Dynamic analysis of multilayer ceramic capacitor for vibration reduction of printed circuit board

2019 ◽  
Vol 33 (4) ◽  
pp. 1595-1601
Author(s):  
Dongjoon Kim ◽  
Wheejae Kim ◽  
Wan-Chin Kim
Keyword(s):  
Dynamic Analysis ◽  
Printed Circuit Board ◽  
Vibration Reduction ◽  
Circuit Board ◽  
Printed Circuit ◽  
Multilayer Ceramic Capacitor ◽  
Ceramic Capacitor ◽  
Multilayer Ceramic

Analysis of Influence of Multilayer Ceramic Capacitor Mounting Method on Circuit Board Vibration

2021 ◽  
pp. 137-140
Author(s):  
Dongjoon Kim ◽  
Wheejae Kim ◽  
Joo Young Yoon ◽  
Eunho Lee ◽  
No-Cheol Park
Keyword(s):  
Circuit Board ◽  
Multilayer Ceramic Capacitor ◽  
Ceramic Capacitor ◽  
Multilayer Ceramic

406. An Ergonomic Hazards Survey of Printed Circuit Board Factories

1999 ◽  
Author(s):  
C. Lu ◽  
S. Wang ◽  
C. Wei ◽  
S. In
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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