Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking

2014 ◽  
Vol 26 (33) ◽  
pp. 5857-5862 ◽  
Author(s):  
Kojiro Uetani ◽  
Seisuke Ata ◽  
Shigeki Tomonoh ◽  
Takeo Yamada ◽  
Motoo Yumura ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Vertically Aligned ◽  
Interface Materials

Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

2019 ◽  
Vol 11 (1) ◽  
pp. 3-10 ◽  
Author(s):  
Guangjie Yuan ◽  
Haohao Li ◽  
Bo Shan ◽  
Johan Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Free Standing ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Potential Applications ◽  
Vertically Aligned ◽  
Interface Materials

As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.

Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling

2021 ◽  
pp. 2104062
Author(s):  
Qingwei Yan ◽  
Fakhr E. Alam ◽  
Jingyao Gao ◽  
Wen Dai ◽  
Xue Tan ◽  
...  
Keyword(s):  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Covalently Bonded ◽  
Vertically Aligned ◽  
Interface Materials

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials

2017 ◽  
Vol 9 (36) ◽  
pp. 30909-30917 ◽  
Author(s):  
Jin Chen ◽  
Xingyi Huang ◽  
Bin Sun ◽  
Yuxin Wang ◽  
Yingke Zhu ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Boron Nitride Nanosheets ◽  
Vertically Aligned ◽  
Interface Materials

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials

2016 ◽  
Vol 97 ◽  
pp. 94-100 ◽  
Author(s):  
Melissa A. Peacock ◽  
Chandan K. Roy ◽  
Michael C. Hamilton ◽  
R. Wayne Johnson ◽  
Roy W. Knight ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Vertically Aligned Carbon Nanotubes ◽  
Aligned Carbon Nanotubes ◽  
Vertically Aligned ◽  
Interface Materials
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