scholarly journals Analytical thermal modelling of multilayered active embedded chips into high density electronic board

2013 ◽  
Vol 17 (3) ◽  
pp. 695-706 ◽  
Author(s):  
Eric Monier-Vinard ◽  
Najib Laraqi ◽  
Cheikh Dia ◽  
Minh Nguyen ◽  
Valentin Bissuel
Keyword(s):  
Analytical Model ◽  
Heat Dissipation ◽  
Numerical Models ◽  
Organic Substrate ◽  
High Density ◽  
Thermal Modelling ◽  
Disruptive Technology ◽  
Printed Wiring Board ◽  
Electronic Board ◽  
Embedded Chips

The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ?10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.

scholarly journals Practical steady-state temperature prediction of active embedded chips into high density electronic board

2016 ◽  
Vol 745 ◽  
pp. 032095 ◽  
Author(s):  
Eric Monier-Vinard ◽  
Brice Rogie ◽  
Nhat-Minh Nguyen ◽  
Najib Laraqi ◽  
Valentin Bissuel ◽  
...  
Keyword(s):  
Steady State ◽  
High Density ◽  
Temperature Prediction ◽  
Steady State Temperature ◽  
Electronic Board ◽  
Embedded Chips

scholarly journals A COMBINED USE OF FDM AND DOE METHOD TO DERIVE A NEW TRANSIENT SIMPLIFIED SEMI-ANALYTICAL MODEL: A CASE STUDY OF ANHYDRITE RADIANT SLAB

2020 ◽  
Vol 330 ◽  
pp. 01002
Author(s):  
Abdelatif Merabtine ◽  
Abdelhamid Kheiri ◽  
Salim Mokraoui
Keyword(s):  
Surface Temperature ◽  
Analytical Model ◽  
Numerical Models ◽  
Thermal Response ◽  
Sensitivity Study ◽  
Conventional Heating ◽  
Heating Systems ◽  
Combined Use ◽  
Scale Test ◽  
Radiant Floor Heating

Radiant floor heating systems (FHS) are considered as reliable heating systems since they ensure maintaining inside air temperature and reduce its fluctuations more efficiently than conventional heating systems. The presented study investigates the dynamic thermal response of an experimental FHS equipped with an anhydrite radiant slab. A new simplified model based on an analytical correlation is proposed to evaluate the heating radiant slab surface temperature and examine its thermal behavior under dynamic conditions. In order the validate the developed analytical model, an experimental scenario, under transient conditions, was performed in a monitored full-scale test cell. 2D and 3D numerical models were also developed to evaluate the accuracy of the analytical model. The method of Design of Experiments (DoE) was used to both derive meta-models, to analytically estimate the surface temperature, and perform a sensitivity study.

scholarly journals Wave Propagation in Thin-Walled Aortic Analogues

2010 ◽  
Vol 132 (2) ◽  
Author(s):  
C. G. Giannopapa ◽  
J. M. B. Kroot ◽  
A. S. Tijsseling ◽  
M. C. M. Rutten ◽  
F. N. van de Vosse
Keyword(s):  
Experimental Data ◽  
Wave Propagation ◽  
Frequency Domain ◽  
Analytical Model ◽  
Viscoelastic Properties ◽  
Numerical Models ◽  
Computational Cost ◽  
One Dimensional ◽  
Arterial Blood

Research on wave propagation in liquid filled vessels is often motivated by the need to understand arterial blood flows. Theoretical and experimental investigation of the propagation of waves in flexible tubes has been studied by many researchers. The analytical one-dimensional frequency domain wave theory has a great advantage of providing accurate results without the additional computational cost related to the modern time domain simulation models. For assessing the validity of analytical and numerical models, well defined in vitro experiments are of great importance. The objective of this paper is to present a frequency domain analytical model based on the one-dimensional wave propagation theory and validate it against experimental data obtained for aortic analogs. The elastic and viscoelastic properties of the wall are included in the analytical model. The pressure, volumetric flow rate, and wall distention obtained from the analytical model are compared with experimental data in two straight tubes with aortic relevance. The analytical results and the experimental measurements were found to be in good agreement when the viscoelastic properties of the wall are taken into account.

Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic Packaging

2014 ◽  
Vol 2014 (1) ◽  
pp. 000141-000147 ◽  
Author(s):  
John M. Lauffer ◽  
Kevin Knadle
Keyword(s):  
Electronic Packaging ◽  
High Performance ◽  
Performance Enhancement ◽  
High Density ◽  
Consumer Electronics ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Electrically Conductive Adhesive ◽  
Plated Through Hole ◽  
Interconnect Technology

Common themes across all segments of electronic packaging today are density and performance. High density interconnect (HDI) technology is one of the most commonly utilized methods for electronic package density improvement, while many different areas have been investigated for performance improvement, from low loss dielectric and conductor materials, to via design and via stub reduction. Electrical performance and density requirements are sometimes complementary, but often times, conflicting with one another. This paper will describe the design, materials, fabrication, and reliability of a new Z-Interconnect technology that addresses both high density and high performance demands simultaneously. Z-Interconnect technology uses an electrically conductive adhesive to electrically interconnect several cores (Full Z) or sub-composites (Sub Z) in a single lamination process. Z-Interconnect technology will be compared and contrasted to other commonly used solutions to the performance and density challenges. HDI or sequential build-up technology is a pervasive solution to the density demands in semiconductor packaging and consumer electronics (e.g. Smart phones), but has not caught hold in HPC or A&D printed wiring board (PWB) applications. One solution for PWB electrical performance enhancement is plated through hole (PTH) stub reduction by “back drilling” the unwanted portion of the PTH. Pb-free reflow and Current Induced Thermal Cycling (CITC) test results of product coupons and specially designed test vehicles, having component pitches down to 0.4mm, will be presented. Z-Interconnect test vehicles have survived 6X Pb-free (260C) reflow cycles, followed by greater than 3000 cycles of 23C–150C CITC cycles. Test vehicle and product coupons also easily survive 10 or more 23C–260C CITC cycles.

Analytical and Numerical Prediction of Springback of SS/Al-Alloy Cladded Sheet in V-Bending

2020 ◽  
Vol 143 (3) ◽  
Author(s):  
Pankaj Kumar Sharma ◽  
Vijay Gautam ◽  
Atul Kumar Agrawal
Keyword(s):  
Analytical Model ◽  
Outer Layer ◽  
Numerical Models ◽  
Yield Criterion ◽  
Bending Moment ◽  
Analytical Models ◽  
Bend Angle ◽  
Radius Of Curvature ◽  
Al Alloy ◽  
First Case

Abstract The present work deals with the development of an analytical model incorporating the effects of anisotropy and strain hardening to predict the springback in V-bending of two-ply sheet metal using a punch profile radius of 15 mm and included a bend angle of 90 deg. In the analytical model, the total bending moment is determined from resulting bending stresses for two different layers arranged in parallel planes one above the other and a new radius of curvature after springback is determined by applying a negative bending moment. The two-ply sheet composed of layers of AA1050 and SS430 is characterized for its tensile properties to be used in analytical and numerical models for prediction of springback. To study the effect of each layer during bending operation, two possible cases of sheet placements during bending and springback are studied; i.e., in the first case, the inner layer is of AA1050 while the SS430 layer is the outer layer whereas in the second case it is opposite. In all the cases of springback experiments when the outer layer is of SS430, the springback values are higher than the values obtained with the specimens when the inner layer is of SS430. This could be attributed to the higher tensile strength of the stainless steel layer and the higher bending radius experienced by it. The springback behaviors are also analyzed by simulations using Hill's anisotropic yield criterion in abaqus software. The springback results obtained by simulations and analytical models are in good agreement in general; however, in some cases, discrepancy of more than 15% is observed in the analytical results when compared with the experimental results.

Comparing biofilm models for a single species biofilm system

2004 ◽  
Vol 49 (11-12) ◽  
pp. 145-154 ◽  
Author(s):  
E. Morgenroth ◽  
H.J. Eberl ◽  
M.C.M. van Loosdrecht ◽  
D.R. Noguera ◽  
G.E. Pizarro ◽  
...  
Keyword(s):  
Mass Transfer ◽  
Numerical Solutions ◽  
Heterotrophic Bacteria ◽  
Numerical Models ◽  
Single Species ◽  
Organic Substrate ◽  
Mass Transfer Resistance ◽  
Benchmark Problem ◽  
External Mass Transfer ◽  
Transfer Resistance

A benchmark problem was defined to evaluate the performance of different mathematical biofilm models. The biofilm consisted of heterotrophic bacteria degrading organic substrate and oxygen. Mathematical models tested ranged from simple analytical to multidimensional numerical models. For simple and more or less flat biofilms it was shown that analytical biofilm models provide very similar results compared to more complex numerical solutions. When considering a heterogeneous biofilm morphology it was shown that the effect of an increased external mass transfer resistance was much more significant compared to the effect of an increased surface area inside the biofilm.

scholarly journals Wave Propagation in Thin-Walled Aortic Analogues

2008 ◽  
Author(s):  
C. G. Giannopapa ◽  
J. M. B. Kroot
Keyword(s):  
Experimental Data ◽  
Wave Propagation ◽  
Frequency Domain ◽  
Analytical Model ◽  
Viscoelastic Properties ◽  
Numerical Models ◽  
Computational Cost ◽  
Arterial Blood Flow ◽  
One Dimensional ◽  
Arterial Blood

Research wave propagation in liquid filled vessels is often motivated by the need to understand arterial blood flow. Theoretical and experimental investigation of the propagation of waves in flexible tubes has been studied by many researchers. The analytical one dimensional frequency domain wave theory has a great advantage of providing accurate results without the additional computational cost related to the modern time domain simulation models. For assessing the validity of analytical and numerical models well defined in-vitro experiments are of great importance. The objective of this paper is to present a frequency domain transmission line analytical model based on one-dimensional wave propagation theory and validate it against experimental data obtained for aortic analogues. The elastic and viscoelastic properties of the wall are included in the analytical model. The pressure, flow and wall distention results obtained from the analytical model are compared with experimental data in two straight tubes with aortic relevance. The analytical models and the experimental measurements were found to be in good agreement when the viscoelastic properties of the wall are taken into account.

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