Strategy to achieve ultralow dielectric constant for polyimide: introduction of fluorinated blocks and fluorographene nanosheets by in situ polymerization

2019 ◽  
Vol 30 (15) ◽  
pp. 14679-14686
Author(s):  
Linyu Pu ◽  
Xu Huang ◽  
Wei Wang ◽  
Yatang Dai ◽  
Junxiao Yang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
In Situ Polymerization

scholarly journals AC CONDUCTIVITY AND DIELECTRIC STUDIES OF POLYPYRROLE-PAPAIN COMPOSITE

2019 ◽  
Vol 7 (8) ◽  
pp. 332-338
Author(s):  
Pandey Munish ◽  
Badlani Richa
Keyword(s):  
Dielectric Constant ◽  
Room Temperature ◽  
In Situ Polymerization ◽  
Weight Percent ◽  
Oxidizing Agent ◽  
Dielectric Studies ◽  
Dielectric Constant And Loss ◽  
Lcr Meter ◽  
Room Temperature Dielectric Constant

Enzyme doped polypyrrole polymer were synthesized by in situ polymerization where ferric chloride works as an oxidizing agent. The different weight percent of papain was added at the time of polymerization. The polypyrrole-papain composite of various composition was analyzed for its dielectric and a. c. conductivity by using LCR meter at room temperature. Dielectric constant and loss decreases, with escalation in frequency. The variation in dielectric constant and dielectric loss was also noted with change in papain percentage in pyrrole.

Properties of Porous Polyimide Films Based on Melamine Template

2019 ◽  
Vol 821 ◽  
pp. 160-166
Author(s):  
Qing Jun Ding ◽  
Hua Feng Li
Keyword(s):  
Dielectric Constant ◽  
In Situ Polymerization ◽  
Polyimide Film ◽  
Decomposition Temperature ◽  
Porous Films ◽  
Wear Properties ◽  
Polyimide Films ◽  
Oil Storage ◽  
Friction And Wear Properties

In this paper, melamine was used as porogen to prepare porous polyimide film by in-situ polymerization. The mechanical properties, thermal properties, dielectric properties, oil content and friction and wear properties of polyimide films with different porosity were investigated. The tensile strength of porous films decreases obviously with increase of melamine content. It shows the lower thermal decomposition temperature and the faster decomposition speed compared with the non-porous film, indicating higher heat exchange rate due to holes in porous films. As the porogen content increases, the dielectric constant decreases significantly, and the film with melamine content of 20 wt.% has the lowest dielectric constant of 2.43. The holes lead to good oil storage performance and the wear rate and the friction coefficient decrease with the increase of porosity. Keywords: polyimide; porous; melamine; dielectric; friction

Preparation and Dielectric Properties of Polyimide Nanocomposite Films Based on Hollow Silica

2011 ◽  
Vol 217-218 ◽  
pp. 647-651
Author(s):  
Yu Li ◽  
Yi He Zhang ◽  
Bo Shen ◽  
Feng Zhu Lv
Keyword(s):  
Dielectric Constant ◽  
In Situ Polymerization ◽  
Tetraethyl Orthosilicate ◽  
Nanocomposite Films ◽  
Polystyrene Microspheres ◽  
Hollow Silica ◽  
Silica Source ◽  
Silica Concentration ◽  
Polyimide Nanocomposite

The hollow silica was fabricated by using monodispersed polystyrene microspheres as core template and tetraethyl orthosilicate as silica source, and polyimide nanocomposite films with different hollow silica concentration were successfully prepared via in situ polymerization. The hollow silica and nanocomposite films were characterized. The results indicated that the diameter of the hollow silica is around 30nm and the dielectric constant of the nanocomposite films enhance with the increase of the concentration of the hollow silica.

PVDF promotes TiO2 dispersion to obtain composite films with high dielectric constant and low loss

2021 ◽  
pp. 095400832110440
Author(s):  
Mingyun Peng ◽  
Ke Li ◽  
Bingliang Huang ◽  
Jie Cheng
Keyword(s):  
Dielectric Constant ◽  
Room Temperature ◽  
Vinylidene Fluoride ◽  
In Situ Polymerization ◽  
Composite Films ◽  
Low Loss ◽  
Three Phase ◽  
Poly Vinylidene Fluoride ◽  
High Dielectric

A series of three-phase composite films with different filler contents were prepared by in-situ polymerization. The composite films comprise polyimide (PI), poly (vinylidene fluoride) (PVDF), and titanium dioxide (TiO2). Compared with PI/TiO2 composite films, the PI/TiO2-PVDF composite films not only get a significant increase in dielectric constant, but also own better mechanical properties. Our results show that with the loading of 50wt% PVDF particles, the dielectric constant of PI/TiO2-PVDF composite films increased from 6.5 to 18.14 at 1 MHz and room temperature, while the tensile strength of PI/TiO2-PVDF composite films increased from 45 to 72 MPa. In addition, the films maintain a low loss tangent of about 0.02. PI/PVDF composite films were also prepared. It was found that dielectric constant of PI/PVDF composite was significantly lower than that of PI/TiO2-PVDF composite films when the loading of PVDF is 50wt%.

scholarly journals High dielectric constant polyaniline/poly(acrylic acid) composites prepared by in situ polymerization

2008 ◽  
Vol 158 (15) ◽  
pp. 630-637 ◽  
Author(s):  
Chao-Hsien Ho ◽  
Cheng-Dar Liu ◽  
Chia-Hung Hsieh ◽  
Kuo-Huang Hsieh ◽  
Sung-Nung Lee
Keyword(s):  
Dielectric Constant ◽  
Acrylic Acid ◽  
High Dielectric Constant ◽  
In Situ Polymerization ◽  
High Dielectric ◽  
Poly Acrylic Acid

Improvement in mechanical, physical and biological properties of eucalyptus and pine woods by raw pine resin in situ polymerization

2021 ◽  
Vol 166 ◽  
pp. 113495
Author(s):  
Andrey Pereira Acosta ◽  
Kelvin Techera Barbosa ◽  
Sandro Campos Amico ◽  
André Luiz Missio ◽  
Rafael de Avila Delucis ◽  
...  
Keyword(s):  
In Situ Polymerization ◽  
Biological Properties ◽  
Pine Resin
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