Mold Fabrication for 3D Dual Damascene Imprinting

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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Dual Damascene Process for FatWires in Copper/FSG Technology

MRS Proceedings ◽

10.1557/proc-766-e5.5 ◽

2003 ◽

Vol 766 ◽

Cited By ~ 1

Author(s):

J. Gambino ◽

T. Stamper ◽

H. Trombley ◽

S. Luce ◽

F. Allen ◽

...

Keyword(s):

Line Width ◽

Lower Cost ◽

Process Window ◽

Cmos Process ◽

Dual Damascene ◽

Damascene Process ◽

Interconnect Technology

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.

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Application of lasers in mold fabrication

10.2351/1.5059262 ◽

1999 ◽

Author(s):

Larry R. Dosser ◽

Carl J. Kershner ◽

David J. Haas

Keyword(s):

Mold Fabrication

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HITACHI METALS SLD-MAGIC

Alloy Digest ◽

10.31399/asm.ad.ts802 ◽

2020 ◽

Vol 69 (10) ◽

Keyword(s):

High Temperature ◽

Physical Properties ◽

Tool Steel ◽

High Performance ◽

Cold Work ◽

Heat Treating ◽

Temperature Performance ◽

Mold Fabrication ◽

Cold Work Tool Steel

Abstract Hitachi Metals SLD-Magic is a high-performance alloy cold-work tool steel that is characterized by improved mold lifespan and easy mold fabrication. This datasheet provides information on composition, physical properties, hardness, elasticity as well as fatigue. It also includes information on low and high temperature performance as well as heat treating, machining, and joining. Filing Code: TS-802. Producer or source: Hitachi Metals Ltd.

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