Effect of heat treatment on microstructure and thermal conductivity of carbon/carbon–copper composites

2016 ◽  
Vol 122 (3) ◽  
Author(s):  
Peng’ao Yang ◽  
Jian Yin ◽  
Hongbo Zhang ◽  
Xiang Xiong
Alloy Digest ◽  
2000 ◽  
Vol 49 (10) ◽  

Abstract CMW 100 is a copper alloy that combines high tensile strength with high electrical and thermal conductivity. It responds to age-hardening heat treatment. It is used for flash welding dies, springs, electrical components, high-strength backing material for brazed assemblies, and wire guides. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as fatigue. It also includes information on corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CU-29. Producer or source: CMW Inc. Originally published as Mallory 100, August 1955, revised October 2000.


Author(s):  
Michael F. P. Bifano ◽  
Jungkyu Park ◽  
Vikas Prakash

In the present study, classical MD simulations using reverse non-equilibrium molecular dynamics with the AIREBO interatomic potential are used to investigate the sensitivity of thermal conductivity in SWCNTs to side-wall defect concentration and heat-treatment. Two types of defects are investigated. First, the thermal conductivity of (6,6) SWCNTs is obtained as a function of concentration of chemisorbed hydrogen adatoms. Secondly, the thermal conductivity is obtained as a function of point-vacancy concentrations. The results of the studies show that 2 atom% of hydrogenation and 1.5–2% vacancy concentrations have very similar detrimental effects on the thermal conductivity of SWCNT. Vacancy repair is evident with heat treatment, and heat-treatments at 3000°C for up to 22 ns are found to transform point vacancies into various types of non-hexagonal side-wall defects; this vacancy repair is accompanied by a ca. 10% increase in thermal conductivity. Thermal conductivity measurements in both heat-treated and non-heat treated chemical vapor deposition grown MWCNTs are also reviewed. The results suggest that CNT thermal conductivity can be drastically increased if measures are taken to remove common defects from the SWCNT side-walls.


2005 ◽  
pp. 1279-1282
Author(s):  
Xin Lu ◽  
Xiao Shan Ning ◽  
Wei Xu ◽  
He Ping Zhou ◽  
Ke Xin Chen

Author(s):  
Brian A. Murtha ◽  
Anil K. Kulkarni ◽  
Jogender Singh

The phenomenon of sintering has a significant impact on the thermal conductivity of a highly porous material. Particle diffusion greatly reduces the number of grain boundaries that are normally present in porous materials. In turn, fewer grain boundaries imply fewer sites for phonon scattering during conductive heat transfer. Therefore, during heat treatment of a highly porous material, particle diffusion accounts for a changing thermal conductivity. This occurs with no bulk densificiation of the material. In fact, SEM images show that the microstructure of a porous material changes from many individual particles with small pores between the particles to diffused particles with large pores in between large chunks of material. To model such a phenomenon, standard equations were scaled with unitless weighting functions to account for variable microstructures during heating. By weighting standard equations, the effects of microstructure could be more accurately described as a function of porosity and time.


2015 ◽  
Vol 655 ◽  
pp. 11-16 ◽  
Author(s):  
Xing Li Liu ◽  
Meng Meng Peng ◽  
Xiao Shan Ning ◽  
Yosuke Takahashi

To investigate the influence of β-Si3N4 powder on thermal conductivity of silicon nitride, coarse, fine β-Si3N4 powder and various β-Si3N4/α-Si3N4 ratios of starting powders were adopted to fabricate ceramics by spark plasma sintering at 1600°Cand subsequent high-temperature heat treatment at 1900°C with the sintering additives of Y2O3 and MgO. It is found that with more fine β-Si3N4 powder in the starting powder, β-Si3N4 grains exhibit high thermal conductivity, which is partly resulted from the compaction of β-Si3N4 grains.


2008 ◽  
Vol 403 ◽  
pp. 61-63
Author(s):  
Hyeon Keun Lee ◽  
Do Kyung Kim

The high thermal conductivity of Aluminum nitride, coupled with its high electrical resistivity and nontoxic nature, makes it a very promising material for electronic substrate. In this study, microstructural characterization on the thermal conductivity of AlN ceramics was investigated. An AlN ceramic was prepared with a dopant Y2O3 under a reducing nitrogen atmosphere with carbon. In order to obtain high thermal conductivity, cooling rate control and after-heat treatment was carried out. Morphology of the second phase was characterized using scanning electron microscopy (SEM). SEM studies showed that the microstructural change caused by after-heat treatment have a major influence on the thermal conductivity.


Sign in / Sign up

Export Citation Format

Share Document