scholarly journals Commercially Fabricated Printed Circuit Board Sensing Electrodes for Biomarker Electrochemical Detection: The Importance of Electrode Surface Characteristics in Sensor Performance

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 741 ◽  
Author(s):  
Gorachand Dutta ◽  
Anna Regoutz ◽  
Despina Moschou
Keyword(s):  
Electrode Surface ◽  
Linear Response ◽  
Printed Circuit Board ◽  
Limit Of Detection ◽  
Surface Characteristics ◽  
Glucose Biosensor ◽  
Circuit Board ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Immobilized Glucose Oxidase

Here we report the first PCB-implemented electrochemical glucose biosensor usingcovalently immobilized glucose oxidase (GOx) on the commercially fabricated PCB electrodesurface, taking particular care on the electrode surface characteristics and their effect on sensorperformance. Based on the results, this assay exhibits a highly linear response from 500 μM to 20mM (R = 0.9961) and a lower limit of detection of 500 μM.

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

scholarly journals A Portable RT-LAMP/CRISPR Machine for Rapid COVID-19 Screening

Biosensors ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 369
Author(s):  
Meysam Rezaei ◽  
Sajad Razavi Bazaz ◽  
Dorsa Morshedi Rad ◽  
Olga Shimoni ◽  
Dayong Jin ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Limit Of Detection ◽  
Circuit Board ◽  
Proportional Integral Derivative ◽  
Early Screening ◽  
Heater Element ◽  
Printed Circuit ◽  
Preventative Measures ◽  
Fast Screening ◽  
Portable System

The COVID-19 pandemic has changed people’s lives and has brought society to a sudden standstill, with lockdowns and social distancing as the preferred preventative measures. To lift these measurements and reduce society’s burden, developing an easy-to-use, rapid, and portable system to detect SARS-CoV-2 is mandatory. To this end, we developed a portable and semi-automated device for SARS-CoV-2 detection based on reverse transcription loop-mediated isothermal amplification followed by a CRISPR/Cas12a reaction. The device contains a heater element mounted on a printed circuit board, a cooler fan, a proportional integral derivative controller to control the temperature, and designated areas for 0.2 mL Eppendorf® PCR tubes. Our system has a limit of detection of 35 copies of the virus per microliter, which is significant and has the capability of being used in crisis centers, mobile laboratories, remote locations, or airports to diagnose individuals infected with SARS-CoV-2. We believe the current methodology that we have implemented in this article is beneficial for the early screening of infectious diseases, in which fast screening with high accuracy is necessary.

scholarly journals Label-Free Electrochemical Detection of S. mutans Exploiting Commercially Fabricated Printed Circuit Board Sensing Electrodes

Micromachines ◽  
2019 ◽  
Vol 10 (9) ◽  
pp. 575 ◽  
Author(s):  
Gorachand Dutta ◽  
Abdoulie A. Jallow ◽  
Debjani Paul ◽  
Despina Moschou
Keyword(s):  
Electrochemical Detection ◽  
Printed Circuit Board ◽  
Electrochemical Impedance ◽  
Limit Of Detection ◽  
Charge Transfer Resistance ◽  
Circuit Board ◽  
Label Free ◽  
Electrochemical Impedance Spectra ◽  
Transfer Resistance ◽  
Printed Circuit

This paper reports for the first time printed-circuit-board (PCB)-based label-free electrochemical detection of bacteria. The demonstrated immunosensor was implemented on a PCB sensing platform which was designed and fabricated in a standard PCB manufacturing facility. Bacteria were directly captured on the PCB sensing surface using a specific, pre-immobilized antibody. Electrochemical impedance spectra (EIS) were recorded and used to extract the charge transfer resistance (Rct) value for the different bacteria concentrations under investigation. As a proof-of-concept, Streptococcus mutans (S. mutans) bacteria were quantified in a phosphate buffered saline (PBS) buffer, achieving a limit of detection of 103 CFU/mL. Therefore, the proposed biosensor is an attractive candidate for the development of a simple and robust point-of-care diagnostic platform for bacteria identification, exhibiting good sensitivity, high selectivity, and excellent reproducibility.

A PCB BASED CAPACITIVE SHEAR FORCE SENSOR DEVELOPED FOR ROBOTIC GRIPPER APPLICATION

2013 ◽  
Vol 24 ◽  
pp. 1360027
Author(s):  
JIAN-LIN HUANG ◽  
SHENG-JUI CHEN ◽  
GWO-JEN WU ◽  
CHUNG-LIN WU ◽  
SHEAU-SHI PAN
Keyword(s):  
Shear Force ◽  
Degrees Of Freedom ◽  
Printed Circuit Board ◽  
High Sensitivity ◽  
Force Sensor ◽  
Circuit Board ◽  
Optical Interferometer ◽  
Robotic Arms ◽  
Printed Circuit ◽  
Sensor Performance

The shear force sensor is one of the key elements in future robotic industry, it is of great importance in applications where robotic arms are required to delicately interact with objects to be handled. In this paper, we present the development of a capacitive shear force capable of sensing shear forces in two degrees of freedom. The fabrication of the sensor is based on the printed circuit board (PCB) fabrication process, a well-known and mature technology. We adopt the capacitance sensing scheme for its high sensitivity and easy implementation. For sensor characterization, we used a force gauge and an optical interferometer to measure sensor's parameters including its sensing coefficient and resolution. The dimension of our prototype shear force sensor including the metal housing is 26 mm×13 mm×58 mm suitable for the integration with commercial robotic grippers. For sensor performance, we achieved a shear force sensing coefficient of 23.3 fF/N and a resolution of smaller than 5mN.

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

2014 ◽  
Vol 11 (3) ◽  
pp. 122-127 ◽  
Author(s):  
Robert N. Dean ◽  
Michael C. Hamilton ◽  
Michael E. Baginski
Keyword(s):  
Dielectric Constant ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Radius Of Curvature ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Fringing Field ◽  
Flexible Printed Circuit ◽  
Cu Foil

Capacitive fringing field sensors are often used in applications where moisture is detected, since the dielectric constant of liquid water is approximately 80 times greater than the dielectric constant of air. Most of these sensors, however, are realized using rigid substrates. Some applications would benefit from using a flexible capacitive fringing field sensor that could be conformally mounted on a nonplanar surface. Flexible printed circuit board technology is a mature commercially available process for manufacturing flexible electronics. This same technology can also be used to realize flexible fringing field moisture sensors where the patterned Cu foil is used for the electrodes and the soldermask coating electrically insulates the electrodes from being electrically shorted by moisture in the detection environment. Sensors were designed and characterized through flat and bending tests in air and in water. The tests demonstrated that bending a sensor over a radius of curvature as small as 13.7 mm had no measurable impact on sensor performance in air or in water. The sensors achieved a 3:1 increase in capacitance when immersed in water compared with in air.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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