Due to the widespread use of copper wires in electrical power transmission, the need for raw materials with a homogeneous structure and high strength while maintaining their conductive properties is of high importance. The present study investigates the production of copper wire with improved mechanical properties and homogeneous microstructure due to its nanometre-sized structure. Therefore, the commercial pure copper specimens were subjected to severe plastic deformation (SPD) by means of equal channel angular pressing (ECAP) during four steps at ambient temperature. Due to the creation of a structure with elongated grains in the ECAP process, the deformed specimens were subjected to the direct extrusion operations; thus, a more homogeneous structure was created in them due to the appearance of a secondary radial strain. The obtained results indicate that by applying the simultaneous effects of SPD and direct extrusion on the microstructure, the mechanical properties such as strength and hardness have improved significantly, while the electrical conductivity of pure copper decreased slightly. The outcome can be used as an alternative to current methods for producing high-strength copper wires with suitable electrical conductivity properties.