Automated Electron Backscatter Diffraction: Present State and Prospects

2000 ◽  
pp. 105-122 ◽  
Author(s):  
Robert A. Schwarzer
Keyword(s):  
Present State ◽  
Electron Backscatter Diffraction ◽  
Electron Backscatter ◽  
Backscatter Diffraction

scholarly journals Present State of Electron Backscatter Diffraction and Prospective Developments

2009 ◽  
pp. 1-20 ◽  
Author(s):  
Robert A. Schwarzer ◽  
David P. Field ◽  
Brent L. Adams ◽  
Mukul Kumar ◽  
Adam J. Schwartz
Keyword(s):  
Present State ◽  
Electron Backscatter Diffraction ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

scholarly journals Microstructure analysis of electrospun La0.8Sr0.2MnO3 nanowires using electron microscopy and electron backscatter diffraction (EBSD)

AIP Advances ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 025008
Author(s):  
Anjela Koblischka-Veneva ◽  
Michael R. Koblischka ◽  
XianLin Zeng ◽  
Jörg Schmauch
Keyword(s):  
Electron Microscopy ◽  
Electron Backscatter Diffraction ◽  
Microstructure Analysis ◽  
Electron Backscatter ◽  
Backscatter Diffraction

scholarly journals Analysis of Strain Partitioning in Intercritically Deformed Microstructures via Interrupted Tensile Tests

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 112
Author(s):  
Unai Mayo ◽  
Nerea Isasti ◽  
José M. Rodríguez-Ibabe ◽  
Pello Uranga
Keyword(s):  
Electron Backscatter Diffraction ◽  
Tensile Tests ◽  
Correlation Technique ◽  
Strain Partitioning ◽  
High Angle ◽  
Electron Backscatter ◽  
Different Types ◽  
Final Deformation ◽  
Micro Alloyed Steel ◽  
Backscatter Diffraction

Intercritically deformed steels present combinations of different types of ferrite, such as deformed ferrite (DF) and non-deformed ferrite (NDF) grains, which are transformed during the final deformation passes and final cooling step. Recently, a grain identification and correlation technique based on EBSD has been employed together with a discretization methodology, enabling a distinction to be drawn between different ferrite populations (NDF and DF grains). This paper presents a combination of interrupted tensile tests with crystallographic characterization performed by means of Electron Backscatter Diffraction (EBSD), by analyzing the evolution of an intercritically deformed micro-alloyed steel. In addition to this, and using the nanoindentation technique, both ferrite families were characterized micromechanically and the nanohardness was quantified for each population. NDF grains are softer than DF ones, which is related to the presence of a lower fraction of low-angle grain boundaries. The interrupted tensile tests show the different behavior of low- and high-angle grain boundary evolution as well as the strain partitioning in each ferrite family. NDF population accommodates most of the deformation at initial strain intervals, since strain reaches 10%. For higher strains, NDF and DF grains behave similarly to the strain applied.

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