A Review of ARM Processor Architecture History, Progress and Applications

Globally, over 50 billion ARM architecture based embedded chips of 32-bit and 64-bit instruction set architecture are commonly used and produced in quantity perspective since 2014. In our daily life most of the people uses and depends upon a penalty of electrical and automotive devices which have now become an essential part of their daily life. Due to that reason embedded processors are used to build such devices which takes less silicone-space, provides efficient processing and less power.

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ?10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.