Circuit-Board Attacks and Security

2022 ◽  
pp. 199-213
Author(s):  
Samuel H. Russ
Keyword(s):  
Circuit Board

Circuit Board Device

2020 ◽  
Author(s):  
Keyword(s):  
Circuit Board

406. An Ergonomic Hazards Survey of Printed Circuit Board Factories

1999 ◽  
Author(s):  
C. Lu ◽  
S. Wang ◽  
C. Wei ◽  
S. In
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Development of High Permeability Core Materials for Embeddable Inductors in Flexible Organic Substrates

2003 ◽  
Vol 769 ◽  
Author(s):  
C. K. Liu ◽  
P. L. Cheng ◽  
S. Y. Y. Leung ◽  
T. W. Law ◽  
D. C. C. Lam
Keyword(s):  
Low Temperature ◽  
Sol Gel ◽  
Circuit Board ◽  
Organic Substrates ◽  
Circuit Boards ◽  
High Permeability ◽  
Electrical Measurements ◽  
Different Temperatures ◽  
Spiral Inductors ◽  
Ceramic Tape

AbstractCapacitors, resistors and inductors are surface mounted components on circuit boards, which occupy up to 70% of the circuit board area. For selected applications, these passives are packaged inside green ceramic tape substrates and sintered at temperatures over 700°C in a co-fired process. These high temperature processes are incompatible with organic substrates, and low temperature processes are needed if passives are to be embedded into organic substrates. A new high permeability dual-phase Nickel Zinc Ferrite (DP NZF) core fabricated using a low temperature sol-gel route was developed for use in embedded inductors in organic substrates. Crystalline NZF powder was added to the sol-gel precursor of NZF. The solution was deposited onto the substrates as thin films and heat-treated at different temperatures. The changes in the microstructures were characterized using XRD and SEM. Results showed that addition of NZF powder induced low temperature transformation of the sol-gel NZF phase to high permeability phase at 250°C, which is approximately 350°C lower than transformation temperature for pure NZF sol gel films. Electrical measurements of DP NZF cored two-layered spiral inductors indicated that the inductance increased by three times compared to inductors without the DP NZF cores. From microstructural observations, the increase is correlated with the changes in microstructural connectivity of the powder phase.

Ultra-Small Reader/Writer with Multiple Contactless Interfaces on a Flexible Circuit Board

2009 ◽  
Vol E92-B (9) ◽  
pp. 2992-2995
Author(s):  
Hideaki YAMAMOTO ◽  
Minoru IKEDA ◽  
Yasuhiro HOSODA
Keyword(s):  
Circuit Board

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Data Center Equipment Reliability Concerns—Contamination Issues, Standards Actions, and Case Studies

2013 ◽  
Author(s):  
Chris Muller ◽  
Chuck Arent ◽  
Henry Yu
Keyword(s):  
Case Studies ◽  
Data Center ◽  
Data Centers ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Lead Free ◽  
Reliable Operation ◽  
Contamination Assessment ◽  
Equipment Reliability ◽  
Equipment Failures

Abstract Lead-free manufacturing regulations, reduction in circuit board feature sizes and the miniaturization of components to improve hardware performance have combined to make data center IT equipment more prone to attack by corrosive contaminants. Manufacturers are under pressure to control contamination in the data center environment and maintaining acceptable limits is now critical to the continued reliable operation of datacom and IT equipment. This paper will discuss ongoing reliability issues with electronic equipment in data centers and will present updates on ongoing contamination concerns, standards activities, and case studies from several different locations illustrating the successful application of contamination assessment, control, and monitoring programs to eliminate electronic equipment failures.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Sign in / Sign up

Export Citation Format

Share Document