Fabrication of Fluxgate Sensor Heads by Milling with a Circuit Board Plotter and Influence of Core Annealing Conditions on Sensor Performance

2016 ◽  
Vol 30 (11) ◽  
pp. 3257-3261 ◽  
Author(s):  
Hava Can ◽  
Peter Svec ◽  
Jan Bydzovsky ◽  
Peter Svec ◽  
Bekir Aktaş ◽  
...  
Keyword(s):  
Circuit Board ◽  
Sensor Performance ◽  
Annealing Conditions ◽  
Fluxgate Sensor

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies

2003 ◽  
Author(s):  
Chih-Tang Peng ◽  
Chang-Chun Lee ◽  
Kuo-Ning Chiang
Keyword(s):  
Pressure Sensor ◽  
Flip Chip ◽  
Circuit Board ◽  
Packaging Design ◽  
System Sensitivity ◽  
Sensor Performance ◽  
Piezoresistive Pressure Sensor ◽  
Flip Chip Packaging ◽  
Novel Design ◽  
Packaging Effect

In this study, a silicon base piezoresistive pressure sensor using flip chip and flex circuit packaging technologies is studied, designed and analyzed. A novel designed pressure sensor using flip chip packaging with spacer is employed to substitute the conventional chip on board or SOP packaging technology. Subsequently, a finite element method (FEM) is adopted for the designing of the sensor performance. Thermal and pressure loading is applied on the sensor to study the system sensitivity as well as the thermal and packaging effect. The performance of novel packaging pressure sensor is compared with that of the conventional one to demonstrate the feasibility of this novel design. The findings depict that this novel packaging design can not only maintain well sensor sensitivity but also reduce the thermal and packaging effect of the pressure sensor.

scholarly journals Commercially Fabricated Printed Circuit Board Sensing Electrodes for Biomarker Electrochemical Detection: The Importance of Electrode Surface Characteristics in Sensor Performance

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 741 ◽  
Author(s):  
Gorachand Dutta ◽  
Anna Regoutz ◽  
Despina Moschou
Keyword(s):  
Electrode Surface ◽  
Linear Response ◽  
Printed Circuit Board ◽  
Limit Of Detection ◽  
Surface Characteristics ◽  
Glucose Biosensor ◽  
Circuit Board ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Immobilized Glucose Oxidase

Here we report the first PCB-implemented electrochemical glucose biosensor usingcovalently immobilized glucose oxidase (GOx) on the commercially fabricated PCB electrodesurface, taking particular care on the electrode surface characteristics and their effect on sensorperformance. Based on the results, this assay exhibits a highly linear response from 500 μM to 20mM (R = 0.9961) and a lower limit of detection of 500 μM.

A Micro Fluxgate Magnetic Sensor Using New Printed Circuit Board Technology

2006 ◽  
Vol 326-328 ◽  
pp. 1487-1490 ◽  
Author(s):  
Won Youl Choi ◽  
Jun Sik Hwang ◽  
Sang On Choi
Keyword(s):  
Low Power ◽  
Printed Circuit Board ◽  
Sine Wave ◽  
Magnetic Core ◽  
Magnetic Sensor ◽  
Circuit Board ◽  
Sensing Element ◽  
Printed Circuit ◽  
Fluxgate Sensor ◽  
Ring Shape

We have developed a micro fluxgate magnetic sensor using new printed circuit board (PCB) technology. The fluxgate sensor consisted of five PCB stack layers including one layer of magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core was made of micro patterned amorphous magnetic ribbon with an extremely high DC permeability of ~100,000, and the core had a rectangular ring shape. Four outer layers as an excitation and pickup coils had a planar solenoid structure. The amorphous magnetic core was easily saturated due to the high permeability, low coercive field, and closed magnetic path for the excitation field. The chip size of the fabricated sensing element was 7.3 × 5.7 mm2. Excellent linear response over the range of –100 μT to +100 μT was obtained with sensitivity of 780 V/T at excitation sine wave of 3 Vp-p and 360 kHz. A very low power consumption of ~8 mW was measured. This low power, small size, and high sensitive fluxgate sensor to measure a low magnetic field is very useful for various applications.

scholarly journals Printed circuit board integrated fluxgate sensor

2000 ◽  
Vol 81 (1-3) ◽  
pp. 200-203 ◽  
Author(s):  
O. Dezuari ◽  
E. Belloy ◽  
S.E. Gilbert ◽  
M.A.M. Gijs
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Fluxgate Sensor

scholarly journals Low-Power Printed Circuit Board Fluxgate Sensor

2007 ◽  
Vol 7 (2) ◽  
pp. 179-183 ◽  
Author(s):  
Jan Kubik ◽  
Luk Pavel ◽  
Pavel Ripka ◽  
Petr Kaspar
Keyword(s):  
Low Power ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Fluxgate Sensor

Design and experimental study of a mutual inductance displacement sensor for active magnetic bearings

2020 ◽  
Vol 62 (12) ◽  
pp. 702-709
Author(s):  
Xiang Guan ◽  
Jin Shang ◽  
Yincai Zou ◽  
Xing Bian ◽  
Junyi Chen ◽  
...  
Keyword(s):  
Basic Structure ◽  
Mutual Inductance ◽  
Circuit Board ◽  
Displacement Sensor ◽  
Design Parameters ◽  
Active Magnetic Bearings ◽  
Circuit Implementation ◽  
Sensor Performance ◽  
Design Experience ◽  
Typical Method

A type of mutual inductance displacement sensor based on probe circuit board (PCB) technology is discussed in this paper. Firstly, the basic structure and principle of the sensor are introduced and an objective function of calculation is proposed for the optimisation of sensitivity. Then, the influence of design parameters on sensor performance is explored and some design experience is summarised. At the same time, a typical method of circuit implementation for the sensor is introduced and the static experiments are carried out with this method. Compared with the sensors reported in the literature, it is concluded that the index of the experimental sensor has reached a good level.

A PCB BASED CAPACITIVE SHEAR FORCE SENSOR DEVELOPED FOR ROBOTIC GRIPPER APPLICATION

2013 ◽  
Vol 24 ◽  
pp. 1360027
Author(s):  
JIAN-LIN HUANG ◽  
SHENG-JUI CHEN ◽  
GWO-JEN WU ◽  
CHUNG-LIN WU ◽  
SHEAU-SHI PAN
Keyword(s):  
Shear Force ◽  
Degrees Of Freedom ◽  
Printed Circuit Board ◽  
High Sensitivity ◽  
Force Sensor ◽  
Circuit Board ◽  
Optical Interferometer ◽  
Robotic Arms ◽  
Printed Circuit ◽  
Sensor Performance

The shear force sensor is one of the key elements in future robotic industry, it is of great importance in applications where robotic arms are required to delicately interact with objects to be handled. In this paper, we present the development of a capacitive shear force capable of sensing shear forces in two degrees of freedom. The fabrication of the sensor is based on the printed circuit board (PCB) fabrication process, a well-known and mature technology. We adopt the capacitance sensing scheme for its high sensitivity and easy implementation. For sensor characterization, we used a force gauge and an optical interferometer to measure sensor's parameters including its sensing coefficient and resolution. The dimension of our prototype shear force sensor including the metal housing is 26 mm×13 mm×58 mm suitable for the integration with commercial robotic grippers. For sensor performance, we achieved a shear force sensing coefficient of 23.3 fF/N and a resolution of smaller than 5mN.

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

2014 ◽  
Vol 11 (3) ◽  
pp. 122-127 ◽  
Author(s):  
Robert N. Dean ◽  
Michael C. Hamilton ◽  
Michael E. Baginski
Keyword(s):  
Dielectric Constant ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Radius Of Curvature ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Fringing Field ◽  
Flexible Printed Circuit ◽  
Cu Foil

Capacitive fringing field sensors are often used in applications where moisture is detected, since the dielectric constant of liquid water is approximately 80 times greater than the dielectric constant of air. Most of these sensors, however, are realized using rigid substrates. Some applications would benefit from using a flexible capacitive fringing field sensor that could be conformally mounted on a nonplanar surface. Flexible printed circuit board technology is a mature commercially available process for manufacturing flexible electronics. This same technology can also be used to realize flexible fringing field moisture sensors where the patterned Cu foil is used for the electrodes and the soldermask coating electrically insulates the electrodes from being electrically shorted by moisture in the detection environment. Sensors were designed and characterized through flat and bending tests in air and in water. The tests demonstrated that bending a sensor over a radius of curvature as small as 13.7 mm had no measurable impact on sensor performance in air or in water. The sensors achieved a 3:1 increase in capacitance when immersed in water compared with in air.

Sign in / Sign up

Export Citation Format

Share Document