Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests

2020 ◽  
Vol 31 (21) ◽  
pp. 19013-19024
Author(s):  
Ping Lin ◽  
Wensheng Liu ◽  
Yunzhu Ma ◽  
Yufeng Huang ◽  
Siwei Tang
Keyword(s):  
Solder Joint ◽  
Temperature Cycle ◽  
Current Switch

scholarly journals Thermo mechanical analysis of through-hole solder joint using strain partitioning method

2021 ◽  
Author(s):  
Imtiaz Ahmed Shaik
Keyword(s):  
Solder Joint ◽  
Creep Strain ◽  
Fatigue Failure ◽  
Thermal Loading ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Deformation Mode ◽  
Temperature Cycle ◽  
Plated Through Hole ◽  
Through Hole

Currently in the electronics industry there is a desire to increase component reliability. Fatigue failure in solder joints is an important design consideration for electronic packaging. In through-hole components, fatigue failure of leads has been observed to antecede fatigue failure of solder joints. The main objective of the study for a solder joint in a plated-through-hole bearing the pin during the temperature cycle was to ascertain the thermo mechanical behavior and the dominant deformation mode. The Digital Speckle Correlation (DSC) technique, which is a computer vision technique, was applied for the measurement of solder joint deforamtion for a prescribed outlined temperature and time. The dimensions for the area of the solder joint under study were 21 by 21 um, located at the centre of the hole. And computation of averaged shear strains at 6 data points for this area was done. R Darveaux's constitutive model was applied for the data analysis such as the solder joint yields stress with respect to the time and temperature. On achieving the stress solution, the measured total strains were partitioned into elastic, plastic and creep terms separately and hence the creep strain was evaluated. From the analysis, it was found that the dominant deformation mode was shear deformation due to mismatch of coefficient of thermal expansion between pin and copper plating material of through-hole under thermal loading. And the dominant deformation mechanism was creep strain while stress started to relax at the end of ramp up and continued throughout the test and creep strain rate decreased during high temperature dwell. In Addition, the elastic strain was dominating during the initial stage of thermal cycle but later it was neglibible when compared to creep strain.

scholarly journals Thermo mechanical analysis of through-hole solder joint using strain partitioning method

2021 ◽  
Author(s):  
Imtiaz Ahmed Shaik
Keyword(s):  
Solder Joint ◽  
Creep Strain ◽  
Fatigue Failure ◽  
Thermal Loading ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Deformation Mode ◽  
Temperature Cycle ◽  
Plated Through Hole ◽  
Through Hole

Currently in the electronics industry there is a desire to increase component reliability. Fatigue failure in solder joints is an important design consideration for electronic packaging. In through-hole components, fatigue failure of leads has been observed to antecede fatigue failure of solder joints. The main objective of the study for a solder joint in a plated-through-hole bearing the pin during the temperature cycle was to ascertain the thermo mechanical behavior and the dominant deformation mode. The Digital Speckle Correlation (DSC) technique, which is a computer vision technique, was applied for the measurement of solder joint deforamtion for a prescribed outlined temperature and time. The dimensions for the area of the solder joint under study were 21 by 21 um, located at the centre of the hole. And computation of averaged shear strains at 6 data points for this area was done. R Darveaux's constitutive model was applied for the data analysis such as the solder joint yields stress with respect to the time and temperature. On achieving the stress solution, the measured total strains were partitioned into elastic, plastic and creep terms separately and hence the creep strain was evaluated. From the analysis, it was found that the dominant deformation mode was shear deformation due to mismatch of coefficient of thermal expansion between pin and copper plating material of through-hole under thermal loading. And the dominant deformation mechanism was creep strain while stress started to relax at the end of ramp up and continued throughout the test and creep strain rate decreased during high temperature dwell. In Addition, the elastic strain was dominating during the initial stage of thermal cycle but later it was neglibible when compared to creep strain.

Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests

2013 ◽  
Vol 2013 (1) ◽  
pp. 000902-000907
Author(s):  
Gordon Elger ◽  
Shri Vishnu Kandaswamy ◽  
Robert Derix ◽  
Jürgen Wilde
Keyword(s):  
Thermal Analysis ◽  
Solder Joint ◽  
High Power ◽  
Test Method ◽  
Temperature Cycle ◽  
Electric Resistance ◽  
Transient Thermal Analysis ◽  
Open Contact ◽  
Long Lifetime ◽  
Transient Thermal

Light emitting diodes (LEDs) are today standard and mature light sources. They have several key advantages, like small size, low energy consumption and long lifetime. However, high reliability of the LED system is required to achieve long lifetime of the light source. Thermo-mechanical stress due to temperature cycle causes failure of electronic systems. The electronic component itself or the interconnect device, e.g. printed circuit board (PCB) might fail. In many cases, the weakest link is found to be the solder interconnect between package and the board. Cracking of the interconnect causes an open contact and the system fails. In this paper we compare the existing methods to investigate LED interconnect failures during temperature cycle tests like the simple “light-on-test”, electric resistance measurement and the shear test. We describe and introduce the transient thermal analysis as a measurement method. We present the first reliability data analysis with transient thermal analysis of ceramic high power LED packages on Al-IMS during air to air thermal shock test (−40°C to +125°C) and correlate it with cross sections. We demonstrate the sensitivity of the thermal analysis to detect solder joint failures of the assembly. We compare the results with electric resistance measurements and light on tests and show that the resolution is significantly higher compared to the methods applied today. The sensitivity of the method enables us to detect the crack in a solder joint much earlier than the final failure of the joint, i.e. the open contact.

Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests

2014 ◽  
Vol 11 (2) ◽  
pp. 51-56 ◽  
Author(s):  
Gordon Elger ◽  
Shri Vishnu Kandaswamy ◽  
Robert Derix ◽  
Jürgen Wilde
Keyword(s):  
Thermal Analysis ◽  
Solder Joint ◽  
High Power ◽  
Open Circuit ◽  
Temperature Cycle ◽  
Electric Resistance ◽  
Transient Thermal Analysis ◽  
Printed Circuit ◽  
Long Lifetime ◽  
Transient Thermal

Light emitting diodes (LEDs) are today standard and mature light sources. They have several key advantages such as small size, low energy consumption, and long lifetime. However, high reliability of the LED system is required to achieve long lifetime of the light source. Thermomechanical stress due to temperature cycling causes failure of electronic systems. The electronic component itself or the interconnect device, for example, the printed circuit board (PCB), might fail. In many cases, the weakest link is found to be the solder interconnect between the package and the board. Cracking of the interconnect causes an open circuit and the system fails. In this paper the existing methods are compared in order to investigate LED interconnect failures during temperature cycle tests such as the simple light-on test, electric resistance measurement, and the shear test. This paper describes and introduces transient thermal analysis as a measurement method. This paper presents the first reliability data analysis with transient thermal analysis of ceramic high power LED packages on printed circuit boards, that is, insulated metal substrates, during the air-to-air thermal shock test (−40°C to +125°C) and correlates it with cross sections. This work demonstrates the sensitivity of the thermal analysis to detect solder joint failures of the assembly. This paper compares the results with electric resistance measurements and light-on tests and shows that the resolution is significantly higher compared with the methods applied today. The sensitivity of the method enables the detection of a crack in a solder joint much earlier than the final failure of the joint, that is, the open circuit.

A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach

1993 ◽  
Vol 115 (4) ◽  
pp. 416-423 ◽  
Author(s):  
S. Verma ◽  
A. Dasgupta ◽  
D. Barker
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Numerical Study ◽  
Elastic Strain Energy ◽  
Energy Partitioning ◽  
Temperature Cycling ◽  
Temperature Cycle ◽  
Strain History ◽  
Stress And Strain ◽  
Solder Joint Fatigue

A surface-mount J-leaded device is modeled in this study, to investigate the effects of selected design, loading and manufacturing variables on solder joint fatigue life. The solder is modeled as a viscoplastic material, while the remaining materials are assumed to be linear elastic, as a first order approximation. Finite element analysis is used to determine the stress and strain history in the solder, due to temperature cycling. A “typical” temperature cycle with uniform dwell periods is applied to the solder joint. The computed stress and strain histories are utilized to construct hysteresis plots at each location in the solder joint. The hysteresis plots are then partitioned into elastic strain energy, plastic work and creep work dissipation. The fatigue life of the solder joint is then estimated through the energy partitioning technique. Parametric studies are conducted to investigate qualitatively the dependence of solder joint fatigue life on selected material properties, geometric variables, life cycle as well as accelerated loads, and manufacturing variabilities.

Comparison of LCC Solder Joint Life Predictions With Experimental Data

1995 ◽  
Vol 117 (2) ◽  
pp. 109-115 ◽  
Author(s):  
Liang-chi Wen ◽  
Ronald G. Ross
Keyword(s):  
Solder Joint ◽  
Cyclic Strain ◽  
Peak Stress ◽  
Temperature Cycling ◽  
Temperature Cycle ◽  
Strain History ◽  
Test Program ◽  
Test Vehicle ◽  
Creep Fatigue ◽  
Life Predictions

The ability of solder joint life-prediction algorithms to predict the failure of solder joints due to temperature-cycling induced creep-fatigue has been investigated using representative leadless chip carriers (LCCs) as the test vehicle. Four different algorithms are assessed: the classic Coffin-Manson algorithm, a modified Coffin-Manson algorithm with dependency on peak stress, and two strain-energy based algorithms. JPL’s special purpose nonlinear finite element computer program was used to dynamically simulate the solder joint response to the standard NASA temperature cycling environment, which ranges from −55°C to +100°C with a 4-hour period. The computed stress-strain history provided the inputs needed by each of the failure algorithms. To test the accuracy of the analytical predictions, three different sizes of LCCs (68 pins, 28 pins, and 20 pins) were subjected to an experimental test program using the same 4-hour temperature cycle as used in the analytical predictions. The three different sized ceramic packages, each with a 50-mil pitch, provided a range of cyclic strain ranges and solder fillet geometries so as to test the algorithms against realistic electronic packaging variables. The study highlights limitations in the historical Coffin-Manson relationship, and points up possible improvements associated with incorporating a stress modifier into the Coffin-Manson equation. This modification is also somewhat simpler and more accurate than the energy-density based algorithms, which also performed quite well.

Reliability Analysis of Solder Joints on Rigid-Flexible PCB for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads with Continuously Monitored Electrical Signals

2021 ◽  
Author(s):  
Xiaoping Wang ◽  
Jun Yang ◽  
Xiaogang Liu ◽  
Panpan Zheng ◽  
Qinglin Song ◽  
...  
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Solder Joints ◽  
Pressure Sensors ◽  
Experimental Results ◽  
Circuit Board ◽  
Design Parameters ◽  
Temperature Cycle ◽  
Electrical Signals ◽  
Flexible Pcb

Abstract The reliability of lead-free solder joints on flexible PCB has created significant new challenges in the industry, especially in automotive electronics, and possibly for future wearable electronics.In this paper, the submodeling technique was used to construct the finite element model of the rigid-flexible printed circuit board (rigid-flexible PCB) for a MEMS pressure sensor subjected to combined temperature cycle and random vibration loadings. During all the experiments, the electrical signals of each specimen were continuously monitored using an event detector. One advantage of this method is that any individual soldering interconnect failure will result in the diagnostic signal of the circuit, which could be detected in real time. The influence of vibration frequency and acceleration on the vibration fatigue life of solid joints was investigated.The research results are helpful to effectively characterize the performance of the MEMS sensors under combine thermal cycling test and vibration test. Two kinds of land shapes and two kinds of PCB assemblies were selected. The solder joint is sliced and the crack on the cross section of solder joint was observed. Results of finite element modeling analysis were consistent with the experimental results. Two design parameters have been identified in our research as being important to soldering usage in automotive environments: pad type (teardrop vs. non-teardrop) and pad size (big vs. small, matching size for Cu-wire and pad). Experimental results also showed that the solder joint with big land shape presented a relatively good thermal fatigue resistance.

scholarly journals 1510 Effect of Initial Temperature Cycle on BGA Solder Joint Durability Against Vibrational Loading

2009 ◽  
Vol 2009.22 (0) ◽  
pp. 722-723
Author(s):  
Takahiro OMORI ◽  
Kenji HIROHATA ◽  
Minoru MUKAI ◽  
Hiroyuki TAKAHASHI ◽  
Hideki OGAWA
Keyword(s):  
Solder Joint ◽  
Initial Temperature ◽  
Temperature Cycle ◽  
Vibrational Loading

Solder-Joint Reliability of BGA Packages in Automotive Applications

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000236-000257 ◽  
Author(s):  
Burton Carpenter ◽  
Andrew Mawer ◽  
Mollie Benson ◽  
John Arthur ◽  
Betty Young
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Performance Test ◽  
Stress Test ◽  
Circuit Board ◽  
Cycle Performance ◽  
Temperature Cycle ◽  
Automotive Applications ◽  
Bga Packages ◽  
Board Level

The solder-joint interconnect between an IC component and the PCB (printed circuit board) is a critical link in the system overall reliability. Trends in the automotive market are driving increased focus on solder-joint performance: (1) increasing electronics content for new functions, especially for ADAS (advanced driver-assistance systems), (2) use in safety critical systems and sub-systems, (3) decreasing interconnect pitches which reduces the stand-off and available solder, (4) increasing industry reliability expectations, and (5) package variations (ex. multi-die). In particular, BGA (Ball Grid Array) packages are used throughout the vehicle across various systems including engine control, braking, communication, infotainment, and radar to name only a few. Among these, under-the-hood applications often require high sustained operating temperatures and many heating/cooling cycles during the vehicle lifetime. The reliability of these interconnects is routinely assessed by cyclical thermal stress (temperate cycling) of components mounted to boards. While AEC (Automotive Electronics Council) offers no standards for solder-joint testing (for example, board level reliability criteria is not included in the AEC Q100 “Failure Mechanism Based Stress Test Qualification for Integrated Circuits”), IPC 9701A “Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments” can be followed. For automotive under-the-hood the specified cycle range is 40°C to 125°C (TC3). This paper summarizes the BL-TC (board level temperature cycle) performance of various BGA packages used in automotive applications. In all cases the test vehicle packages were daisy-chain versions of production devices, while maintaining critical features such as BGA footprint, physical dimensions, BOM (bill of materials), die size and thickness and substrate layer metal densities. All used Pb-free solders for both the BGA solder ball and the paste printed onto the PCB. The PCB designs were complementary to the packages establishing daisy-chain connections winding through the PCB, the solder-joint and package substrate. Each chain (net) was continuously monitored in situ during cycling. An event detector logged a failure when a net resistance exceeded 300 ohms. Wirebonded and flip chip packages were studied, ranging in size from 10mm to 29mm with BGA pitches including 0.65mm, 0.80mm and 1.00mm. In addition to these primary attributes, various other factors were found to alter the solder-joint lifetimes. For example, increasing BGA pad and solder sphere diameters improved solder-joint lifetime, but increasing the PCB pad diameter often did not. Among solder materials, eutectic SnAg typically showed longer lifetimes than other high Ag SAC alloys such as SAC305 and SAC405. The addition of Bi to the SAC alloy showed promise for further improvements. Other factors that were studied include die thickness, die size, and BGA pad finish. Both mechanical cross-section and dye penetrant analysis (dye-and-pry) were employed for failure analysis, enabling study of crack propagation and crack location within the solder-joint. Additionally, failure location (failing solder-joint) was identified for each as package corner, under the die edge, or package center in a predictable pattern depending on the package type. Examined in total, two opposing trends will force future innovation. Industry reliability requirements continue to drive expectations (i.e. cycles to failure) higher, while increasing package size and decreasing pitch will naturally reduce the solder-joint lifetimes. Solutions will be found in package design, package material and solder selections.

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