Pad finish related board-level solder joint reliability research

2010 ◽  
Author(s):  
Chen Zhengrong ◽  
Zhou Jianwei ◽  
Fu Xingming ◽  
Lee Jaisung
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Board Level

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

2003 ◽  
Vol 43 (8) ◽  
pp. 1329-1338 ◽  
Author(s):  
Tong Yan Tee ◽  
Hun Shen Ng ◽  
Daniel Yap ◽  
Zhaowei Zhong
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Reliability Modeling ◽  
Joint Reliability ◽  
Board Level

Reliability of Underfilled Chip Scale Packages Attached With Heat Sink

2005 ◽  
Author(s):  
Saketh Mahalingam ◽  
Ashutosh Joshi ◽  
Joseph Lacey ◽  
Kunal Goray
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Operating Temperature ◽  
Ball Grid Array ◽  
Solder Joint Reliability ◽  
Proper Understanding ◽  
Joint Reliability ◽  
Board Level ◽  
Inelastic Strains ◽  
Underfill Material

Chip Scale Packages (CSP) are ideal intermediates between Direct Chip Attach (DCA) and Ball Grid Array (BGA) technologies in terms of both size and cost. Depending upon the application, chip scale packages are either underfilled for better solder joint reliability or are attached with a heat sink to keep the operating temperature of the chip under control. In many applications, as discussed in this paper, both an underfill and a heat sink are required. Quite expectedly the addition of two more materials, heat sink and adhesive, in the board level assembly results in fresh reliability concerns. In particular, the requirements on the underfill material and the heat sink attach adhesive are more rigorous and needless to say, a proper understanding of process and material issues is needed to make such a choice. The inelastic strains experienced by the solder joint (related to the underfill) and the peeling stresses at the heat sink attach adhesive interfaces (related to the thermal adhesive) are used as metric for comparing the number of material choices that are available. Based on the results, it is shown that it is important to choose materials that are thermo-mechanically matched with the rest of the system.

scholarly journals Improving the Solder Joint Reliability of a Power Leadframe Package Using Thermomechanical Simulation

2019 ◽  
pp. 1-6
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mold Material ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Thermomechanical Simulation ◽  
Board Level

Leadframe-based packages are commonly used for semiconductor power devices. With these packages, heat dissipation is much better compared with laminate substrated-based packages. However, the solder joint reliability requirement under thermal cycling condition is also higher and this is what makes the development of a power package challenging. One of the usual requirements from customers is that there should be no solder joint failure up to 2,000 thermal cycles. This paper presents the thermomechanical simulation of a power leadframe package that was conducted to improve its solder joint reliability. Board level solder joint cycle life was predicted using finite element analysis and the result was validated with actual solder life result from board level reliability evaluation. Since available solder prediction equation was for the characteristic life (63.2% accumulative failure), using the normalized characteristic life was implemented for predicting the number of cycles to first failure of the solder joint connection and the approach showed good agreement with the actual result. Results also indicated that the choice of epoxy mold material and the type of PCB (printed circuit board) have a significant contribution to the solder joint reliability performance.

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