EFFECT OF CU CONTENT AND GROWTH VELOCITY ON THE MICROSTRUCTURE PROPERTIES OF THE DIRECTIONALLY SOLIDIFIED AL-MN-CU TERNARY ALLOYS

In this work, influences of composition (Cu content) and growth velocity (V) on the microstructure (dendritic spacing) of Al–Mn–Cu ternary alloys have been investigated. Al–1.9Mn–xCu (x=0.5, 1.5 and 5 wt. %) alloys were prepared using metals of 99.90% high purity in the vacuum atmosphere. These alloys were directionally solidified upwards under various growth velocities (8.3–978 m/s) using a Bridgman-type directional solidification furnace at a constant temperature gradient (7.1 K/mm). Measurements of primary dendrite arm spacing () of the samples were carried out and then expressed as functions of growth velocity and Cu content. Especially, cell-dendritic transition was detected for low growth velocity (41.6 m/s) for alloys containing 0.5 and 1.5Cu. It has been found that the values of  decrease with increasing V and decreasing Cu content. Keywords: Aluminum alloys, Solidification, Cell-dendritic transition, Dendrite arm spacing

Relationship between Microstructure Evolution and Tensile Properties of AlSi10Mg Alloys with Varying Mg Content and Solidification Cooling Rates

This work explored and contrasted the effect of microstructure on the tensile properties of AlSi10Mg alloys generated by transient directional solidification depending on variations in cooling rate and magnesium (Mg) content (i.e., 0.45 and 1 wt.% Mg), with a focus on understanding the dendritic growth and phases constitution. Optical and scanning electron (SEM) microscopies, CALPHAD, and thermal analysis were used to describe the microstructure, forming phases, and resulting tensile properties. The findings showed that the experimental evolution of the primary dendritic spacing is very similar when both directionally solidified (DS) Al-10 wt.% Si-0.45 wt.% Mg and Al-10 wt.% Si-1 wt.% Mg alloys samples are compared. The secondary dendritic spacing was lower for the alloy with more Mg, especially considering the range of high growth velocities. Moreover, a greater fraction of (Al + Si + Mg2Si) ternary eutectic islands surrounding the α-Al dendritic matrix was noted for the alloy with 1 wt.% Mg. As a result of primary dendritic spacings greater than 180 μm related to lower cooling rates, slightly higher tensile properties were attained for the Al-10 wt.% Si-0.45 wt.% Mg alloy. In contrast, combining dendritic refining (<150 μm) and a larger Mg2Si fraction, fast-solidified DS Al-10 wt.% Si-1 wt.% Mg samples exhibited higher tensile strength and elongation. The control of cooling rate and fineness of the dendritic array provided a new insight related to the addition of Mg in slightly higher levels than conventional ones, capable of achieving a better balance of tensile properties in AlSi10Mg alloys.

Relationship Between Microstructure Evolution and Tensile Properties of AlSi10mg Alloys With Varying Solidification Cooling Rates

This work explored and contrasted the effect of microstructure on the tensile properties of AlSi10Mg alloys generated by transient directional solidification depending on variations in cooling rate and Magnesium (Mg) content (i.e., 0.45 and 1wt.% Mg), with a focus on understanding the dendritic growth and phases constitution. Optical and Scanning electron (SEM) microscopies, CALPHAD and thermal analysis were used to describe the microstructure, forming phases and resulting tensile properties. The findings showed that the experimental evolution of the primary dendritic spacing is very similar when both directionally solidified (DS) Al-10wt.% Si-0.45wt.% Mg and Al-10wt.% Si-1wt.% Mg alloys samples are compared. The secondary dendritic spacing was lower for the alloy with more Mg, especially considering the range of high growth velocities. Moreover, a greater fraction of (Al+Si+Mg2Si) ternary eutectic islands surrounding the -Al dendritic matrix was noted for the alloy with 1wt.% Mg. As a result of primary dendritic spacings greater than 180 m related to lower cooling rates, slightly higher tensile properties were attained for the Al-10wt.% Si-0.45wt.% Mg alloy. In contrast, combining dendritic refining (&lt; 150 m) and larger Mg2Si fraction, fast solidified DS Al-10wt.% Si-1wt.% Mg samples exhibited higher tensile strength and elongation. The control of cooling rate and fineness of the dendritic array provided a new insight related to the addition of Mg in slightly higher levels than conventional ones, capable of achieving a better balance of tensile properties in AlSi10Mg alloys.

Upward Unsteady-State Solidification of Dilute Al–Nb Alloys: Microstructure Characterization, Microhardness, Dynamic Modulus of Elasticity, Damping, and XRD Analyses

Aluminium alloys form many important structural components, and the addition of alloying elements contributes to the improvement of properties and characteristics. The objective of this work is to study the influence of thermal variables on the microstructure, present phases, microhardness, dynamic modulus of elasticity, and damping frequency in unidirectional solidification experiments, which were performed in situ during the manufacturing of Al–0.8 Nb and Al–1.2 Nb (wt.%) alloys. Experimental laws for the primary (λ1) and secondary (λ2) dendritic spacings for each alloy were given as a function of thermal variables. For Al–0.8%wt Nb, λ1 = 600.1( T ˙ )−1.85 and λ2 = 186.1(VL)−3.62; and for Al–1.2%wt Nb, λ1 = 133.6( T ˙ )−1.85 and λ2 = 55.6(VL)−3.62. Moreover, experimental growth laws that correlate the dendritic spacings are proposed. An increase in dendritic spacing influences the solidification kinetics observed, indicating that metal/mold interface distance or an increase in Nb content lowers the liquidus isotherm velocity (VL) and the cooling rate (Ṫ). There is also a small increase in the microhardness, dynamic modulus of elasticity, and damping frequency in relation to the composition of the alloy and the microstructure.

Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ1, and secondary, λ2, dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys.