scholarly journals Thermo mechanical analysis of through-hole solder joint using strain partitioning method

2021 ◽  
Author(s):  
Imtiaz Ahmed Shaik
Keyword(s):  
Solder Joint ◽  
Creep Strain ◽  
Fatigue Failure ◽  
Thermal Loading ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Deformation Mode ◽  
Temperature Cycle ◽  
Plated Through Hole ◽  
Through Hole

Currently in the electronics industry there is a desire to increase component reliability. Fatigue failure in solder joints is an important design consideration for electronic packaging. In through-hole components, fatigue failure of leads has been observed to antecede fatigue failure of solder joints. The main objective of the study for a solder joint in a plated-through-hole bearing the pin during the temperature cycle was to ascertain the thermo mechanical behavior and the dominant deformation mode. The Digital Speckle Correlation (DSC) technique, which is a computer vision technique, was applied for the measurement of solder joint deforamtion for a prescribed outlined temperature and time. The dimensions for the area of the solder joint under study were 21 by 21 um, located at the centre of the hole. And computation of averaged shear strains at 6 data points for this area was done. R Darveaux's constitutive model was applied for the data analysis such as the solder joint yields stress with respect to the time and temperature. On achieving the stress solution, the measured total strains were partitioned into elastic, plastic and creep terms separately and hence the creep strain was evaluated. From the analysis, it was found that the dominant deformation mode was shear deformation due to mismatch of coefficient of thermal expansion between pin and copper plating material of through-hole under thermal loading. And the dominant deformation mechanism was creep strain while stress started to relax at the end of ramp up and continued throughout the test and creep strain rate decreased during high temperature dwell. In Addition, the elastic strain was dominating during the initial stage of thermal cycle but later it was neglibible when compared to creep strain.

scholarly journals Thermo mechanical analysis of through-hole solder joint using strain partitioning method

2021 ◽  
Author(s):  
Imtiaz Ahmed Shaik
Keyword(s):  
Solder Joint ◽  
Creep Strain ◽  
Fatigue Failure ◽  
Thermal Loading ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Deformation Mode ◽  
Temperature Cycle ◽  
Plated Through Hole ◽  
Through Hole

Currently in the electronics industry there is a desire to increase component reliability. Fatigue failure in solder joints is an important design consideration for electronic packaging. In through-hole components, fatigue failure of leads has been observed to antecede fatigue failure of solder joints. The main objective of the study for a solder joint in a plated-through-hole bearing the pin during the temperature cycle was to ascertain the thermo mechanical behavior and the dominant deformation mode. The Digital Speckle Correlation (DSC) technique, which is a computer vision technique, was applied for the measurement of solder joint deforamtion for a prescribed outlined temperature and time. The dimensions for the area of the solder joint under study were 21 by 21 um, located at the centre of the hole. And computation of averaged shear strains at 6 data points for this area was done. R Darveaux's constitutive model was applied for the data analysis such as the solder joint yields stress with respect to the time and temperature. On achieving the stress solution, the measured total strains were partitioned into elastic, plastic and creep terms separately and hence the creep strain was evaluated. From the analysis, it was found that the dominant deformation mode was shear deformation due to mismatch of coefficient of thermal expansion between pin and copper plating material of through-hole under thermal loading. And the dominant deformation mechanism was creep strain while stress started to relax at the end of ramp up and continued throughout the test and creep strain rate decreased during high temperature dwell. In Addition, the elastic strain was dominating during the initial stage of thermal cycle but later it was neglibible when compared to creep strain.

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

2020 ◽  
Author(s):  
Debabrata Mondal ◽  
Abdullah Fahim ◽  
KM Rafidh Hassan ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Grain Size ◽  
Solder Joint ◽  
Deformation Behavior ◽  
Thermal Loading ◽  
Solder Joints ◽  
Lead Free ◽  
External Loading ◽  
Lead Free Solder ◽  
Material Anisotropy ◽  
Free Solder

Abstract Lead-free solder joints are the most widely used interconnects in electronic packaging industries. Usually solder joints in most of the electronic devices are exposed to an environment where variation of temperature exists, which indicates cyclic thermal loading to be a very common type of external loading. Moreover, due to difference in the coefficient of thermal expansion (CTE) among dissimilar contact materials, shear stress develops in junctions under thermal loading, which significantly deteriorates the overall reliability. Hence, characterization of lead-free solder materials under thermal loading is essential to predict the performance and deformation behavior of joints in practical applications. A significant portion of the studies in this field are concerned with thermal loading of lead-free solder interconnects, each of which has a very small diameter, in sub-millimeter range. Although the solder balls have very small dimensions, most of the analyses considered them as a bulk material with homogeneous and isotropic properties. However, with the decrease of specimen dimensions, size effects and material directionality play a significant role in deformation mechanisms. Since a very few grains exist in a small specimen, individual grain properties play a vital role on overall material response. Therefore, modeling from the grain structure and orientation point of view could be an effective and more accurate way to predict solder joint deformation behavior under thermal loading. In this study, the effect of grain size and orientation of SAC305 is investigated for predicting anisotropic behavior of solder joints under thermal load. A simplified three-dimensional model of beach-ball configuration solder joint was generated and simulated using ABAQUS finite element (FE) software. Experimentally obtained directional properties such as elastic modulus and CTE were assigned to the computational geometry to create material anisotropy. The effects of material anisotropy were studied for varying grain size specimens, as well as for specimens with varying grain orientation.

RELIABILITY EVALUATION OF BGA SOLDER JOINTS DURING ACCELERATED LIFE TEST

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4553-4558
Author(s):  
OUK SUB LEE ◽  
NO HOON MYOUNG ◽  
DONG HYEOK KIM ◽  
MAN JAE HUR ◽  
SI WOON HWANG
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Accelerated Life Test ◽  
Lead Free ◽  
Lead Free Solder ◽  
Metal Fatigue ◽  
Mechanical Loads ◽  
Free Solder

The use of BGA (Ball Grid Array) interconnects utilizing the lead-free solder joint has grown rapidly because of its small volume and diversity of application. Thus, it requires the continuous quantification and refinement of lead-free solder joint reliability. The lead-free solder creep and cyclically applied mechanical loads cause metal fatigue on the lead-free solder joint which inevitably leads to an electrical discontinuity. In the field application, BGA solder joints experience mechanical loads during temperature changes caused by power up/down events as the result of the CTE (Coefficient of Thermal Expansion) mismatch between the substrate and the Si die. In this paper, extremely small resistance changes at joint area corresponding to through-cracks generated by thermal fatigue were measured. In this way, the failure was defined in terms of anomalous changes in electrical resistance of the joint. Furthermore the reliability of BGA solder joints in thermal cycling is evaluated by using the modified coffin-Manson criterion which may define and distinguish failure. Any change in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint was recorded and evaluated in order to quantitate reliability of solder joint.

Microstructural Evaluation and Quantitative Analysis in the Unleaded Solder Joint

1999 ◽  
Vol 5 (S2) ◽  
pp. 602-603
Author(s):  
J.G. Duh ◽  
Y.G. Lee ◽  
F.B. Wu
Keyword(s):  
Thermal Expansion ◽  
Solder Joint ◽  
Solder Joints ◽  
Environmental Concern ◽  
Coefficient Of Thermal Expansion ◽  
Practical Importance ◽  
Thermal Expansion Coefficients ◽  
Free Solder ◽  
Joint Quality ◽  
Microelectronic Package

Solder joints provide mechanical and electronic connections between solders and components for various levels in microelectronic package. However, due to different thermal expansion coefficients and elastic modulus of the associated materials, solder joints are susceptible to fatigue degration, microcracks and fracture. The solder joint reliability is, therefore, critical in the evalution of the joint quality. Recently, the employment of lead-free solder is attractive due to the environmental concern of the Pb-containing solder. Hence, the investigation on the unleaded solder joint is of practical importance in the field of microelectronic package.Intermetallic compounds (IMC), which form and grow between solders and metallizations, are considered to be a source of mechanical weakness for its brittleness and different coefficient of thermal expansion from the metallization or the solder.

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

1991 ◽  
Vol 113 (2) ◽  
pp. 138-148 ◽  
Author(s):  
J. Lau ◽  
R. Subrahmanyan ◽  
D. Rice ◽  
S. Erasmus ◽  
C. Li
Keyword(s):  
Thermal Expansion ◽  
Solder Joint ◽  
Normal Stress ◽  
Printed Circuit Board ◽  
Thermal Stresses ◽  
Circuit Board ◽  
Thermal Expansion Mismatch ◽  
Stress Strain ◽  
Plated Through Hole ◽  
Through Hole

Thermal stresses and strains in the solder joints and plated-through-hole (PTH) copper pads/barrels of a pin-grid array (PGA) assembly under thermal cycling conditions have been determined in the present study. There are two major systems of thermal stresses/strains acting at the solder joint and copper. One is the transverse shear and vertical normal stress/strain due to the local thermal expansion mismatch between the pin, solder, copper, and FR-4. The other is the horizontal normal stress/strain due to the global thermal expansion mismatch between the ceramic PGA and the FR-4 printed circuit board (PCB). The effects of the local thermal expansion mismatch on the reliability of solder joint and PTH copper have been determined using a 3-D orthotropic-elastoplastic finite element method. The effects of the global thermal expansion mismatch on the reliability of solder joint and PTH copper have been determined by fatigue experiments. Fatigue life of the solder joint and PTH copper was then estimated based on the calculated strains and the fatigue data on solders and coppers.

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

2003 ◽  
Vol 125 (4) ◽  
pp. 498-505 ◽  
Author(s):  
Bart Vandevelde ◽  
Eric Beyne ◽  
Kouchi (G.Q.) Zhang ◽  
Jo Caers ◽  
Dirk Vandepitte ◽  
...  
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Empirical Model ◽  
Prediction Models ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Solder Joint Reliability ◽  
Joint Geometry ◽  
Joint Reliability ◽  
Area Array

Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board (PCB) using an area array of solder joints varying from 5×4 up to 7×7. An empirical model for estimating the reliability of CSP solder joints is derived by correlating the simulated strains to thermal cycling results for 20 different sample configurations. This empirical model translates the inelastic strains calculated by nonlinear three-dimensional (3D) finite element simulations into a reliability estimation (N50% or N100 ppm). By comparing with the results of reliability tests, it can be concluded that this model is accurate and consistent for analyzing the effect of solder joint geometry. Afterwards, parameter sensitivity analysis was conducted by integrating a design of experiment (DOE) analysis with the reliable solder fatigue prediction models, following the method of simulation-based optimization. Several parameters are analyzed: the PCB parameters (elastic modulus, coefficient of thermal expansion, thickness), the chip dimensions (area array configuration), and the parameters defining the solder joint geometry (substrate and chip pad diameter, solder volume). The first study analyzes how the solder joint geometry influences the CSP reliability. A second study is a tolerance analysis for six parameters. These parameters can have a tolerance (=accuracy) of their nominal value, and it is shown that these small tolerances can have a significant influence on the solder joint reliability.

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

2007 ◽  
Vol 353-358 ◽  
pp. 2932-2935
Author(s):  
Yong Cheng Lin ◽  
Xu Chen ◽  
Xing Shen Liu ◽  
Guo Quan Lu
Keyword(s):  
Solder Joint ◽  
Fatigue Failure ◽  
Flip Chip ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Failure Behavior ◽  
Stress Strain ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Failure Life

The reliability of solder joints in flip chip assemblies with both compliant (flex) and rigid (PCB) substrates was studied by accelerated temperature cycling tests and finite element modeling (FEM). In-process electrical resistance measurements and nondestructive evaluations were conducted to monitor solder joint failure behavior, hence the fatigue failure life. Meanwhile, the predicted fatigue failure life of solder joints was obtained by Darveaux’s crack initiation and growth models. It can be concluded that the solder joints in flip chip on flex assembly (FCOF) have longer fatigue life than those in flip chip on rigid board assembly (FCOB); the maximum von Mises stress/strain and the maximum shear stress/strain of FCOB solder joints are much higher than those of FCOF solder joints; the thermal strain and stress in solder joints is reduced by flex buckling or bending and flex substrate could dissipate energy that otherwise would be absorbed by solder joint. Therefore, the substrate flexibility has a great effect on solder joint reliability and the reliability improvement was attributed to flex buckling or bending during temperature cycling.

A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis

1997 ◽  
Vol 119 (3) ◽  
pp. 177-182 ◽  
Author(s):  
S. Ling ◽  
A. Dasgupta
Keyword(s):  
Solder Joint ◽  
Potential Energy ◽  
Stress Analysis ◽  
Thermal Loading ◽  
Solder Joints ◽  
Stress And Strain ◽  
Thermomechanical Stress ◽  
Cyclic Thermal Loading ◽  
Surface Mount ◽  
Elastic Plastic

This is part II of a two-part paper presented by the authors for thermomechanical stress analysis of surface mount interconnects. A generalized multi-domain Rayleigh Ritz (MDRR) stress analysis technique has been developed to obtain the stress and strain fields in surface-mount solder joints under cyclic thermal loading conditions. The methodology was first proposed in Part I by the authors and results were presented for elastic-plastic loading (Ling et al., 1996). This paper extends the analysis for viscoplastic material properties. The solder joint domain is discretized selectively into colonies of nested sub-domains at locations where high stress concentrations are expected. Potential energy stored in the solder domain and in the attached lead and Printed Wiring Board (PWB) is calculated based on an assumed displacement field. Minimization of this potential energy provides a unique solution for the displacement field, consequently, stress and strain distribution. The MDRR technique was demonstrated to provide reasonable accuracy for elastic deformation (Ling and Dasgupta, 1995) and for time-independent elastic-plastic deformation (Ling and Dasgupta, 1996) for solder joints under cyclic thermal loading conditions. A piecewise linear incremental loading technique is used to solve the nonlinear elastic-plastic problem. The focus in the current paper is primarily on time-dependent viscoplastic deformation of the solder joints. Full field elastic, plastic, and viscoplastic analyses are performed, and the stress, strain hysteresis loops are obtained. Results are presented for a J-lead solder joint as an illustrative example.

Comparison of Reliability of Solder Joints by FORM and SORM

2007 ◽  
Vol 353-358 ◽  
pp. 2593-2596
Author(s):  
Ouk Sub Lee ◽  
Man Jae Hur ◽  
Yeon Chang Park ◽  
Dong Hyeok Kim
Keyword(s):  
Solder Joint ◽  
Boundary Conditions ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Probabilistic Approach ◽  
Thermal Displacement ◽  
Reliability Method ◽  
Cause Of Failure ◽  
Reliability Of Solder Joints ◽  
The Difference

The difference in the Coefficient of Thermal Expansion (CTE) between the chip and the substrate generate thermal displacement in the solder joint. It seems to be a main cause of failure in the solder joint when the chip and the substrate are heated repeatedly. The failure of the solder joints by thermal fatigue is known to be influenced by varying boundary conditions such as the difference in CTE, the height of solder, the Distance of the solder joint from the Neutral Point (DNP) and the temperature variation. In this paper, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic approach methods such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM).

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

2008 ◽  
Vol 130 (1) ◽  
Author(s):  
Andy Perkins ◽  
Suresh K. Sitaraman
Keyword(s):  
Numerical Modeling ◽  
Solder Joint ◽  
Fatigue Failure ◽  
Heat Sink ◽  
Solder Joints ◽  
Numerical Models ◽  
Sinusoidal Vibration ◽  
Solder Joint Fatigue ◽  
Damage Mapping ◽  
Frequency Sweeps

Solder joint fatigue failure under vibration loading continues to be a concern in microelectronic industry. Existing literature has not adequately addressed high-cycle fatigue failure of high-lead solder joints, especially under a broad spectrum of vibration frequencies. Also, damage mapping across solder joints in an area-array package has not been effectively studied using numerical models and experimental cross sectioning. This paper aims to develop an experimental and modeling approach that can accurately determine the solder joint behavior of electronic components under vibration conditions. In particular, this paper discusses the out-of-plane sinusoidal vibration experiments at 1G, numerical modeling, and fatigue life prediction for a 42.5×42.5×4mm3 1089 input∕output ceramic column grid array (CCGA) package on a 133×56×2.8mm3 FR4 board. Detailed investigation and characterization involving dye-and-pry analysis, microstructural examination, and numerical modeling enabled the development of a high-cycle stress-based equation for lead-containing CCGA under sinusoidal loading. The developed approach has been applied to a number of cases including a CCGA package with a heat sink as well as a CCGA package subjected to frequency sweeps. It is seen that the predictions from the developed model agree well with experimental data and that the developed model can map the evolution of solder damage across all solder joints and can also provide important design recommendations in terms of solder joint location as well as heat sink attachment.

Sign in / Sign up

Export Citation Format

Share Document