Surface integrity enhancement of ZL109 aluminum-silicon piston alloy employing the forward and reverse finish cutting method

2020 ◽  
Vol 107 (1-2) ◽  
pp. 617-629
Author(s):  
Hu Sun ◽  
Anhai Li ◽  
Yonghui Zhou ◽  
Xuhao Song ◽  
Chaoyi Xue
Biomimetics ◽  
2019 ◽  
Vol 4 (3) ◽  
pp. 57 ◽  
Author(s):  
Xiangyu Zhang ◽  
Zhenlong Peng ◽  
Deyuan Zhang

Cutting is the foundation of manufacturing in industry. The main cutting objects include metals, ceramics, glasses, compositions, and even biological materials such as tissues and bones. The special properties of each material such as hardness, ductility, brittleness, and heat conductivity lead to either a large cutting force or a high cutting temperature. Both of these factors result in poor machinability due to rapid tool wear or break or unsatisfactory surface integrity of the material finishing surface using the conventional cutting (CC, conventional cutting) types. In nature, snakes have their own way of reducing heat accumulation on their body when moving on the hot desert surface. They move forward along an “S”-type path, so that the bottom of their body separates from the desert intermittently. In this way, the separation interval both reduces the cutting heat accumulations and effectively achieves cooling by allowing the air to go through. In addition, the acceleration of Odontomachus monticola’s two mandibles when striking a target can reach 71,730 g m/s2 within 180 ms, which can easily break the target surface by the transient huge impact. Therefore, based on a snake’s motion on the desert surface and Odontomachus monticola’s striking on the target surface, respectively, an ultrasonic-frequency intermittent cutting method, also called “snake-type” vibration cutting (SVC, snake-type vibration cutting), was proposed in this study. First, its bionic kinematics were analyzed, then the SVC system’s design was introduced. Finally, cutting experiments were conducted on a common and typical difficult-to-cut material, namely titanium alloys. Cutting force, cutting temperature, and the surface integrity of the material finishing surface were measured, respectively. The results demonstrated that, compared to conventional cutting methods, SVC achieved a maximum of 50% and 30% reductions of cutting force and cutting temperature, respectively. Moreover, the surface integrity was improved both in surface roughness and residual stress state.


2016 ◽  
Vol 836-837 ◽  
pp. 71-76
Author(s):  
Rui Tao Peng ◽  
Yang Ge Li ◽  
Xin Zi Tang ◽  
Zhuan Zhou

In order to solve the poor cutting performance for the titanium alloy and the serious residual tensile stress distribution on the machined surface in cutting titanium alloy, the utilization of prestressed cutting method is proposed to actively control the residual stress distribution status on the machined surface in machining process. Titanium alloy ring parts were pre-stretched at different condition by a lathe-specific pretension device respectively. By the cutting experimental, the cutting force ,chip formation and surface integrity indexes are compared and studied. The results show that in suitable compressive residual stress on machined surface are achieved by utilizing the prestressed cutting method ,meanwhile procedures of residual stress adjustment after machining could be omitted. Furthermore, the magnitude of compressive residual stress could be actively controlled by adjusting the magnitude of prestressed force in certain extent. And uniform saw-tooth chip are generated in prestressed cutting, meanwhile there’s no significant increment of cutting force. Prestressed cutting method could generate good surface integrity.


Author(s):  
R. M. Anderson ◽  
T. M. Reith ◽  
M. J. Sullivan ◽  
E. K. Brandis

Thin films of aluminum or aluminum-silicon can be used in conjunction with thin films of chromium in integrated electronic circuits. For some applications, these films exhibit undesirable reactions; in particular, intermetallic formation below 500 C must be inhibited or prevented. The Al films, being the principal current carriers in interconnective metal applications, are usually much thicker than the Cr; so one might expect Al-rich intermetallics to form when the processing temperature goes out of control. Unfortunately, the JCPDS and the literature do not contain enough data on the Al-rich phases CrAl7 and Cr2Al11, and the determination of these data was a secondary aim of this work.To define a matrix of Cr-Al diffusion couples, Cr-Al films were deposited with two sets of variables: Al or Al-Si, and broken vacuum or single pumpdown. All films were deposited on 2-1/4-inch thermally oxidized Si substrates. A 500-Å layer of Cr was deposited at 120 Å/min on substrates at room temperature, in a vacuum system that had been pumped to 2 x 10-6 Torr. Then, with or without vacuum break, a 1000-Å layer of Al or Al-Si was deposited at 35 Å/s, with the substrates still at room temperature.


2009 ◽  
Vol 46 (3) ◽  
pp. 137-152 ◽  
Author(s):  
Mile Djurdjevic ◽  
Glenn Byczynski ◽  
Carola Schechowiak ◽  
Hagen Stieler ◽  
Jelena Pavlovic

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