thermal durability
Recently Published Documents


TOTAL DOCUMENTS

99
(FIVE YEARS 19)

H-INDEX

16
(FIVE YEARS 3)

2021 ◽  
pp. 151915
Author(s):  
Xue Jiang ◽  
Jun Fan ◽  
Siying Xiang ◽  
Jialin Mou ◽  
Peng Yao ◽  
...  

2021 ◽  
Vol 52 (S2) ◽  
pp. 861-863
Author(s):  
Chang'ou Wang ◽  
Mengyan Gao ◽  
Yan Jia ◽  
Lei Zhai ◽  
Minhui He ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4063
Author(s):  
Byeong-Hun Woo ◽  
Dong-Ho Yoo ◽  
Seong-Soo Kim ◽  
Jeong-Bae Lee ◽  
Jae-Suk Ryou ◽  
...  

To solve the problem of black ice, many studies are being carried out. The key in recent days is enhancing the thermal conductivity of concrete. In this study, to improve the thermal conductivity, silicon carbide was used to substitute 50% and 100% of the fine aggregate. In addition, steel fiber is not only for enhancing the mechanical properties but could enhance thermal conductive material. Hence, the arched-type steel fiber was used up to a 1% volume fraction in this study. Furthermore, graphite was used for 5% of the volume fraction for enhancing the thermal conductivity. However, thermal damage would occur due to the difference in thermal conductivity between materials. Therefore, the thermal durability must be verified first. The target application of the concrete in this study was its use as road paving material. To evaluate the thermal durability, freeze–thaw and rapid cyclic thermal attacks were performed. The thermal conductivity of the specimens was increased with the increase in thermal conductive materials. Graphite has already been reported to have a negative effect on mechanical properties, and the results showed that this was the case. However, the steel fiber compensated for the negative effect of graphite, and the silicon carbide provided a filler effect. Graphite also had a negative effect on the freeze–thaw and rapid cyclic thermal attack, but the steel fiber compensated for the reduction in thermal durability. The silicon carbide also helped to improve the thermal durability in the same way as steel fiber. Comprehensively, the steel fiber enhanced all of the properties of the tests. Using 100% silicon carbide was considered the acceptable range, but 50% of silicon carbide was the best. Graphite decreased all the properties except for the thermal conductivity. Therefore, the content of graphite or using other conductive materials used should be carefully considered in further studies.


2021 ◽  
Vol 2021 ◽  
pp. 1-9
Author(s):  
Dung Van Hoang ◽  
Anh Tuan Thanh Pham ◽  
Truong Huu Nguyen ◽  
Thang Bach Phan ◽  
Vinh Cao Tran

In this work, undoped, aluminum-, and gallium-doped ZnO thin films (ZnO-H, AZO-H, and GZO-H, respectively) deposited on soda-lime glass substrates by magnetron sputtering method in a gas mixture of hydrogen and argon are annealed at various temperatures in the range of 200–500°C in air to evaluate the durability of those films under annealing temperature. From photoluminescence spectra, formation of point defects, especially oxygen vacancies, when hydrogen diffuses out of the films at high annealing temperature is exhibited via a significant increase of visible emissions. We find out that carrier concentration and Hall mobility of AZO-H and ZnO-H films dramatically decrease, while those of GZO-H film are still stable as the annealing temperature increased from 200°C to 300°C. We proposed a model for interpreting the thermal durability of GZO-H film that, at an annealing temperature of 300°C, Ga3+ ions located at adjacent Zn sites can push hydrogen atoms, which are broken out of the antibonding sites which are perpendicular to the c -axis (AB┴), into bond center sites paralleled to the c -axis (BC//). The movement of hydrogen from AB┴ to BC// site also gives rise to the durability of electrical properties of GZO-H films at the high annealing temperature.


2021 ◽  
Vol 5 (19) ◽  
pp. 7241-7250
Author(s):  
Wenhua Zhang ◽  
Xueping Zong ◽  
Ming Luo ◽  
Mengnan Hua ◽  
Lianjie Zhu ◽  
...  

A type of comparatively flexible binaphthyl-ether structured polymer, which reveals high device thermal-durability, is reported.


Sign in / Sign up

Export Citation Format

Share Document