A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide
precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with
hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between
80nm to 1µm, depending on the size of silica particles. The structure and dielectric constant of the
hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively
low dielectric constant compared to the hybrid polyimide-silica films.