Cooling of high-performance electronic equipment using graphite foam heat sinks

2021 ◽  
pp. 116844
Author(s):  
Ahmed Alhusseny ◽  
Qahtan Al-Aabidy ◽  
Nabeel Al-Zurfi ◽  
Adel Nasser ◽  
Mohanad Aljanabi
Keyword(s):  
High Performance ◽  
Electronic Equipment ◽  
Heat Sinks ◽  
Graphite Foam

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Design and Realization of High Performance Ceramic Heat Sinks

1995 ◽  
pp. 89-100
Author(s):  
E. Gambarte ◽  
M. Töpfer ◽  
A. Paredes ◽  
M. Reill ◽  
M. Weickhmann
Keyword(s):  
High Performance ◽  
Heat Sinks

Characterization of Exotic Material Heat Sinks for Laser Diode Arrays

2005 ◽  
Vol 883 ◽  
Author(s):  
Edward.F. Stephens
Keyword(s):  
Laser Diode ◽  
High Performance ◽  
Critical Role ◽  
Cost Effective ◽  
Heat Sinks ◽  
High Peak Power ◽  
Low Duty Cycle ◽  
Trade Offs ◽  
Duty Cycles ◽  
Laser Diode Arrays

AbstractLow duty cycle, high peak power, conductively cooled laser diode arrays have been manufactured for several years by a number of different vendors. Typically these packages have been limited to a few percent duty cycles due to thermal problems that develop in tight bar pitch arrays at higher duty cycles. Traditionally these packages are made from some combination of copper and BeO or Tungsten/copper and BeO. Trade-offs between thermal conductivity and CTE matching are always made when manufacturing these devices. In addition, the manufacturability of the heat sinks plays a critical role in creating a cost effective, high performance solution. In this discussion we examine several different exotic materials that have been manufactured and tested as heat sinks for laser diode arrays.

scholarly journals High-Performance Emerging Solid-State Memory Technologies

MRS Bulletin ◽  
2004 ◽  
Vol 29 (11) ◽  
pp. 805-813 ◽  
Author(s):  
Herb Goronkin ◽  
Yang Yang
Keyword(s):  
Solid State ◽  
Research And Development ◽  
High Performance ◽  
New Technologies ◽  
State Of The Art ◽  
Electronic Equipment ◽  
Private Industry ◽  
Development Stages ◽  
The World ◽  
And Storage

AbstractThis article introduces the November 2004 issue of MRS Bulletin on the state of the art in solid-state memory and storage technologies.The memory business drives hundreds of billions of dollars in sales of electronic equipment per year. The incentive for continuing on the historical track outlined by Moore's law is huge, and this challenge is driving considerable investment from governments around the world as well as in private industry and universities. The problem is this: recognizing that current approaches to semiconductor-based memory are limited, what new technologies can be introduced to continue or even accelerate the pace of complexity? The articles in this issue highlight several commercially available memories, as well as memory technologies that are still in the research and development stages. What will become apparent to the reader is the huge diversity of approaches to this problem.

High performance liquid cooled aluminium nitride heat sinks

1999 ◽  
Vol 16 (1) ◽  
pp. 21-26 ◽  
Author(s):  
R. Hahn ◽  
V. Glaw ◽  
A. Ginolas ◽  
M. Töpfer ◽  
K. Wittke ◽  
...  
Keyword(s):  
High Performance ◽  
Aluminium Nitride ◽  
Heat Sinks

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

2003 ◽  
Author(s):  
Gary L. Solbrekken ◽  
Kazuaki Yazawa ◽  
Avram Bar-Cohen
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Electronic Equipment ◽  
Interfacial Thermal Resistance ◽  
Maximum Heat ◽  
Power Efficient ◽  
System Sensitivity ◽  
Heat Pumping

It is well established that the power dissipation for electronic components is increasing. At the same time, high performance portable equipment with volume, weight, and power limitations are gaining widespread acceptance in the marketplace. The combination of the above conditions requires thermal solutions that are high performance and yet small, light, and power efficient. This paper explores the possibility of using thermoelectric (TE) refrigeration as an integrated solution for portable electronic equipment accounting for heat sink and interface material thermal resistances. The current study shows that TE refrigeration can indeed have a benefit over using just a heat sink. Performance maps illustrating where TE refrigeration offers an advantage over an air-cooled heat sink are created for a parametric range of CPU heat flows, heat sink thermal resistances, and TE material properties. During the course of the study, it was found that setting the TE operating current based on minimizing the CPU temperature (Tj), as opposed to maximizing the amount of heat pumping, significantly reduces Tj. For the baseline case studied, a reduction of 20–30°C was demonstrated over a range of CPU heat dissipation. The parametric studies also illustrate that management of the heat sink thermal resistance appears to be more critical than the CPU/TE interfacial thermal resistance. However, setting the TE current based on a minimum Tj as opposed to maximum heat pumping reduces the system sensitivity to the heat sink thermal resistance.

Thermodynamic Analysis of Heat and Fluid Flow in a Microchannel With Internal Fins

2009 ◽  
Author(s):  
Ramesh Narayanaswamy ◽  
Tilak T. Chandratilleke ◽  
Andrew J. L. Foong
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Thermodynamic Analysis ◽  
Entropy Generation ◽  
High Performance ◽  
Numerical Study ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Heat Transfer Fluid ◽  
Internal Fins

Efficient cooling techniques are one of the critical design requirements for maintaining reliable operational characteristics of modern, miniaturised high performance electronic components. Microchannel heat sinks form an integral part of most devices used for thermal management in electronic equipment cooling. A microchannel of square cross section, having internal longitudinal fins is considered for analysis. A numerical study is carried out to investigate the fluid flow and heat transfer characteristics. Three-dimensional numerical simulations are performed on the microchannel in the presence of a hydrodynamically developed, thermally developing laminar flow. Further on, a thermodynamic analysis is carried out, for a range of fin heights and thermophysical parameters, in order to obtain the irreversibilities due to heat transfer and fluid flow within the microchannel. An optimum fin height, corresponding to the thermodynamically optimum conditions that minimize the entropy generation rates has been obtained. The effect of the presence of internal fins on the entropy generated due to heat transfer, fluid friction, and the total entropy generation is also provided.

scholarly journals Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

2021 ◽  
Vol 2116 (1) ◽  
pp. 012052
Author(s):  
David Olugbenga Ariyo ◽  
Tunde Bello-Ochende
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
Flow Boiling ◽  
High Heat ◽  
Geometric Optimization ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

Sign in / Sign up

Export Citation Format

Share Document