high performance computing (HPC) technology, thereby improving the overall Performance per Watt in datacenters. The various cooling technologies evaluated for the present study include air-cooling, liquid-cooling and two-phase immersion-cooling. Air-cooling is evaluated by providing controlled airflow to a cluster of eight 300 W Xeon Phi coprocessors (7120P). For liquid-cooling, two different cold plate technologies are evaluated, viz, Formed tube cold pates and Microchannel based cold plates. Liquidcooling with water as working fluid, is evaluated on single Xeon Phi coprocessors, using inlet conditions in accordance with ASHRAE W2 and W3 class liquid cooled datacenter baselines. For immersion-cooling, a cluster of multiple Xeon Phi coprocessors is evaluated, with three different types of Integrated Heat Spreaders (IHS), viz., bare IHS, IHS with a Boiling Enhancement Coating (BEC) and IHS with BEC coated pin-fins. The entire cluster is immersed in a pool of Novec 649 (3M fluid, boiling point 49 °C at 1 atm), with polycarbonate spacers used to reduce the volume of fluid required, to achieve target fluid/power density of ∼ 3 L/kW. Flow visualization is performed to provide further insight into the boiling behavior during the immersion-cooling process. Performance per Watt of the Xeon Phi coprocessors is characterized as a function of the cooling technologies using several HPC workloads benchmark run at constant frequency, such as the Intel proprietary Power Thermal Utility (PTU), and industry standard HPC benchmarks LINPACK, DGEMM, SGEMM and STREAM. The major parameters measured by sensors on the coprocessor include total power to the coprocessor, CPU temperature, and memory temperature, while the calculated outputs of interest also include the performance per watt and equivalent thermal resistance. As expected, it is observed that both liquid and immersion cooling show improved performance per Watt and lower CPU temperature compared to air-cooling. In addition to elucidating the performance/watt improvement, this work reports on the relationship of cooling technologies on total power consumed by the Xeon-Phi card as a function of coolant inlet temperatures. Further, the paper discusses form-factor advantages to liquid and immersion cooling and compares technologies on a common platform. Finally, the paper concludes by discussing datacenter optimization for cooling in the context of leakage power control for Xeon-Phi coprocessors.

Effect of Process Parameters on the Cooling Performance of Liquid Cooling System for Electronic Application

This project is focused to study on the cooling performance of liquid cooling system under different process parameter. In this research, a liquid cooling system with copper block that simulates CPU, was setup to identify cooling performance of distilled water and vegetable oil at different mass flow rates (distilled water: 8.00g/s, 10.60g/s & 13.24g/s; vegetable oil: 1.22g/s, 1.30g/s & 1.38g/s) and input power (29.12W & 47.66W). The cooling performance of each fluid was characterized by the properties of: heat transfer coefficient, thermal resistance and also, the maximum CPU temperature (T4 at 66min) for the experiments. Experimental data shows that cooling performance was improved at higher mass flow rate and both distilled water and vegetable oil is a good coolant material.