Kinetic segregation on pores in the process of sintering a homogeneous solid solution

1993 ◽  
Vol 32 (5) ◽  
pp. 401-403
Author(s):  
Yu. I. Boiko ◽  
V. Kaizer ◽  
G. Pettsov ◽  
A. Frish
RSC Advances ◽  
2019 ◽  
Vol 9 (66) ◽  
pp. 38882-38890 ◽  
Author(s):  
Md Samiul Islam Sarker ◽  
Takahiro Nakamura ◽  
Satoshi Kameoka ◽  
Yuichiro Hayasaka ◽  
Shu Yin ◽  
...  

Catalytic Rh-based alloy nanoparticles (NPs) with inhomogeneous solid-solution structures were prepared from homogeneous solid-solution alloy NPs.


Minerals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 822 ◽  
Author(s):  
Ella V. Sokol ◽  
Svetlana N. Kokh ◽  
Yurii V. Seryotkin ◽  
Anna S. Deviatiiarova ◽  
Sergey V. Goryainov ◽  
...  

Minerals of the Zn-Cd-S-Se system that formed by moderately reduced ~800–850 °C combustion metamorphic (CM) alteration of marly sediments were found in marbles from central Jordan. Their precursor sediments contain Se- and Ni-enriched authigenic pyrite and ZnS modifications with high Cd enrichment (up to ~10 wt%) and elevated concentrations of Cu, Sb, Ag, Mo, and Pb. The marbles are composed of calcite, carbonate-fluorapatite, spurrite, and brownmillerite and characterized by high P, Zn, Cd, U, and elevated Se, Ni, V, and Mo contents. Main accessories are either Zn-bearing oxides or sphalerite, greenockite, and Ca-Fe-Ni-Cu-O-S-Se oxychalcogenides. CM alteration lead to compositional homogenization of metamorphic sphalerite, for which trace-element suites become less diverse than in the authigenic ZnS. The CM sphalerites contain up to ~14 wt% Cd and ~6.7 wt% Se but are poor in Fe (means 1.4–2.2 wt%), and bear 100–250 ppm Co, Ni, and Hg. Sphalerite (Zn,Cd,Fe)(S,O,Se)cub is a homogeneous solid solution with a unit cell smaller than in ZnScub as a result of S2− → O2− substitution (a = 5.40852(12) Å, V = 158.211(6) Å3). The amount of lattice-bound oxygen in the CM sphalerite is within the range for synthetic ZnS1−xOx crystals (0 < x ≤ 0.05) growing at 900 °C.


2013 ◽  
Vol 33 (3) ◽  
pp. 122-126
Author(s):  
Jin-Pyeong Kim ◽  
Si-Young Sung ◽  
Beom-Suck Han ◽  
Sang-Ho Kim

2007 ◽  
Vol 280-283 ◽  
pp. 127-130 ◽  
Author(s):  
Xiang Yu Zhang ◽  
Shou Hong Tan ◽  
Wei-Wei Xu ◽  
Shao Ming Dong ◽  
Zheng Ren Huang ◽  
...  

The microstructure and microwave dielectric properties of inhomogeneous SiC-AlN solid solutions, hot pressed under a pressure of 40 MPa, have been investigated. Microstructure analysis detected the existence of BN in the resulted samples, which may be a reason that homogeneous solid solution was not formed for the samples with AlN content higher than 20%. The dc resistivity of the solid solutions at room temperature varies from 8 × 103 Ω m to 1 × 109 Ω m. Ion jump and dipole relaxation losses are the main mechanism of dielectric losses.


Author(s):  
L.E. Murr ◽  
J.S. Dunning ◽  
S. Shankar

Aluminum additions to conventional 18Cr-8Ni austenitic stainless steel compositions impart excellent resistance to high sulfur environments. However, problems are typically encountered with aluminum additions above about 1% due to embrittlement caused by aluminum in solid solution and the precipitation of NiAl. Consequently, little use has been made of aluminum alloy additions to stainless steels for use in sulfur or H2S environments in the chemical industry, energy conversion or generation, and mineral processing, for example.A research program at the Albany Research Center has concentrated on the development of a wrought alloy composition with as low a chromium content as possible, with the idea of developing a low-chromium substitute for 310 stainless steel (25Cr-20Ni) which is often used in high-sulfur environments. On the basis of workability and microstructural studies involving optical metallography on 100g button ingots soaked at 700°C and air-cooled, a low-alloy composition Fe-12Cr-5Ni-4Al (in wt %) was selected for scale up and property evaluation.


Author(s):  
A. Christou ◽  
J. V. Foltz ◽  
N. Brown

In general, all BCC transition metals have been observed to twin under appropriate conditions. At the present time various experimental reports of solid solution effects on BCC metals have been made. Indications are that solid solution effects are important in the formation of twins. The formation of twins in metals and alloys may be explained in terms of dislocation mechanisms. It has been suggested that twins are nucleated by the achievement of local stress-concentration of the order of 15 to 45 times the applied stress. Prietner and Leslie have found that twins in BCC metals are nucleated at intersections of (110) and (112) or (112) and (112) type of planes.In this paper, observations are reported of a transmission microscope study of the iron manganese series under conditions in which twins both were and were not formed. High strain rates produced by shock loading provided the appropriate deformation conditions. The workhardening mechanisms of one alloy (Fe - 7.37 wt% Mn) were studied in detail.


Author(s):  
Jordi Marti ◽  
Timothy E. Howson ◽  
David Kratz ◽  
John K. Tien

The previous paper briefly described the fine microstructure of a mechanically alloyed oxide dispersion strengthened nickel-base solid solution. This note examines the fine microstructure of another mechanically alloyed system. This alloy differs from the one described previously in that it is more generously endowed with coherent precipitate γ forming elements A1 and Ti and it contains a higher volume fraction of the finely dispersed Y2O3 oxide. An interesting question to answer in the comparative study of the creep and stress rupture of these two ODS systems is the role of the precipitate γ' in the mechanisms of creep and stress rupture in alloys already containing oxide dispersoids.The nominal chemical composition of this alloy is Ni - 20%Cr - 2.5%Ti - 1.5% A1 - 1.3%Y203 by weight. The system receives a three stage heat treatment-- the first designed to produce a coarse grain structure similar to the solid solution alloy but with a smaller grain aspect ratio of about ten.


Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


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