Core–shell structured dendritic CuO@TiO2 for high-k P(VDF-HFP) composites with suppressed dielectric loss and enhanced thermal conductivity

2017 ◽  
Vol 29 (2) ◽  
pp. 1269-1279 ◽  
Author(s):  
Liang Hu ◽  
Yuting Xia ◽  
Qianqian Wang ◽  
Hui Yang ◽  
Qi-long Zhang
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
Core Shell ◽  
High K ◽  
Enhanced Thermal Conductivity

scholarly journals Core-Shell Sr2CeO4@SiO2 Filled COC‑Based Composites with Low Dielectric Loss for High-Frequency Substrates

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4006
Author(s):  
Qinlong Wang ◽  
Hao Wang ◽  
Caixia Zhang ◽  
Qilong Zhang ◽  
Hui Yang
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Frequency ◽  
High Speed ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Signal Transmission ◽  
Sol Gel ◽  
Normal Operation ◽  
Core Shell

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/℃. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

Flexible and enhanced thermal conductivity of a Al2O3@polyimide hybrid film via coaxial electrospinning

RSC Advances ◽  
2015 ◽  
Vol 5 (25) ◽  
pp. 19315-19320 ◽  
Author(s):  
Jianwen Xia ◽  
Guoping Zhang ◽  
Libo Deng ◽  
Haipeng Yang ◽  
Rong Sun ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Hybrid Film ◽  
Coaxial Electrospinning ◽  
Core Shell ◽  
Enhanced Thermal Conductivity

A core–shell Al2O3@PI fiber was prepared by coaxial electrospinning, which showed excellent properties of flexibility and in plane thermal conductivity.

scholarly journals Enhanced thermal conductivity of epoxy composites with core‐shell SiC@SiO 2 nanowires

High Voltage ◽  
2017 ◽  
Vol 2 (3) ◽  
pp. 154-160 ◽  
Author(s):  
Dianyu Shen ◽  
Mengjie Wang ◽  
Yuming Wu ◽  
Zhiduo Liu ◽  
Yong Cao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Composites ◽  
Core Shell ◽  
Enhanced Thermal Conductivity
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